• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1995년도 춘계학술대회 논문집
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• pp.39-42
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• 1995

In this study, PLZT thin films prepared by Sol-Gel method were deposited on ITO glass by spin coating and cryatallized at 750$^{\circ}C$ for 5 min by RTA in oreder to investigate their electrical and optical properties. Although thin film experieneced narrowing their hysteresis loops with increasing La content, E$\sub$c/ and P.sub r/ were higher for thin film than for bulk materials. $\varepsilon$$\sub$r/ and optical transmittance increased with increasing La content.

• 한국세라믹학회지
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• 제31권2호
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• pp.171-176
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• 1994

The spin-casted PLZT(9/65/35) thin films through polymeric sol-gel process were prepared on Pt substrate. The crack-free, uniform and dense films were obtained by post-annealing at the temperature between 35$0^{\circ}C$ and $700^{\circ}C$. The composite structure mixed together with large grains called "rosette" and surrounding small grains were observed on the films annealed over $600^{\circ}C$. Pyrochlore phase was completely changed to perovskite phase above $600^{\circ}C$ with the increase of annealing temperature. Dielectric constant (k) was larger with the increase of film thickness and annealing temperature. from the measurements of dielectric constant as a function of measuring temperature, it was also observed that Curie temperature was shifted to higher temperature with the increase of film thickness and annealing temperature. The pyroelectric coefficient(P) of 10 times coated film annealed at $700^{\circ}C$ was 65 $\mu$C/$\textrm{cm}^2$.K.$.K.

• 한국진공학회지
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• 제18권2호
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• pp.141-146
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• 2009

rf magnetron sputtering 법을 이용하여 Pt/Ti/$SiO_2$/Si 기판 위에 buffer layer인 $TiO_2$ 층을 증착한 후 PLZT 강유전체 박막을 증착하였다. PLZT 박막 증착 시 가스 분압비가 박막의 특성에 미치는 영향을 알아보기 위해 Ar/$O_2$ 분압비를 각각 27/1.5 sccm, 23/5.5 sccm, 21/7.5 sccm, 19/9.5 sccm로 변화시키면서 박막을 증착하였다. 이들 박막의 구조적인 특성을 분석하기 위해 X-선 회절법을 사용하였으며 FE-SEM을 이용하여 입자상을 관찰하였다. 또한 박막의 유전특성을 분석하기 위해 Precision LC를 이용하여 이력곡선, 잔류분극, 누설전류를 측정하였다. 산소 분압이 높아질수록 박막의 결정성 및 치밀성이 저하되었으며, (110) 방향에서 (111) 방향으로 우선배향성이 변화하는 것을 확인하였다. 산소 분압비의 변화는 박막 표면 및 강유전 특성에 영향을 미치는 것으로 판단된다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1995년도 춘계학술대회 논문집
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• pp.187-191
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• 1995

Thin film of the (Pb$\_$1-x/La.sub x/)(Zr$\_$0.25/Ti/Sub 0.48/) O$_3$(x=0~13[at%]) were prepared by Sol - Gel method. Multi-layer PLZT thin films were fabricated by spin-coating on Pt/Ti/SiO$_2$/Si substrate. The crystallinity and microstructure of the films were investigated with the sintering condition. At the sintering temperature of of 600[$^{\circ}C$], the perovskite phase was dominat. PLZT(11/52/48)thin films sintered at 600[$^{\circ}C$], 1[hr] had good dielectric constant (1236), dielectric loss (2.2[%]), remanent polarization (1.38[${\mu}$C/$\textrm{cm}^2$] and coercive field(16.86[ kV/cm]) respectively.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1996년도 하계학술대회 논문집 C
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• pp.1505-1507
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• 1996

In this study, $(Pb_{0.88}La_{0.12})(Zr_{0.40}Ti_{0.60})O_{2.97}$ (La/Zr/Ti=12/40/60) ceramic thin films were fabricated from an alkoxide-based by Sol-Gel method. PLZT stock solutions were made and spin-coated on the ITO-glass rubstrate at 4000[rpm] for 30[sec]. Coated specimens were baked to remove the organic materials at $400[^{\circ}C]$ for 10[min]. This procedure was repeated 5 times. The coated films were finally annealed at $450{\sim}700[^{\circ}C]$ for 1[hr]. The ferroelectric perovskite phases precipitated under the sintering of $550{\sim}700[^{\circ}C]$ for 1[hr]. Relative dielectric constant of the PLZT thin were increased with increasing the sintering temperature, the thin file sintered at $650[^{\circ}C]$ showed the highest value of 196. But in the PLZT thin film sintered at $700[^{\circ}C]$, relative dielectric constant was greatly decreased due to reacts between ITO electrode and glass substrate. In all thin films, the transmittance was more than 70[%] (at 632.8[nm]).

