• The Proceeding of the Korean Institute of Electromagnetic Engineering and Science
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• v.25 no.3
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• pp.24-33
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• 2014

• Journal of Korean Academy of Nursing
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• v.48 no.1
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• pp.50-58
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• 2018

Purpose: The purpose of this study was to examine the mediating effect of marital intimacy on the impact of uncertainty on the quality of life (QoL) of young breast cancer patients. Methods: This study used a pathway analysis with 154 young breast cancer cases in their early diagnosis stage at a medical center in Korea. Data were collected from November 2016 to February 2017 and analyzed using correlation analysis and pathway analysis. Results: Uncertainty, marital intimacy, and 4 sub-scales of QoL showed a significant correlation. Marital intimacy was directly affected by uncertainty (${\beta}=-.39$, p=.013) and 4 sub-scales of QoL were also affected by uncertainty. Among the 4 sub-scales of QoL, physical well-being (PWB) (${\beta}=.17$, p=.026), social well-being (SWB) (${\beta}=.49$, p=.010), and functional well-being (FWB) (${\beta}=.38$, p=.009) were affected by marital intimacy but emotional well-being (EWB) was not affected by it. The mediating effect of marital intimacy on the impact of uncertainty on QoL was confirmed. Marital intimacy showed a significant indirect effect on PWB (${\beta}=-.07$, p=.024), SWB (${\beta}=-.19$, p=.008), and FWB (${\beta}=-.15$, p=.005), and it means that marital intimacy has a partial mediating effect on the impact of uncertainty on PWB, SWB, and FWB. Conclusion: Effects of uncertainty on QoL was mediated by marital intimacy of young breast cancer patients in their early diagnosis stage. It suggests that marital intimacy needs to be considered in providing nursing intervention for young breast cancer patients.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.09a
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• pp.87-119
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• 2001

Fine Pitch Technology will be accelerated among next decade. Buildup Technology is Key Technology for High Density Interconnection. Novel Base Material is critical for High Speed, Area Array Flip Chip Application. Japanese PWB Technology Roadmap will be Published soon.

• Journal of Applied Reliability
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• v.5 no.2
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• pp.241-259
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• 2005

The environmental problem is a main subject of the 21C and an environment destruction phenomenon by various kinds of environmental materials is reaching serious level. Nations to be classified as the environmental developed country, are born again environmental rich country. And they earn a large income by trade Every kind environmental resource in an international commercial transaction. Especially, the study that a reliability assessment method to prevent to reliability problem to be happened when the solder lead(lead-free solder), non-cd component, non-bromide component(without the polybrominated biphenyls(PBB) and polybrominated diphenyl ethers(PBDE))and hexavalent chromium(Cr VI) clearance component and mercury-free applied to electronic equipment is progressed. As the result of the study for applying of a reliability assessment technique of lead-free solder that recognized the most of urgent problem at the company, combination accelerated life test could taken by adding and appling the part of a humidity acceleration part to Eyring Model which is proposed by R.E.Thomas. The reliability assessment methods study of PWB clean environmental materials is expected to respond to a reliability elevation and environmental material regulation policy spreading all over the world by beginning form Europe.

• Proceedings of the Korean Reliability Society Conference
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• 2005.06a
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• pp.393-404
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• 2005

The environmental problem is a main subject of the 21C and an environment destruction phenomenon by various kinds of environmental materials is reaching serious level. Nations to be classified as the environmental developed country, are born again environmental rich country. And they earn a large income by trade Every kind environmental resource in an international commercial transaction. Especially, the study that a reliability assessment method to prevent to reliability problem to be happened when the solder lead(lead-free solder), non-cd component, non-bromide component(without the polybrominated biphenyls(PBB) and polybrominated diphenyl ethers(PBDE))and hexavalent chromium(Cr VI) clearance component and mercury-free applied to electronic equipment is progressed. As the result of the study for applying of a reliability assessment technique of lead-free solder that recognized the most of urgent problem at the company, combination accelerated life test could taken by adding and appling the part of a humidity acceleration part to Eyring Model which is proposed by R.E.Thomas. The reliability assessment methods study of PWB clean environmental materials is expected to respond to a reliability elevation and environmental material regulation policy spreading all over the world by beginning form Europe.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.25 no.9
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• pp.919-929
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• 2014

