• Title/Summary/Keyword: PCB power-bus

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Correlated effects of decoupling capacitors and vias loaded in the PCB power-bus (PCB power-bus에 장하된, 결합제거 커패시터와 금속선의 상관관계적 영향 연구)

  • Kahng, Sung-Tek
    • Proceedings of the Korea Electromagnetic Engineering Society Conference
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    • 2005.11a
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    • pp.429-432
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    • 2005
  • This paper investigates how the PCB power-bus structure's characteristics are influenced by the loading of decoupling capacitors that are placed close to vias, on purpose or not. It is worthwhile to see the correlated effects of the aforementioned lumped elements in that when they inevitably share one DC power-bus they will result in positive or negative changes in the PCB EMC design. The EM fields and impedance profiles are rigously calculated on the PCB power-bus cases loaded with the above components and their effects will be given to bring better PCB EMC countermeasures.

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Correlated Effects of Decoupling Capacitors and Vias Loaded in the PCB Power-Bus (PCB Power-Bus에 장하된, 결합제거 커패시터와 금속선의 상관관계적 영향 연구)

  • Kahng, Sung-Tek
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.17 no.2 s.105
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    • pp.213-220
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    • 2006
  • This paper investigates how the PCB power-bus sturcture's characteristics are influenced by the loading of decoupling capacitors in conjunction to other lumped elements including vias. The fields and impedance profiles are rigously evaluated and analyzed on various cases loaded with the above components and their effects will be given to bring better PCB EMC countermeasurs.

A Study on the Radiated Emission from the DC Power-Bus for the PCB (PCB DC Power-Bus로부터의 전파 방사에 관한 연구)

  • Kahng, Sung-Tek
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.17 no.2 s.105
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    • pp.148-151
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    • 2006
  • The DC power-bus' resonance is frequently attributed to EMI sources in the PCBs. Subsequently, it will ruin the digital signal integrity within one system or between adjacent systems in the form of conducted or radiated emission. Hence, since it is of importance to examine the PCB's emission, this paper sheds a light on the radiated emission from the power-bus with regards to its resonance modes. A full-wave analysis method is used to calculate the impedance and radiated electric fields and is validated by physics and an EM analysis tool.

A study on the radiated emission from the DC power-bus for the PCB (PCB DC power-bus로부터의 전파방사에 관한 연구)

  • Kahng, Sung-Tek
    • Proceedings of the Korea Electromagnetic Engineering Society Conference
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    • 2005.11a
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    • pp.149-152
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    • 2005
  • The DC power-bus' resonance is frequently attributed to EMI sources in the PCBs. Subsequently, it will ruin the digital signal integrity within one system or between adjacent systems in the form of conducted or radiated emission. Hence, since it is of importance to examine the PCB's emission, this paper sheds a light on the radiated emission from the power-bus with regards to its resonance modes. A full-wave analysis method is used to calculate the impedance and radiated electric fields and is validated by physics and an EM analysis tool.

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Investigation of Power Bus Decoupling by the Screw Connection of the PCB to Chassis (나사를 이용한 기구물과 인쇄회로기판 연결이 전원단 잡음 감소에 미치는 영향 분석)

  • 권덕규;이신영;이해영;이재욱;배승민
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.13 no.10
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    • pp.1040-1047
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    • 2002
  • In this paper, we investigated noise decoupling on the power bus by the screw connection, used to the mechanical join and grounding of the PCB ground to chassis. The screw connection penetrates the power bus and then it affects noise propagation on the power bus. To verify effect of the screw connection, we compare bare board with board having screws connection with 0.5 mm separation between power bus and chassis. From these results, we observed that the power bus noise was decreased about 5 dB at the frequency range from 0.1 GHz to 1 GHz. Also, we verified that a 4-layer PCB with signal trace had the better signal quality up to 600 MHz by the screw connection. Therefore, these results will be useful in designing to the high speed circuit and chassis.