• 한국세라믹학회지
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• 제29권3호
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• pp.216-222
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• 1992

PLZT thin films were prepared using sol-gel spin coating. The films mainly consisted of perovskite phase when heat treated at 600$^{\circ}C$ and in O2 or air atmosphere for 2 hours after 7 coating cycles. Cracks were formed when smaller than after 9 coating cycles. When ITO interlayer existed between Corning 7059 glass substrate and the film, cracks were not formed after 9 coating cycles, but cracks were formed after 11 coating cycles because of large volume change of the film contracting on the substrate during the heat treatment. In the observation of microstructure, the thin films have perovskite phase of about 2 $\mu\textrm{m}$ grain size and pyrochlore phase of 100∼200${\AA}$ grain size.

• 한국정보통신학회논문지
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• 제9권5호
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• pp.1066-1072
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• 2005

비휘발성 메모리 소자로의 응용의 관점에서, sol-gel 방법으로 PLZT(x/30/70) 박막을 제작하여 La 농도에 따른 구조적 및 전기적 특성을 조사하였다 La 농도가 0 에서 $10mol\%$ 로 증가함에 따라, PLZT 박막의 유전상수는 450 에서 600 으로 증가된 반면, 유전손실과 100kV/cm에서 측정한 누설전류밀도는 각각 0.075 에서 0.025 로 $5.83{\times}10^{-7}$에서 $1.38{\times}10^{-7}A/cm^2$ 으로 감소되었다. 175kV/cm 에서 측정한 PLZT 박막의 이력곡선을 측정한 결과, La 농도가 0 에서 $10mol\%$ 로 증가함에 따라 박막의 잔류분극과 항전계는 각각 20.8에서 $10.5{\mu}C/cm^2,$ 54.48 에서 32.12kV/cm 로 감소되었다. PLZT 박막에 ${\pm}5V$ 의 사각펄스를 $10^9$ 회 인가하여 피로특성을 측정한 결과, La 농도가 증가함에 따라 초기 분극값의 감소가 64 에서 $40\%$ 로 개선됨을 확인할 수 있었다.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1994년도 하계학술대회 논문집 C
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• pp.1305-1307
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• 1994

9/65/35 PLZT thin films were prepared by sol-gel processing and annealed by direct insertion, 9/65/35 PLZT thin films were poly-crystallized after direct insertion at $750^{\circ}C$ for 3omin. The grain size of film was 50 nm, coercive field was 28.2 kV/cm and remnant polarization was $3.68 {\mu}C/cm^2$.

• 한국정보통신학회논문지
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• 제11권9호
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• pp.1717-1723
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• 2007

본 연구에서는 PLZT(10/30/70), PLT(10), PZT(30/70) 강유전체 박막을 이용한 quasi-MFISFET (Metal-Ferroelectric-Insulator-Semiconductor FET) 소자를 제작하여 드레인 전류 특성을 조사하였다. 이로부터, quasi-MHSFET 소자의 드레인 전류 크기가 강유전체 박막의 분극 크기에 따라 직접적인 영향을 받으며 결정된다는 사실을 알 수 있었다. 또, ${\pm}5V$ 와 ${\pm}10V$의 게이트 전압변화를 주었을 때 메모리 윈도우는 각각 0.5V 와 1.3V 이었고, 강유전체 박막에 인가되는 전압에 의해 만들어지는 항전압의 변동에 따라 메모리 윈도우가 변화된다는 사실을 확인할 수 있었다. MFISFET 소자의 retention 특성을 알아보기 위 해 PLZT(10/30/70) 박막의 전기장과 시간지연에 따른 누설전류 특성을 측정하여 전류밀도 상수 $J_{ETO}$, 전기장 의존 요소 K, 시간 의존 요소 m을 구하고, 이들 파라미터를 이용하여 시간에 따른 전하밀도의 변화를 정량적으로 분석하였다.

• 한국전기전자재료학회논문지
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• 제22권1호
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• pp.29-34
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• 2009

PLZT thin films were deposited on platinized silicon (Pt/$TiSiO_2$/Si) substrate by RF magnetron sputtering. A $TiO_2$ buffer layer was fabricated, prior to deposition of PLZT films. the layer was strongly affected the crystallographic orientation of the PLZT films. X-ray diffraction was performed on the films to study the crystallization of the films as various substrate temperatures (Ts). According to increasing Ts, preferred orientation of films was changed (110) plane to (111) plane. The ferroelectric, dielectric and electrical properties of the films were also investigated in detail as increased substrate temperatures. The PLZT films deposited at $400^{\circ}C$ showed good ferroelectric properties with the remnant polarization of $15.8{\mu}C/cm^2$ and leakage current of $5.4{\times}10^{-9}\;A/cm^2$.