• Proceedings of the KOSOMBE Conference
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• v.1998 no.11
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• pp.147-148
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• 1998

In this paper, we developed the process for depth-probe type silicon microelectrode arrays. The process consists of four mask steps only. The steps are for defining sites, windows, and for shaping probe using plasma etch from above, and for shaping using wet etch from below, respectively. The probe thickness is controlled by dry etching, not by impurity diffusion. We used gold electrodes with a triple dielectric system consisting of oxide/nitride/oxide. The shank of the probe taper from 200um to tens of urn tip and has 30 um thickness.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2012.11a
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• pp.141-141
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• 2012

고종횡비 10:1 비아를 Si wafer 상에 형성하기 위해 $7{\mu}m$ 직경의 마스크로 포토작업하여 Cr층을 100nm 스퍼터링하여 PR(photo resistor) 대신의 에칭 barrier 막으로 사용하였다. 얼라인, 노광, 현상을 거쳐 Cr에칭, PR 제거후 ICP(inductively coupled plasma) 공정으로 Si deep etching하여 via 직경 $10.16{\mu}m$, 깊이 $102.5{\mu}m$의 고종횡비 비아를 형성하였다. 구리필링도금을 위해서 필수적인 seed layer는 단층 또는 다층의 금속막을 스퍼터링 법으로 형성하였다. 형성된 seed layer 단면을 FE-SEM(Field emission scanning electron microscope)으로 관찰하여 내부에 seed 층의 형성 유무를 확인하였다.

• 한국정보디스플레이학회:학술대회논문집
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• 2005.07a
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• pp.808-810
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• 2005

Inexpensive large area arrays of thin film transistors (TFTs) on flexible substrates will enable many new display products that cannot be cost effectively manufactured by conventional means. This paper presents a new approach for low cost manufacturing of electronic devices using roll-to-roll (R2R) processes exclusively. It was developed in partnership by Hewlett Packard Laboratories and Iowa Thin Film Technologies (ITFT), a solar cell manufacturer. The approach combines ITFT's unique processes for vacuum deposition and etching of semiconductors, dielectrics and metals on continuous plastic webs with a method HP has invented for the patterning and aligning the multiple layers of a TFT with sub-micron accuracy and feature size.

• Proceedings of the KIEE Conference
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• 1998.07e
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• pp.1752-1754
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• 1998

Recently the research about electron transport characteristic and energy distribute function in mixture gases within Helium, has been used and developed widely as industrial quality improvement of extinguish characteristic, electrical dielectric strength ability of application of each species high voltage apparatus, gas plasma etching progress of work to use manufacture of semiconductor, thin film molding by CVD, insulation film to use ultra LSI, etc. This paper analyze electron transport characteristic in the range E/N $1{\sim}60$[Td], pressure $0.1{\sim}6.0$[Torr] by MCS. It is necessary to seek electron drift velocity, diffusion coefficient, lonization coefficients, characteristic energy, mean energy and electron energy distribution function as electron transport characteristic.

• Journal of the Semiconductor & Display Technology
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• v.11 no.1
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• pp.61-65
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• 2012

In this study, for use of carbon nanotubes (CNTs) as a cold cathode of x-ray tubes, we examine the effects of selective growth of CNTs on their field emission properties and long-term stability. The selective growth of CNTs was performed by selectively etching the catalyst layer which was used for CNTs' nucleation. CNTs were grown on conical-type tungsten substrates using an inductively-coupled plasma chemical vapor deposition system. For all the grown CNTs, their morphologies and microstructures were analyzed by field-emission scanning electron microscope and Raman spectroscopy. The electron-emission properties of CNTs and the long-term stability of emission currents were measured and characterized according to the CNTs' growth position on the substrate.

