• 한국표면공학회지
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• 제12권3호
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• pp.161-166
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• 1979

Theoretical and practical aspects are investigated for electrochemical behavious, plating processes and the structures of electrodeposit of Pb-Sn binary alloy plating through numerous literatures in this report. The anodic and cathodic electrode reaction mechanisms of Pb and Sn could co-deposit and make Pb-Sn alloy deposit from the results of cathode current density-cathode potential curves of Pb, Sn and Pb-Sn alloys in fluoborate solutions. The compositions of the best alloy plating solutions are obtained for the purpose of bearing, anticorrosion and solder plating. In general, the casting anodes of Pb-Sn alloys are used, but separated anodes of Pb and Sn pure metal are used in order to obtain the fine compositions of Pb-Sn alloy deposits. The electrodeposits of Pb-Sn alloy are in nonequilibrium state and saturated solid solutions. Thus, ${\beta}$-phase (Sn-phase) is precipitated by heat treatment. The texture and structure of the electrodeposit are associated with the surface energies of deposit lattice planes and with the cathode polarization. The electrodeposit of Pb-Sn alloy is shown as lamellar structure.

• 마이크로전자및패키징학회지
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• 제26권2호
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• pp.51-54
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• 2019

실리콘 기판상에 여러 조건의 전류밀도에서 로듐 도금을 실시하였다. 직류전원의 경우 전류밀도가 증가하면 로듐 표면에 균열이 발생하였다. 잔류응력을 낮추기 위하여 펄스전류를 인가하였다. 펄스전류의 off 시간이 도금층의 잔류응력을 낮추는데 영향을 주었다. 펄스전류의 인가 주기를 5:5로 하였을 경우 균열 없는 로듐 도금층을 얻었다.

• Membrane and Water Treatment
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• 제11권3호
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• pp.217-222
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• 2020

An electrochemical oxidation process was applied to remove cyanide (CN^-) from real plating wastewater. CN^- removal efficiencies were investigated under various operating factors: current density and electrolyte concentration. Electrolyte concentration positively affected the removal of both CN^- and Chemical Oxygen Demand (COD). As the electrolyte concentration increased from 302 to 2,077 mg Cl^-/L, removal efficiency of CN^- and COD increased from 49.07% to 98.30% and from 23.53% to 49.50%, respectively, at 10 mA/㎠. Current density affected the removal efficiency in a different way. As current density increased at a fixed electrolyte concentration, CN^- removal efficiency increased while COD removal efficiency decreased, this is probably due to lowered current efficiency caused by water electrolysis.

• 한국표면공학회지
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• 제35권1호
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• pp.17-32
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• 2002

Electroplating methods by molten salts and non-aqueous melts were employed for aluminium coating on STS 316L stainless steel. After coated with Ni or non-coated surface on stainless steel, Al pulse plating was carried out in two different types of electrolytes at room temperature. The Al layer from $AlCl_3$-TMPAC melts could not obtain appreciable thickness for engineering application due to chemical reactions between deposits and moisture of air. However, The Al coating by pulse plating in the Ethylbenzene-Toluene-$AlBr_3$ systems was found to be solid coating layer with a few $\mu\textrm{m}$ scale. The conductivity of Ethylbenzene-Toluene-$AlBr_3$ electrolyte was as functions of time and agitation. By seven days exposure after mixing of the electrolyte, Al-deposited layer shows uniform and near by pore-free with high current density (higher than 30mA/$\textrm{cm}^2$). The roughness and imperfection of coating layer were decreased with a increasing agitation speed. It was found that the optimum condition for the Al pulse plating on the 316L stainless steel was a 400mA peak current, duty cycle, $t_{on}$ $t_{ off}$=3ms/1ms, and a current density of 30mA/$\textrm{cm}^2$.

• 한국표면공학회지
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• 제40권3호
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• pp.125-130
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• 2007

Many fundamental studies have been carried out regarding waste water and hazardous gas treatment technology using the photolysis effect of $TiO_2$. However, photolysis of both organic and organic-inorganic binders immobilizing $TiO_2$ makes permanent use impossible. In this study we manufactured a catalytic electrode by nickel-$TiO_2$ composite plating in order to immobilize $TiO_2$. The surface properties according to the current density changes of cathode and concentration changes of $TiO_2$ powder in nickel plating bath has been analysed with EDX, XRF, SEM, Raman spectrometer etc. The characterization of the catalytic electrode in decomposition of organic compound has been obtained by using UV-Visible spectrophotometer through analysing concentration changes of methyl orange solution containing the catalytic electrode vs. time with projecting UV-light in the solution. The study shows that a catalytic electrode of nickel-$TiO_2$ composite plating with high-efficiency in decompostion of organic compound has been formed under high concentration of $TiO_2$ powder and low current density of cathode.

• 한국표면공학회지
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• 제18권3호
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• pp.105-115
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• 1985

Lead-tin-copper ternary alloy electrodeposition is conducted onto the inner bore surface of plain bearings as an overlay in order to investigate the effect of slot width, current density and fluoboric acid concentration on the uniformity of overlay. The thickness of overlay is analyzed by means of current distribution resulting from the overvoltage of plating bath and the apparent distance between cathode and anode. The result demonstrate that the uniformity of overlay is remarkably dependent of the slot size and current density, but has little bearing on the fluoboric acid concentration over 100g/L. This present study indicates that uniform overlay is obtainable within the tolerable thickness of ${\pm}2{\mu}m$ by using the slot width of 22mm. The surface morphology examination also shows the important role of concentration polarization of the micro-uniformity of overlay. The micro-uniformity has improved at the low concentration polarization which resulted from operating at the low current density and high fluoboric acid concentration. The surface morphology of deposits exhibits the vivid pyramid crystalline in the plating condition of low concentration polarizatio and all deposits have columnar structure parallel to the applied electric field regardless of the electroplating condition used.

