• International Journal of Korean Welding Society
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• v.1 no.1
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• pp.58-62
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• 2001

The surface of AC8A Ah alloy was modified by adding the Cu powder using a Plasma Transferred Arc (PTA) welding process. Under the optimum fabricating conditions, the modified surface of AC8A Ah alloy was observed to possess the sound microstructure with a minimum porosity. Hardness and wear resistance properties of the as-fabricated alloy were compared with those of the 76 heat-treated one. In case of the as-fabricated alloy, the hardness of the modified layer was twice that of the matrix region. Although significant increase in the hardness of the matrix region was observed after T6 heat treatment, the hardness of the modified layer was not observed to change. The wear resistance of the modified layer was significantly increased compared to that of the matrix region. The microstructure of a weld zone and the matrix region were investigated using the optical microscope, scanning electron microscope (SEM), electron probe microanalysis (EPMA), and transmission electron microscope (TEM). The primary and eutectic silicon in the weld zone were finer and more curved than in the matrix region, while some precipitates has had been found therein. According to the TEM observation, the predominant precipitate present in the weld zone was the $\theta$'phase, which is precipitated during cooling by rapid solidification in PTA welding process. Improvement of hardness and wear properties in the weld zone in the as-fabricated condition can be explained based on the presence of $\theta$’precipitates and fine primary and eutectic silicon distribution.

• Journal of the Korean Vacuum Society
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• v.15 no.3
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• pp.259-265
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• 2006

We measured sputtering yield of RF $O_2-plasma$ treated MgO protective layer for AC-PDP(plasma display panel) using a Focused ion Beam System(FIB). A 10 kV acceleration voltage was applied. The sputtering yield of the untreated sample and the treated sample were 0.33 atoms/ion and 0.20 atoms/ion, respectively. The influence of the plasma-treatment of MgO thin film was characterized by XPS and AFM analysis. We observed that the binding energy of the O 1s spectra, the FWHM of O 1s spectra and the RMS(root-mean-square) of surface roughness decreased to 2.36 eV, 0.6167 eV and 0.32 nm, respectively.

• Journal of Pharmaceutical Investigation
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• v.39 no.6
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• pp.423-429
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• 2009

Liposomes have been used as one of the efficient carriers for drug delivery. In this study, anionic liposomes of which surface was modified by using both electrostaic interaction between anionic liposomes and cationically charged BSA molecules at lower pH than isoelectric point (pI) of BSA and denaturation of the BSA-coated liposomes by thermal treatment. The thermally denatured BSA-coated liposomes (DBAL) had mean particle diameter of 125.2${\pm}$1.7 nm and zeta potential value of -22.4${\pm}$4.5 mV. Loading efficiency of model drug, doxorubicin (DOX), into liposomes was 83.0${\pm}$2.6%. Results of in vitro stability study of DBAL in blood plasma showed that the mean particle diameter of DBAL 400 did not increase in blood plasma and adsorption of plasma protein was much less than plain or anionic liposomes. Intracellular uptake of DBAL 400 evaluated by confocal microscopy observation was higher than that of PEG liposomes.

• Journal of Sensor Science and Technology
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• v.8 no.3
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• pp.291-297
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• 1999

The plasma etching of tungsten thin films has been studied with $SF_6$ gas in RIE system. The etch rate of ${\alpha}$-phase W film with $SF_6$ gas plasma has been showed to depend strongly on process parameters ($SF_6$, $SF_6-N_2$ gas). Effect of $N_2$ addition and etching selectivity between W film and photoresist have also been studied in detail. Etching profiles between W film and photoresist were investigated by SEM. The compounds on W surface after $SF_6-N_2$ gas plasma treatment were examined by XPS and the concentration of F ions was detected by OES during plasma on.

• Journal of the Korean institute of surface engineering
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• v.54 no.4
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• pp.200-208
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• 2021

This paper investigated generation behavior of micro-arcs and growth behavior of PEO films on the AA7050 disc specimen in 0.1 M NaAlO₂ solution under the application of 1200 Hz anodic pulse current. Morphologies, thickness and surface roughness of PEO films were examined at the edge part and central part separately. Micro-arcs were generated first at the edge part and then moved towards the central part with PEO treatment time, indicating lateral growth of PEO films. The lateral growth resulted in uniform PEO thickness of about 5 ㎛ and surface roughness of about 0.5 ㎛. Moving of the arcs from the edge towards the central part appeared only one time and large size arcs were generated at the edge before completing the central part with small size micro-arcs. This suggests that vertical growth starts before completing the lateral growth. Large size arcs generated at the edge resulted in the formation of relatively large size pores within the PEO films on the AA7050 disc specimen.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.30 no.5
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• pp.189-193
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• 2020

Recently, various methods for preparing a flexible electrode for implementing a wearable sensor have been introduced. Wearable sensors show similar tendency to use various polymer substrates, which provides elasticity suitable to the motion of human body. In this paper, a highly elastic silver nanowire based electrode was prepared on a sponge-based stretchable substrate, and electrical properties were evaluated. Silver nanowires were grown using a wet chemical synthesis, impregnated into a plasma-treated sponge, and then heat treated at a low temperature. In particular, the plasma surface treatment of the sponge enables uniform coating of silver nanowires. The flexible sponge electrode showed reliable electrical resistance changes over 160 repeated tensile-compression cycles.

