• 폴리머
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• 제36권4호
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• pp.461-469
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• 2012

아르곤(Ar) 플라즈마 처리된 폴리프로필렌 복합소재의 표면 개질 및 특성 변화를 X-선 광전자 분광 분석(XPS), 적외선 분광 분석(FTIR), 주사 전자 현미경 분석(SEM) 및 접촉각 측정 등을 이용하여 조사하였다. Ar 플라즈마 처리 시간의 증가는 폴리프로필렌 복합소재 표면의 젖음성, 극성 관능기를 갖는 산소 성분, 탈크 함량 및 표면조도의 증가를 초래하였다. 주사 전자 현미경 분석을 통한 자세한 관찰은 폴리프로필렌 성분으로 구성된 표면층(skin layer)이 존재함을 확인하였다. 폴리프로필렌과 고무 입자간의 점도차는 표면층의 생성을 촉진시켰다. 하지만 Ar 플라즈마 처리시간의 증가는 표면층의 두께를 감소시키는 것을 확인하였다. 사출성형 공정 동안, 표면층을 제거할 수 있는 추가적인 방법론에 대해서도 토의하였다. Ar 플라즈마 처리에 의한 표면 개질 및 모폴로지의 변화는 폴리프로필렌 복합소재 표면 상에 친수화 상태를 부여하고, 이에 따라 젖음성 향상을 유도하였다.

• Transactions on Electrical and Electronic Materials
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• 제1권1호
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• pp.6-11
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• 2000

The hydrogen plasma treatment of silicon wafers in the reactive ion-etching mode was studied for the application to silicon-on-insulator wafers which were prepared using the wafer bonding technique. The chemical reactions of hydrogen plasma with surface were used for both surface activation and removal of surface contaminants. As a result of exposure of silicon wafers to the plasma, an active oxide layer was found on the surface. This layer was rendered hydrophilic. The surface roughness and morphology were examined as functions of the plasma exposing time and power. In addition, the surface became smoother with the shorter plasma exposing time and power. The value of initial surface energy estimated by the crack propagation method was 506 mJ/㎡, which was up to about three times higher as compared to the case of conventional direct using the wet RCA cleaning method.

• Corrosion Science and Technology
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• 제8권1호
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• pp.15-20
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• 2009

Surface of PEEK(poly-ether-ether-ketone) was modified by chemical etching, plasma treatment and mechanical grinding to improve the plating adhesion. The plating characteristics of these samples were studied by the contact angle, plating thickness, gloss and adhesion. Chemical etching and plasma treatment increased wettability, adhesion and gloss. The contact angle of as-received PEEK was $61^{\circ}$. The contact angles of chemical etched, plasma treated or both were improved to the range of $15{\sim}33^{\circ}$. In the case of electroless plating, the thickest layer without blister was $1.6{\mu}m$. The adhesion strengths by chemical etching, plasma treatment or both chemical etching and plasma treatment were $75kgf/cm^2$, $102kgf/cm^2$, $113kgf/cm^2$, respectively, comparing to the $24kgf/cm^2$ of as-received. In the case of mechanically ground PEEKs, the adhesion strengths were higher than those unground, with the sacrifice of surface gloss. The gloss of untreated PEEK were greater than mechanically ground PEEKs. Plating thickness increased linearly with the plating times.

• 한국진공학회지
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• 제17권3호
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• pp.199-203
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• 2008

$O_2$ 플라즈마를 이용한 표면처리 공정이 Bio-FET (biologically sensitive field-effect transistor)에 미치는 영향을 조사하기 위하여, SOI (Silicon-on-Insulator) wafer와 sSOI (strained- Si-on-Insulator) wafer를 이용하여 pseudo-MOSFET을 제작하고 $O_2$ 플라즈마를 이용하여 표면처리를 진행하였다. 제작된 시료들은 back gated metal contact junction 방식으로 측정되었다. $I_D-V_G$ 특성과 field effect mobility 특성의 관찰을 통하여 $O_2$ 플라즈마 표면처리에 따른 각 시료들의 전기적 특성 변화에 대하여 관찰하였다. 그리고 $O_2$ 플라즈마 표면처리 과정에서 플라즈마에 의한 손상을 받은 시료들은 2% 수소희석가스 ($H_2/N_2$)를 이용한 후속 열처리 공정을 진행한 후 전기적 특성이 향상되는 것을 관찰할 수 있었다. 이는 수소희석가스를 이용한 후속 열처리 공정을 통하여 산화막과 Si 사이의 계면 준위와 산화막 내부의 전하 포획 준위를 감소시켰기 때문이다.