In recent, the requirements for the safety to the effects of high power electromagnetic wave have been increased along with the development of electricity and electronic equipments. The small sized electronic devices and the various components have been analyzed by using the full-EM simulation and solving a complete set of Maxwell equation. However, the deterministic approach has a drawback and much limitation in the electromagnetic analysis of an electrically large cavity with a high complexity of the structure. In this paper, statistical theory and topological modeling method are combined to analyze the large cavity with a complex structure. In particular, the PWB(Power Balance) method and BLT(Baum-Liu-Tesche) equation are combined and employed to solve the frequency response to the large-scaled cavity with remarkably reduced time-consumption. For instance, a PCB substrate inside box of box are considered as a large structure with a complexity.

• (The) Korean Journal of Educational Psychology
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• v.32 no.3
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• pp.571-596
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• 2018

Objectives: This study investigated the challenges of young cross-cultural individuals (CCIs) through the cultural homelessness (CH) framework. Methods: Through a survey of 151 CCIs, the study empirically examined the relationship between CH and psychological well-being (PWB), as well as the moderating role of emotional clarity (EC). Results: Results indicated that CH was significantly and negatively associated with PWB, especially on the Positive Relations with Others and Environmental Mastery dimensions. Individuals with high CH tended to have less satisfactory relationships and a reduced sense of control over daily life situations, regardless of their EC level. A significant interaction effect between CH and EC was found, specifically in Positive Relations with Others (PR) and Personal Growth (PG). For individuals with high CH, however, satisfactory relationships were dependent on their EC level; they reported more positive relationships with others when their EC levels were high. Interestingly, individuals with high CH were likely to report a high desire for personal growth regardless of their EC level, indicating that they may appear ambitious but may be experiencing unclear emotions. Conclusions: These findings suggest that CH and EC are issues that need to be dealt with simultaneously. As individuals' PWB depends not only on their CH level, but also on their EC, reducing the level of CH should not be the only goal in promoting the well-being of CCIs. Increasing individuals' EC would be just as important, as high EC, along with low CH, predicts important dimensions of PWB.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.11a
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• pp.111-114
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• 2001

Optical transmitter and receiver are the essential components for optical communication. For these components, butterfly type packages are used which are comprised of metal housing, multilayer ceramic inserts, lead and window. In this study, 2.5 Gbps DFB(Distributed -Feedback) LD(Laser Diode) package was fabricated and characterized. Metal housing showed good thermal conductivity (200W/mK) and well matched TCE(6.7ppm/K) with GaAs chip. Ceramic inserts also showed good VSWR(Voltage Standing Wave Ratio) characteristics(<2.0). By brazing technology, all the elements were combined and sealed. RF characteristics of the package mounted on the PWB was also tested.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.02a
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• pp.37-59
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• 2004

In the case of Ni/Au finished pad on the package side, the solder joint of SnAgCu system can bring brittle fracture under impact load such as drop test. Therefore, it's difficult to prevent the brittle fracture of lead-free solder, by controlling Cu content. The failure locus existing on the interface between $(Ni,Cu)_3Sn_4\;and\;(Cu,Ni)_6Sn_5$ IMC layers must be changed to other site in order to avoid brittle fracture due to impact load. It was not found any clear evidence that there were two IMC layers exist. But it was strongly assumed these were two layers which have different Cu-Ni composition. From the above analysis it was assumed that Cu atom in the solder alloy or substrate seemed to affect IMC composition and cause to IMC brittle fracture.

• 제어로봇시스템학회:학술대회논문집
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• 2001.10a
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• pp.104.2-104
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• 2001

In the intelligent integrated systems, the delay time must be reduced using highly parallel processors, as well as high throughput performance. In this paper, we propose a new concept for building 3D highly parallel processors using multi-layer printed wiring boards with built-in soldering heater (BISH-PWB). The proposed BISH is realized with the long and narrow cupper wiring pattern on the internal layer in the terminal pattern area. Based on the linearity of the cupper resistance vs. temperature, we can measure the BISH, temperature and its calorific value from the heater voltage and current measurements. If we provide the BISH temperature control systems for each BISH, selective multi-point soldering can be realized with same ...