• 한국재료학회지
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• 제8권11호
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• pp.1048-1054
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• 1998

Pt 상부 전극 증착온도가 Pb(Zr,Ti)$O_3$(PZT) 박막의 전기적 특성에 미치는 영향에 대하여 연구하였다. Pt 상부 전극을 $200^{\circ}C$이상의 고온에서 증착하는 경우, Pt 전극의 하부에 위치한 PZT 박막은 강유전 특성이 심하게 저하되었으나, Pt 전극이 증착되지 않았던 부분은 강유전 특성이 저하되지 않았다. 이와 같은 현상이 발생된 것은 진공 chamber 내의 수증기가 Pt 상부전극의 촉매 작용에 의해 수소 원자로 분해되고, 이 분해된 수소 원자가 고온에서 Pt 하부의 PZT 박막 내로 확산해 들어가 PZT박막에 산소 공공을 만들어 내기 때문이다. Pt의 촉매 작용이 없이는 수증기의 수소 원자로의 분해가 어려우므로 Pt 전극이 덮여져 있지 않는 PZT 박막은 강유전 특성이 저하되지 않는다. 이러한 강유전 특성의 저하는 산소 분위기의 RTA(rapid thermal annealing)처리에 의해 회복이 되었다. 한편, 누설전류 특성은 Pt 상부 전극의 증착온도가 증가함에 따라 향상되는 특성을 보였다.

• 한국세라믹학회지
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• 제30권4호
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• pp.332-338
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• 1993

TiN/Ti is the best buffer layer between PZT thin film and si substrate among the Ti, TiN, ZrN, TiN/Ti, ZrN/Ti. The amorphous PZT films deposited on TiN/Ti buffer layer directly transform into perovskite phase when rapid thermal annealed for 30sec above 55$0^{\circ}C$. As Rapid Thermal Annealing(RTA) temperature increased, the remanent polarization(Pr) and dielectric constant($\varepsilon$r) increased and then showed Pr=21 $\varepsilon$r=593 when rapid thermal annealed 80$0^{\circ}C$ for 30sec. On the contrary the leakage current increased with increasing RTA temperature due to the formation of void made by Pb evaporationand grain cohesion.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1994년도 추계학술대회 논문집
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• pp.24-27
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• 1994

Variations with structural and electrical properties of Yttrium added PZT thin films were observed and measured respectively. Area of rosette was increased by Yttrium added and shapes of hysteresis curves were changed to slim type. $Y^{3+}$ ion substituted $Pb^{2+}$ ion and played the role of doner. Because the creation of space charges was restricted by Yttrium, degradation of remanent polarizations by cumutation of polarization reversals of PZT was protected. But coercive field was increased because of vacancies generated Yttrium added.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 하계학술대회 논문집 Vol.4 No.2
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• pp.641-643
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• 2003

The ferroelectric properties of PZT(53/47) thin film was investigated by methoxy enthanol solution based on sol-gel method. The thickness of each layer by spincoating 0.25M sol at one time was $0.1{\mu}m$ and crack-free film was formed. $LaNiO_3/Si(100)$ electrode and $Pt/Ti/SiO_2/Si(100)$ electrode was coated by PZT sol at several times. PZT orientation was confirmed as a method of XRD and coercive field(Ec) as well as remnant polarization(Pr) was investigated from hysterisis curve. As a result of XRD analysis, we can know that the orientation of on PZT/LNO/Si(100) is better than on $Pt/Ti/SiO_2/Si(100)$. The remnant polarization(Pr) in LNO electrode was $87.5{\mu}C/cm^2$ and $39.8{\mu}C/cm^2$ in Pt. From this figures, it is investigated that the Pr in LNO electrode was better than in Pt.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 춘계학술대회 논문집 유기절연재료 전자세라믹 방전플라즈마 일렉트렛트 및 응용기술
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• pp.47-52
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• 2002

