• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.05c
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• pp.58-62
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• 2002

Pb($Zr_{0.52}Ti_{0.48}$)$O_3$ (PZT) thin films deposited on the Pt/Ti and Ru/$RuO_2$ bottom electrode by rf magnetron sputtering methode. Ru/$RuO_2$ bottom electrode deposited on the p-type wafer as Ru thickness by in-situ process. Our results show that all PZT films indicated perovskite polycrystalline structure with perferred orientation (110) and no pyrochlore phase is observed. A well-fabricated $RuO_2$/PZT/Ru(100nm)/$RUO_2$ capacitor showed a leakage current density in the order of $2.13{\times}10^{-7}A/cm^2$ as 100 kV/cm, a remanent polarization of 7.20 ${\mu}C/cm^2$, and a coercive field of 58.37 kV/cm. The results show that the new Ru/$RuO_2$ bottom electrodes are expected to reduce the degradation ferroelectric fatigue and excellent ferroelectric properties.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.08a
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• pp.216.1-216.1
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• 2013

PZT 박막은 강유전 특성과 압전소자 특성을 나타내는 물질로 DRAM (dynamic random acess memory)과 FRAM (ferroelectric RAM) 등의 기억소자용 capacitor와 MEMS (micro electro mechanical system) 소자의 압전 물질로 사용하기 위한 연구가 진행중에 있다. 하지만 이러한 연구에서는 PZT 박막의 전기적 특성 향상을 주목적으로 연구가 진행되어 왔다. 특히, 박막 공정중 발생하는 plasma에 의한 PZT의 전기적 특성 변화가 박막 표면의 물리적 변화에 기인할 것으로 추정하고 있지만 이에 대한 구체적인 연구는 미비하다. 이 연구에서는 plasma에 의한 PZT 박막 표면의 물리적 특성 변화를 연구하기 위하여 PZT 박막을 sol-gel을 이용하여 Si 기판위에 약 100 nm의 두께로 증착하였으며, 이후 최대 300 W의 Ar plasma로 plasma power을 증가시켜 각각 10분간 plasma처리를 실시하였다. PZT 박막 표면의 nano-mechanics 특성을 분석하기 위하여 Nano-indenter와 Kelvin Probe Force Microscopy (KPFM)을 사용하여 surface hardness, surface morphology를 확인하였고 특히, surface potential 분석을 통하여 PZT 박막 표면의 plasma에 의한 박막 극 표면의 전기적 특성 변화를 연구하였다. 이 연구로 plasma에 의한 PZT 박막은 표면으로부터 최대 43 nm 깊이에서의 hardness는 최대 5.1 GPa에서 최소 4.3 GPa의 분포로 plasma power 변화에 의한 특성은 측정 불가능하였다. 이는 plasma에 의한 영향이 시료 극 표면에 국한되어 나타나기 때문으로 추정되며 이를 보완하기 위하여 surface potential을 분석하였다. 결과에 의하면 plasma power가 0 W에서 300 W로 증가함에 따라 potential이 30 mV에서 -20 mV로 감소하였으나 potential의 분산은 100 W에서 최대인 17 mV로 측정되었으며, 이때 RMS roughness역시 가장 높은 20.145 nm로 측정되었다. 특히, 100 W에서 potential에서는 물결 모양과 같은 일정한 패턴의 potential 무늬가 확인되었다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1999.05a
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• pp.341-344
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• 1999

The effects of post annealing treatments of ferroelectrlclty in PZT(P $b_{1.05}$(Z $r_{0.52}$, $Ti_{0.48}$) $O_3$ thin film deposited on Pt/ $SiO_2$/Si substrate by RF-Magnetron sputtering methode was Investigated. Analyses by RTA(Rapid Thermal Annealing) treatments reveled that the crystallization process strongly depend on the healing temperature. The Perovskite structure with strong PZT (101) plan was obtained by RTA treatments at 75$0^{\circ}C$ With increasing RTA temperature of PZI thin films, the coercive field and remanent Polarization decreased, while saturation polarization( $P_{r}$) was decreased. P-E curves of Pt/PZT/Pt capacitor structures demonstrate typical hysteresiss loops. The measure values of $P_{r}$,. $E_{c}$ and dielectric constants by post annealed at 75$0^{\circ}C$ were 38 $\mu$C/$\textrm{cm}^2$ 35KV/cm and 974, respectively. Switching polarization versus fatigue characteristic showed 12% degradation up to 10$^{7}$ cycles.s.s.s.s.s.s.

