• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.18 no.4 s.119
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• pp.423-429
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• 2007

The clock recovery module of gap filler for satellite DMB is proposed. Proposed module sustains the output frequency of 10 MHz whether the received signal from the satellite is unstable or cut off within 0.5 sec. The advantages of this module is without frequency tuning at regular interval and low material cost. This module is fabricated by using CPLD as clock recovery IC and new type of loop filter for satisfying the fast lock time and long hold over time simultaneously. The measured performance of the fabricated module has a holdover time of 11 sec at frequency stability less than 0.01 ppm, and phase noise of -113 dBc/Hz at 100 Hz offset.

• The Journal of Korean Institute of Information Technology
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• v.16 no.11
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• pp.61-68
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• 2018

This paper describes design of a 10.525 GHz self oscillating mixer semiconductor IC chip combining voltage controlled oscillator and frequency mixer using silicon CMOS technology for Doppler radar applications. The p-core type VCO included in the self oscillating mixer minimizes the noise contained in the transmitted signal. This noise minimization increases the sensing distance and acts in a direction favorable to the reaching distance and the sensitivity of the motion detection sensor. Simulation results for phase noise show that a VCO designed as a P-core has a noise characteristic of -106.008 dBc / Hz at 1 MHz offset and -140.735 dBc / Hz at 25 MHz offset compared to a VCO designed with N-core and NP-core showed excellent noise characteristics. If a self-oscillating mixer is implemented using a p-core designed VCO in this study, a motion sensor with excellent range and reach sensitivity will be produced.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.25 no.7A
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• pp.935-942
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• 2000

In this paper, miniature voltage-controlled oscillator(VCO) for 1.6GHz PCS band is designed and implemented. Colpitts type LC resonating oscillator is designed with multilayer PCB and circuit parameters are optimized using the circuit simulator. Using the optimized design parameters, miniature VCO with 6X6X1.8mm3 (0.065cc)dimensions is fabricated and experimented. Developed VCO has -1.67dBm $\pm$0.5dBm output power level in52.5MHz tunung range, and has -99.33dBc/Hz phase noise performance at 10 KHz frequency offset.

• 전자공학회논문지 IE
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• v.45 no.4
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• pp.1-6
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• 2008

A fast-hopping frequency synthesizer that reduces complexity and power consumption is presented for MB-OFDM UWB applications. The proposed architecture uses 3960 MHz LC VCO, 528 MHz ring oscillator, passive mixer and LC-tuned Q-enhancement BPF to generate Band Group 1 frequencies. The adjacent channel rejection ratio is less than -40 dBc for 3432 MHz and -H dBc for 4488 MHz. A fast switching SCL-tpre MUX is used to produce the required channel output signal and it takes less than 2.2 ns for band switching. The total power consumption is 47.9 mW from a 1.8 V supply.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.45 no.6
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• pp.60-67
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• 2008

A low-power 2.4GHz fractional-N frequency synthesizer has been designed for 2.4GHz ISM band applications such as Bluetooth, Zigbee, and WLAN. To achieve low-power characteristic, the design has been focused on the power optimization of power-hungry blocks such as VCO, prescaler, and ${\Sigma}-{\Delta}$ modulator. An NP-core type VCO is adopted to optimize both phase noise and power consumption. Dynamic D-F/Fs with no static DC current are employed in designing the low-power prescaler circuit. The ${\Sigma}-{\Delta}$ modulator is designed using a modulus mapping circuit for reducing hardware complexity and power consumption. The designed frequency synthesizer which was fabricated using a $0.18{\mu}m$ CMOS process consumes 7.9mA from a single 1.8V supply voltage. The experimental results show that a phase noise of -118dBc/Hz at 1MHz offset, the reference spur of -70dBc at 25MHz offset, and the channel switching time of $15{\mu}s$ over 25MHz transition have been achieved. The designed chip occupies an area of $1.16mm^2$ including pads where the core area is only $0.64mm^2$.