A processing method is developed for preparing sol-gel derived $Pb(Zr_{1-x}Ti_x)O_3$ (x=0.5) thin films on Pt-Ir($Pt_{80}Ir_{20}$)-alloy substrates. The as-deposited layer was dried on a plate in air at $70^{\circ}C$. And then it was baked at $1500^{\circ}C$, annealed at $450^{\circ}C$ and finally annealed for crystallization at various temperatures ranging from $580^{\circ}C$ to $700^{\circ}C$ for 1hour in a tube furnace. The thickness of the annealed film with three layers was $0.3{\mu}m$. Crystalline properties and surface morphology were examined using X-ray diffractometer (XRD). Electrical properties of the films such as dielectric constant, C-V, leakage current density were measured under different annealing temperature. The PZT thin film which was crystallized at $600^{\circ}C$ for 60minutes showed the best structural and electrical dielectric constant is 577. C-V measurement show that $700^{\circ}C$ sample has window memory volt of 2.5V and good capacitance for bias volts. Leakage current density of every sample show $10^{-8}A/cm^2$ r below and breakdown voltage(Vb) is that 25volts.

• Transactions on Electrical and Electronic Materials
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• 제11권4호
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• pp.182-185
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• 2010

$Pb_{0.99}[(Zr_{0.6}Sn_{0.4})_{0.9}Ti_{0.1}]_{0.98}Nb_{0.02}O_3$ (PNZST) thin films were deposited by radio frequency magnetron sputtering on a $(La_{0.5}Sr_{0.5})CoO_3$ (LSCO)/Pt/Ti/$SiO_2$/Si substrate using a PNZST target with an excess PbO of 10 mole%. The thin films deposited at the substrate temperature of $500^{\circ}C$ crystallized to a perovskite phase after rapid thermal annealing (RTA). The thin films, which annealed at $650^{\circ}C$ for 10 seconds in air, exhibited good crystal structures and ferroelectric properties. The remanent polarization and coercive field of the fabricated PNZST capacitor were approximately $20uC/cm^2$ and 50 kV/cm, respectively. The reduction of the polarization after $2.2\;{\times}\;10^9$ switching cycles was less than 10%.

• 한국재료학회지
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• 제9권12호
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• pp.1181-1187
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• 1999

diol을 기반으로 하는 Sol-Gel 방법으로 PZT (53/47) 1M sol 용액을 만들어 회전 코팅법으로 Pt/Ti/$SiO_2$/Si 기판위에 코팅하였고 한번 코팅으로 최대 0.9${\mu}m $의 PZT막을 얻었다. PZT는 비강유전성 pyrochlore상을 거쳐 강유전성 perovskite상으로 전이하며 따라서 PZT perovskite seed가 상전이에 미치는 영향을 규명하고자 하였다. 0.2${\mu}m $ 이하의 크기를 갖는 1wt% PZT분말을 propanol용액에 분산시켜 PZT sol 용액에 도입하여 seeded PZT 막을 제조하였다. Seeded PZT막을 열처리한 결과 perovskite상의 생성이 촉진되어 상전이 온도가 50$^{\circ}C$정도 낮아졌다.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제53권3호
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• pp.128-132
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• 2004

The perovskite ferroelectric materials of the PZT, SBT and BST series will attract much attention for application to ULSI devices. Among these materials, the BST ($Ba_0.6$$Sr_0.4$/$TiO_3$) is widely considered the most promising for use as an insulator in the capacitors of DRAMS beyond 1 Gbit and high density FRAMS. Especially, BST thin films have a good thermal-chemical stability, insulating effect and variety of Phases. However, BST thin films have problems of the aging effect and mismatch between the BST thin film and electrode. Also, due to the high defect density and surface roughness at grain boundarys and in the grains, which degrades the device performances. In order to overcome these weakness, we first applied the chemical mechanical polishing (CMP) process to the polishing of ferroelectric film in order to obtain a good planarity of electrode/ferroelectric film interface. BST ferroelectric film was fabricated by the sol-gel method. And then, we compared the surface characteristics before and after CMP process of BST films. We expect that our results will be useful promise of global planarization for FRAM application in the near future.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2002년도 춘계 학술발표강연 및 논문개요집
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• pp.36-36
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• 2002

• 한국재료학회:학술대회논문집
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• 한국재료학회 2001년도 춘계학술발표강연 및 논문개요집
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• pp.25-25
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• 2001