• Journal of the Microelectronics and Packaging Society
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• v.11 no.3 s.32
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• pp.91-97
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• 2004

PBT thin films were formed by rf-magnetron sputtering on $Pt/Ti/SiO_2/Si$ substrate. Bulk-PZT target containing $5\%$-excess PbO was used. After PZT thin films had been deposited at room temperature, remaining portion of the thin film was formed by in-situ process. The ferroelectric perovskite phase was formed at $650^{\circ}C$. The leakage current property was improved dramatically by 2-step sputtering, and in the sample containing optimum thickness of room temp.-layer very low leakage current of $2{\times}10^{-7}A/cm^2$ was shown. As a result of the investigation on the leakage current mechanism, the electrical conduction mechanism in all PZT thin films formed by several conditions was confirmed as bulk-limited mechanism.

• Proceedings of the KIEE Conference
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• 1998.11c
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• pp.801-803
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• 1998

We investigated Pt and $RuO_2$ as a bottom electrode and PZT thin film for ferroelectric applications. XRD examination shows that a mixed phase of (111) and (200) Pt peak for the temperature ranged from RT to $200^{\circ}C$, and a preferred (111) orientation for the substrate temperature of $300^{\circ}C$. From the XRD and AFM results, we recommend the substrate temperature of $300^{\circ}C$, 80 W for the Pt bottom electrode growth. From the study of an oxygen partial pressure from 0 to 50%, we learned that only Ru metal was grown with $0{\sim}5%$, a mixed phase of Ru and $RuO_2$ for $10{\sim}40%$, pure $RuO_2$ at 50%. Having optimized the bottom electrode growth conditions, we employed two step process in PZT film capacitor: PZT film growth at the low substrate temperature of $300^{\circ}C$ and then post RTA anneal treatments. PZT films were randomly oriented on $RuO_2$ and (110) preferentially oriented on Pt electrode. Leakage current density of PZT film demonstrated two to three orders higher for $RuO_2$ bottom electrode. From C-V results we observed a dielectric constant of PZT film higher than 1200. This paper presents the optimized process conditions of the bottom electrodes and properties of PZT thin films on these electrodes.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1999.05a
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• pp.638-641
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• 1999

In consideration of Dielectric loss and Temperature stability, 3-element system dopped with NiO, $Cr_2O_3$, well-known as Hardner and Stabilizer whose primary element is PZT was eximanated its structure, Temperature Coefficient of Capacitor, relative resistivity for Temperature Compensation condensor study. dopping with Nio, $Cr_2O_3$, Temperature Characteristic is developed, Dielectric loss largely represented useful1 small values in specimens dopped with NiO 0.2wt%, and specimence sintered at $110^{\circ}C$ dopped with $Cr_2O_3$, 0.1wt% also relative resistivity largely showed tendency of decrement According to dopping NiO more.

• Journal of the Korean Ceramic Society
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• v.35 no.7
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• pp.647-647
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• 1998

(La,Sr)CoO3/Pb(Zr,Ti)O3/(La,Sr)CoO3 (LSCO) heterostructures have been grown on LaAlO3 substrates by pulsed laser deposition (PLD) to investigate asymmetric polarization of Pb(Zr,Ti)O3 (PZT) thin flims with different electrode configuration. P-V hysteresis loop of LSCO/PZT/LSCO was symmetric. However, LaCoO3 (LCO_/PZT/LSCO showed a largely asymmetric P-V hystersis loop and large relaxation of the remanent polarization at the negatively poled state, which means that the negatively poled state was unstable. On the other hand, LSCO/PZT/LCO exhibited large relaxation of the positively poled state. The asymmetric behavior of the polarized states implies the presence of an interal electric firld inside the PZT layer. It is suggested that internal electric field is caused by built-in voltages at LCO/PZT and LSCO/PZT interfaces. The built-in voltages at LCO/PZT and CSCO/PZT interfaces were 0.6 V and -0.12 V, respectively.