• Proceedings of the Korean Vacuum Society Conference
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• 2015.08a
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• pp.111.2-111.2
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• 2015

Typical electrodes (metal or indium tin oxide (ITO)), which were used in conventional organic light emitting devices (OLEDs) structure, have transparency and conductivity, but, it is not suitable as the electrode of the flexible OLEDs (f-OLEDs) due to its brittle property. Although Graphene is the most well-known alternative material for conventional electrode because of present electrode properties as well as flexibility, its carrier injection barrier is comparatively high to use as electrode. In this work, we performed plasma treatment on the graphene surface and alkali metal doping in the organic materials to study for its possibility as anode and cathode, respectively. By using Ultraviolet Photoemission Spectroscopy (UPS), we investigated the interfaces of modified graphene. The plasma treatment is generated by various gas types such as O2 and Ar, to increase the work function of the graphene film. Also, for co-deposition of organic film to do alkali metal doping, we used three different organic materials which are BMPYPB (1,3-Bis(3,5-di-pyrid-3-yl-phenyl)benzene), TMPYPB (1,3,5-Tri[(3-pyridyl)-phen-3-yl]benzene), and 3TPYMB (Tris(2,4,6-trimethyl-3-(pyridin-3-yl)phenyl)borane)). They are well known for ETL materials in OLEDs. From these results, we found that graphene work function can be tuned to overcome the weakness of graphene induced carrier injection barrier, when the interface was treated with plasma (alkali metal) through the value of hole (electron) injection barrier is reduced about 1 eV.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.3
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• pp.55-60
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• 2020

The recent semiconductor packaging technology is evolving into a high-performance system-in-packaging (SIP) structure, and copper-to-copper bonding process becomes an important core technology to realize SIP. Copper-to-copper bonding process faces challenges such as copper oxidation and high temperature and high pressure process conditions. In this study, the bonding interface quality of low-temperature copper-to-copper bonding using a two-step plasma treatment was investigated through quantitative bonding strength measurements. Our two-step plasma treatment formed copper nitride layer on copper surface which enables low-temperature copper bonding. The bonding strength was evaluated by the four-point bending test method and the shear test method, and the average bonding shear strength was 30.40 MPa, showing that the copper-to-copper bonding process using a two-step plasma process had excellent bonding strength.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.23 no.5
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• pp.374-378
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• 2010

The effects of $O_2$ plasma pretreatment on the properties of Ga-doped ZnO films on polyimide substrate were studied. GZO films were fabricated by RF magnetron sputtering process. To improve surface energy and adhesion between the polyimide substrate and the GZO film, $O_2$ plasma pretreatment process was used prior to GZO sputtering. As the RF power and the treatment time increased, the crystallinity increased and the contact angle decreased significantly. When the RF power was 100 W and the treatment time was 120 sec, the resistivity of GZO films on the polyimide substrate was $1.90{\times}10^{-3}{\Omega}-cm$.

• Journal of Advanced Marine Engineering and Technology
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• v.41 no.3
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• pp.238-244
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• 2017

Plasma ion nitriding has been widely used in various industries to improve the mechanical properties of materials, especially stainless steels by increasing the surface hardness. It has the particular advantages of less distortion compared to that in the case of hardening of steel, gas nitriding, and carburizing; in addition, it allows treatment at low-temperatures, and results in a high surface hardness and improved corrosion resistance. Many researchers have demonstrated that the plasma ion nitriding process should be carried out at temperatures of below $450^{\circ}C$ to improve corrosion resistance via the formation of the expanded austenite phase(S-phase). Most experimentals studied to date have been carried out in chloride solutions like HCl or NaCl. However, the electrochemical characteristics for the chloride solutions and natural seawater differ. Hence, in this work, plasma ion nitriding of 304 stainless steels was performed at various temperatures, and the electrochemical characteristics corresponding to the different process temperatures were analyzed for the samples in natural seawater. Finally the optimum plasma ion nitriding temperature that resulted in the highest corrosion resistance was determined.