• 한국항행학회논문지
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• 제28권4호
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• pp.544-551
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• 2024

본 연구에서는 도금 공정 시뮬레이션에 필요한 전기화학적 분극 데이터와 도금 조건 시뮬레이션 및 도금층의 특성 평가에 대해 다루었다. Ni과 Cu의 동전위 분극 분석 및 정전류 분극 시험을 통해 얻은 전기화학적 분극 데이터는 도금액의 유동 조건에 따른 과전압 분포 변화를 관찰하는 데 사용되었다. 도금 조건 시뮬레이션에서는 랙 핀의 접점 위치와 개수가 도금 품질에 미치는 영향을 분석하기 위해 다양한 변수 하에서 전류 밀도 분포 및 도금 두께 분포를 평가하였다. 양극 형상, 극간 거리, 보조 양극 배치, 피도금체 간격 변화 등의 변수에 따른 시뮬레이션 결과를 통해 도금 두께 편차를 개선할 수 있는 방안을 모색하였다. 또한, 도금층의 특성 평가는 버퍼레이어 형성 유무에 따른 도금층의 두께, 밀착성 및 박리 여부를 분석하였다. 시뮬레이션을 통해 도금 공정의 효율성과 품질 향상을 위한 중요한 기초 데이터로 활용될 수 있다.

• 대한기계학회논문집A
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• 제39권12호
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• pp.1297-1303
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• 2015

장축의 내부 크롬도금은 크롬산 용액에 황산을 촉매로 경질의 후막 도금층을 형성시키는 기술로서 산업뿐만 아니라 군사적 목적으로도 널리 사용되고 있다. 대구경의 포신내부에 경질크롬도금을 처리하면 강성과 내마성을 증대시켜 고압의 폭발력에 견딜 수 있다. 탄자의 높은 운동에너지와 탄 폭발로 생긴 고압력에 의해 포신 내부의 크롬도금층이 탈락되는 문제가 있어 도금 공정 전반에 걸친 검토가 이루어졌다. 크롬도금은 탈지, 수세, 전해연마, 에칭, 도금, 수세 및 수소취성제거 등 여러 공정으로 이루어진다. 크롬도금 탈락은 도금의 밀착성과 연관이 있으며, 그 중에 전해연마액의 Fe 농도가 도금 밀착성에 영향을 미치는 것으로 나타났다. 도금부위의 요철상태를 SEM으로 조사하여 도금탈락을 방지할 수 있는 최적의 Fe 농도를 설정하고, 밀착성 시험 등으로 그 효과를 입증하였다.

• 한국표면공학회지
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• 제27권2호
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• pp.109-117
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• 1994

Effect of ultrasonic agitation on the contact properties was studied in Ni electroless plating and Pd activation. P-type Si bare wafers were used as substrate and DMAB was used as reducing agent due to its good electrical properties, solderability and compatibility to substrate. In activation, high density Pd nuclei of small size were formed during ultra-sonic agitation compared to that of no stirring. In electroless plating, the plating rate was enhanced by 30∼90% by using ultrasonic agitation. In elecrtoless plating, inhibitor is the most effective additives in ultrasonic agitation. In this experi-ment, thiourea was used as inhibitor. The less the amount of the inhibitor, the more ultrasonic agitation efficiency. It is confirmed by SEM that Ni-B films formed by ultrasonic were coarser, less porous, and denser than those of no stirring. In ultrasonic agitation, boron content of the films was more than those of no stirring. In this case, the more DMAB concentration, the higher the temperature, the less pH, the more boron content. Resistivity of the films formed by ultrasonic agitation was higher than that of no strirring. As the content of boron was increased, the resistivity of the films was increased exponentially.

• 한국표면공학회지
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• 제29권2호
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• pp.140-145
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• 1996

Silver deposits formed on copper substrates by replacement reactions show poor adhesion, and a silver film plated on such a deposit does not adhere. Silver ion makes a highly stable complex with cyanide ion, so that in a silver cyanide solution, the activity of silver ion is very small. This is one of the reasons for the universal use of cyanide baths in the industrial silver plating. However, the consideration of the difference between the values of the stability constants for bath the silver-iodide complex and the copper-iodide complex suggest that the rate of replacement deposition of silver on the copper substrate in si]ver-potassium iodide solution, could be comparatively low. To confirm this, the rate of replacement deposition of silver in both a silver-potassium iodide solution ($AgNO_3$0.10 mol/L, KI 2.00 mol/L ) and a strike silver plating bath (AgCN 0.028 mol/L, KCN 1.15 mol/L ) was estimated from the current density corresponding to the point of intersection of the anodic and the cathodic polarization curves. These estimated values were almost the same, and it is suggested that the silver-potassium iodide solution is not only a cyanide free silver plating bath capable of employing a copper substrate but a silver plating bath which requires no strike plating.