Prediction of the Radiated Emission(RE)s due to the PCB Power-Bus' Resonance Modes and Mitigation of the RE Levels

  • Kahng, Sung-Tek
    • Journal of electromagnetic engineering and science
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    • v.7 no.1
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    • pp.7-11
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    • 2007
  • PCB Power-Bus (comprising power/ground planes) impedance and fields are evaluated by an efficient series expansion method that is suggested in this paper. It is used to investigate the structure's radiated emission(RE) levels and find acceptable ways of loading the power/ground planes such as decoupling capcitor(DeCap)s, balanced feeding and slits, in order to reduce the interferences. Also, the calculations and measurements of a proposed geometry are verified by vector fitting as a analysis model to check the behavior of the slit.

Study on the Effect of Metal-Wall Loading on the DC Power-Bus

  • Kahng Sungtek
    • Journal of electromagnetic engineering and science
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    • v.5 no.4
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    • pp.193-196
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    • 2005
  • The DC power-bus for the PCB is loaded with metal walls on its selected sides and is characterized electromagnetically. This is a novel concept of approach to mitigate the spurious resonance and finally signal integrity problems. In particular, the peak at DC, which is always in the way to secure parallel-plates' EMC, can be completely removed by the proposed method. Through the findings of this study, the effect of metal-loading of the power-bus will be presented along with the impression that the suggested technique can tackle the headaches of signal integrity, ground bounce, EMIs.

Design Considerations on Partition of SOP, CMOS and PCB technologies for Mobile Display System Implementation

  • Lee, Seung-Yong;You, Jae-Hee
    • 한국정보디스플레이학회:학술대회논문집
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    • 2007.08a
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    • pp.798-801
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    • 2007
  • For lower power and smaller size with higher image quality, it is desirable to have more units integrated on a display panel. It needs careful design considerations in selecting CMOS, SOP or PCB. An experimental display system is designed and power and delay considering chip area, data rates and bus width are analyzed for all technology combinations to obtain optimum design methodologies.

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Wideband Suppression of Radiated Emissions from a Power Bus in High-Speed Printed Circuit Boards

  • Shim, Yujeong;Kim, Myunghoi
    • Journal of information and communication convergence engineering
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    • v.14 no.3
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    • pp.184-190
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    • 2016
  • We present experimental demonstrations of electromagnetic bandgap (EBG) structures for the wideband suppression of radiated emissions from a power bus in high-speed printed circuit boards (PCBs). In most of the PCB designs, a parallel plate waveguide (PPW) structure is employed for a power bus. This structure significantly produces the wideband-radiated emissions resulting from parallel plate modes. To suppress the parallel plate modes in the wideband frequency range, the power buses based on the electromagnetic bandgap structure with a defected ground structure (DGS) are presented. DGSs are applied to a metal plane that is connected to a rectangular EBG patch by using a via structure. The use of the DGS increases the characteristic impedance value of a unit cell, thereby substantially improving the suppression bandwidth of the radiated emissions. It is experimentally demonstrated that the DGS-EBG structure significantly mitigates the radiated emissions over the frequency range of 0.5 GHz to 2 GHz as compared to the PPW.

Fault Diagnosis of a Electrolytic Capacitor for Inverter DC-Link Voltage Smoothing (인버터 직류링크 전압 평활용 전해 커패시터의 고장 진단)

  • Lee, Kwang-Woon
    • The Transactions of the Korean Institute of Power Electronics
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    • v.12 no.5
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    • pp.372-377
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    • 2007
  • This paper proposes a novel fault diagnosis method of a electrolytic capacitor used for DC-link voltage smoothing in adjustable speed drives. The equivalent series resistance (ESR) of the electrolytic capacitor is directly estimated from DC-link voltage and load currents and the status of the electrolytic capacitor is determined from the estimated ESR. To compensate the variation of the ESR owing to temperature variation, diodes are located on the same PCB near the capacitor and the temperature of the capacitor is sensed indirectly from the voltage drop of diodes. Simulation and experimental studies show the effectiveness of the proposed method.