• Korean Journal of Materials Research
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• v.3 no.5
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• pp.482-496
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• 1993

Radiation damage and contamination of silicons etched in the $CF_4+H_2$ and $CHF_3$ magnetron discharges have been characterized using Schottky diode characteristics, TEM, AES, and SIMS as a function of applied magnetic field strength. It turned out that, as the magnetic field strength increased, the radiation damage measured by cross sectional TEM and by leakage current of Schottky diodes decreased colse to that of wet dtched samples especially for $CF_4$ plasma etched samples, For $CF_4+H_2$and $CHF_3$ etched samples, hydrogen from the plasmas introduced extended defects to the silicon and this caused increased leakage current to the samples etched at low magnetic field strength conditions by hydrogen passivation. The thickness of polymer with the increasing magnetic field strength and showed the minimum polymer residue thickness near the 100Gauss where the silicon etch rate was maximum. Also, other contaminants such as target material were found to be minimum on the etched silicon surface near the highest etch rate condition.

• Journal of the Semiconductor & Display Technology
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• v.11 no.2
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• pp.71-74
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• 2012

Uniformity of the wafer temperature is one of the important factors in etching process. Plasma, chucking force, backside helium pressure and the surface temperature of ESC(electrostatic chuck) affect the wafer temperature. ESC consists of several layers of structure. Each layer has own thermal resistance and the Si-adhesive layer has highest thermal resistance among them. In this work, the temperature distribution of ESC was analyzed by 3-D FEM with various defects and the thickness deviation of the Si-adhesive layer. The result with Si-adhesive layer with the low center thickness deviation shows modified temperature distribution of ESC surface.

• Electronics and Telecommunications Trends
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• v.3 no.2
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• pp.56-60
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• 1988

반도체 가스의 순도에 따라 반도체 박막의 특성이 좌우되기 때문에 현재의 고순도 가스에서 초고순도 가스로 사용하여야 한다. 최근 반도체 공정기술은 화학증착법으로 많은 특수 가스를 사용하는데 이런 가스들은 사전에 가스에 대한 전문 지식과 기술을 충분히 이해한 다음 사용하여야만 고성능화 공정기술이 가능하다. 반도체용 가스는 회로의 집적도가 높아짐에 따라 요구되는 가스의 품질이 점점 고순도화되고 있다. 따라서 현 반도체 공정에 사용되는 가스 순도를 초고순도화 시켜야만 초고집적 소자인 4M DRAM, 16M DRAM, 64M DRAM 제품 개발 및 제조가 가능하다. 다시말해서 공정에 따른 주변조건이 이루어져야 만 반도체 산업이 크게 신장 할 수 있다. 최근 반도체 공정 기술로는 플라즈마(Plasma), 드라이에칭(Dry etching), CVD(Chemical Vapor Deposition), MOCVD(Metal Organic Chemical Vapor Deposition), Ion Implantation, EPI 공정으로 거의 대부분 공정 가스가 가연성, 폭발성, 독성, 부식성 이기 때문에 한번 취급을 잘못하면 막대한 인명 및 재산 피해를 입히므로 취급상 특별한 주의를 요하고 사전에 가스의 전문 지식과 기술을 충분히 이해한 다음 사용하여야 한다.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.05a
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• pp.255-258
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• 2002

In this study, $CeO_2$thin films were etched with an addition of $Cl_2$gas to $Ar/CF_4$gas mixing in an inductively coupled plasma(ICP) etcher. The surface reactions of the etched $_CeO2$thin films were investigated by X-ray photoelectron spectroscopy(XPS). It was analyzed that Ce peaks were mainly observed in Ce-O bonds formed $CeO_2$or $CeO_3$compounds. Cl peaks were detected by the peaks of Cl $2p_{3/2}$ and Cl $2p_{1/2}$. Almost all of Cl atoms were combined with Ce atoms like $CeCl_{x}$ compounds.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1997.11a
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• pp.413-417
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• 1997

In this study, chlorine(Cl)-based gas chemistry is generally used to etching for AlCu films metallization. The corrosion phenomena of AlCu films were examined with XPS (X-ray photoelectron spectroscopy), SEM (Scanning electron microscopy), and TEM (Transmission electron microscopy). SF$\sub$6/ plasma treatment subsequent to the etch process prevents the corrosion effectively in the pressure of 300 mTorr. It is found that the chlorine atoms on the etched surface are not substituted for fluorine atoms during SF$\sub$6/ treatment, but a passivation layer on the surface by fluorine-related compounds would be formed. The passivation layer prevents the moisture penetration on the SF$\sub$6/ treated surface and suppresses the corrosion successfully.