• 한국수소및신에너지학회논문집
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• 제24권2호
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• pp.160-171
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• 2013

$LiNi_{1/3}Co_{1/3}Mn_{1/3}O_2$ powder for cathode materials in lithium rechargeable batteries was treated by atmospheric plasma containing hydrogen to investigate the relationship between charge/discharge performance and physical/chemical changes of materials. Hydrogen plasma at atmosphere pressure was irradiated on the surface of active materials, and the change for their crystal structure, surface morphology, and chemical composition were observed by XRD, SEM-EDS and titration method, respectively. The crystal structure and surface morphology of $H_2$ plasma-treated powders were not changed but their chemical compositions were slightly varied. For charge/discharge test, $H_2$ plasma affected initial capacity and rate capability of active materials but continuous cycling was not subject to plasma treatment. Therefore, it was observed that $H_2$ plasma treatment affected the surface of materials and caused the change of chemical composition.

• Transactions on Electrical and Electronic Materials
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• 제8권5호
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• pp.211-214
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• 2007

Chemical and morphological changes of phenol formaldehyde-based photoresist after $O_2$ radiofrequency(RF) plasma treatment depending on exposure time and source power were investigated. It was found that etch rate of photoresist sharply increased after discharge turn on and reached a limit with increase in plasma exposure time. Contact angle measurements and X-ray photoelectron spectroscopy(XPS) analysis showed that the surface chemical structure become nearly constant after 15 sec of the treatment. Atomic force microprobe(AFM) measurements were shown that surface roughness was increased with plasma exposure time.

• 한국레이저가공학회지
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• 제17권2호
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• pp.1-4
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• 2014

With the PEO(Plasma electrolytic oxidation) surface treatment, the oxide film of aluminum alloy is growing in a short time. The reflectance measurement to find the oxygen atoms in the oxide could be investigated. In order to form a thicker oxide film, the PEO surface treatment should be uniformly controlled in processing time.

• 전자공학회논문지 IE
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• 제44권3호
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• pp.6-11
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• 2007

본 연구는 플라즈마 처리한 고분자 복합재료 표면의 접촉각, X-선광전자분광법(XPS) 및 코로나 대전에 의한 표면 정전특성을 분석하여 발생된 화학적 변화와 정전적 특성 변화를 고찰하여 열화 메커니즘을 도출하였다. 플라즈마 처리된 시료의 접촉각 및 표면전위는 표면에 카르복실기 라디칼을 포함하는 다량의 측쇄화가 집중적으로 발생되어 처리시간에 따라 급격한 친수화가 진행되었다. 플라즈마 처리로 인한 화학적 변화에서 표면에 carboxyl 라디칼이 주로 형성되면서 급격히 표면 친수화로 변화하였다. 정전변화를 분석한 전위감쇠 결과에서 미처리 시료는 부극성 표면을 나타내었으나, 친수화 표면은 carboxyl 라디칼(-COO*)을 포함하는 정극성 라디칼로 인해 정극성 표면으로 변화하여 부극성 전하가 빠르게 감소하였다.

• 한국표면공학회지
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• 제41권1호
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• pp.33-37
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• 2008

Polycarbonate has a high transmittance to light, low specific gravity, flexibility and cost-effectiveness that extends the application field of the polymer to bio-engineering, optics, electronic parts, etc. Moreover, electro plating of metallic film on PC could endow the parts the electromagnetic interference shielding capability. However, poor adhesion of copper on PC limited the wide usage in the industry. In this work, a composite(PC/ABS) and MmSH(Momentary mold Surface Heating) injection process were used to improve the plating characteristics; plating thickness, gloss and adhesion. Also plasma treatment and chemical treatment were employed for improving adhesion. Plating characteristics on PC/ABS were better than those on PC due to the anchoring effect of butadiene. MmSH injection process could ameliorate the gloss and coating adhesion. Also plating thickness and adhesion of PC and PC/ABS were increased by plasma treatment.

• 한국표면공학회지
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• 제53권6호
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• pp.306-311
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• 2020

In this work, diamond-like carbon (DLC) films are coated onto plasma nitrided AISI 4140 steel by DC-pulsed PECVD. One problem of DLC films is their very poor adhesion on steel substrates. The purpose of the nitriding was to enhance adhesion between the substrate and the DLC films. The white layer formation is avoided. Plasma nitriding increased adhesion from 8 N for DLC coating to 25 N for duplex coating. Duplex plasma nitriding/DLC coating was proven to be more effective in improving the adhesion. The purpose of the bond layer was to enhance adhesion between the substrate and the DLC films.