• Korean Journal of Materials Research
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• v.10 no.10
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• pp.684-690
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• 2000

In order to study effects of interfacial layers between $Pb(Zr,Til)Q_3(PZT)$ films and electrodes for Metal-Ferroelectric-MetaI(MFM) structure capacitors, we have fabricated the capacitors with the Pt/PZT/interfacial-layer/Pt/$TiO_2/SiO_2$/Si structure. $PbTiO_3(PT)$ interfacial layers were formed by sol-gel deposition and PbO, ZrO, and $TiO_2$ thin layers were deposited by reactive sputtering. $TiO_2$ interface layers result in the finest grains of PZT(crystalline Temp. $600^{\circ}C$) films compare to $PbO_2\;and\;ZrO_2$ layers. However, as the thickness of $TiO_2$ layer increases. PZT thin films become rough and electrical characteristics were deteriorated due to remained anatase phase. On the other hand. PT interface layers result in improved morphology of PZT films and do not significantly change ferroelectric properties. It is a also observed that seed layers at the middle and top of PZT films do not give significant effects on grain size but the PT seed layer at the interface between the bottom electrode and the PZT films results in the small grain size.

• Analytical Science and Technology
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• v.10 no.1
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• pp.35-42
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• 1997

The sample pretreatment technique using a high pressure acid digestion bomb for the analysis of ceramic capacitor materials, such as barium titanate and PZT, was studied. When the concentrations of hydrochloric acid were varied with the addition of nitric acid or distilled water, quantitative measurements for those samples were carried out using inductively coupled plasma atomic emission spectrometry. From this experiment the results indicate that most of elements, such as Ba, Mn, Zn, Si, etc., aren't affected by the concentration of hydrochloric acid but Nb and Zr are very susceptable to it. It however turns out that the digestion time relatively gave little effects on the analytical result. In case of Nb the ratio of hydrochloric acid to water should be greater than 3:1(v / v) for the best analytical result. For the Pb determination use of diluted hydrochloric acid compared to the mixture of nitric acid and hydrochloric acid showed a better analytical result.

• Proceedings of the Materials Research Society of Korea Conference
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• 2003.11a
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• pp.139-139
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• 2003

많은 압전 후막은 여러 감지소자, 통신 및 사무자동화 기기, 전기 및 전자부품, 의료장비 및 국방산업에 까지 널리 응용되어 왔다. 그 중에서도 압전특성이 뛰어난 PZT 후막은 마이크로 펌프, 밸브, 헤드, 모터, 트랜스듀서 뿐 아니라 최근 바이오칩용 센서와 액추에이터로서 널리 연구되고 있다. 또한 마이크로 센서와 액추에이터 의 제작 및 구동을 위한 MEMS 기술의 도입으로 실리콘 베이스의 소자 개발이 집중되고 있다. 스크린 프린팅 방법은수 마이크론에서 수십 마이크론 후막의 실현이 용이하고 비교적 경제적이며 소자신뢰도가 높고 대량생산에 유리하여 활발한 연구가 진행 중이다. 그러나 후막은 벌크에 비해 기공률이 높고, 또 소자응용에 있어서 고온소결 시 MEMS공정을 위한 실리콘 베이스 기판과의 확산 및 반응에 의 한 계면 및 활물질 성능의 저하가 문제가 되고 있다. 따라서 본 연구에서는 스크린 프린팅과 더불어 졸 코팅 방법의 도입으로 후막의 성형 및 소결 밀도를 높임과 동시에 여러 확산 방지 막의 증착으로 capacitor 형 PZT 후막의 물성 및 전기 적 특성을 향상시키고자 하였다.