Correlated Effects of Decoupling Capacitors and Vias Loaded in the PCB Power-Bus

PCB Power-Bus에 장하된, 결합제거 커패시터와 금속선의 상관관계적 영향 연구

  • Kahng, Sung-Tek (Dept. of Information and Telecommunication Eng., University of Incheon)
  • 강승택 (인천대학교 정보통신공학과)
  • Published : 2006.02.01

Abstract

This paper investigates how the PCB power-bus sturcture's characteristics are influenced by the loading of decoupling capacitors in conjunction to other lumped elements including vias. The fields and impedance profiles are rigously evaluated and analyzed on various cases loaded with the above components and their effects will be given to bring better PCB EMC countermeasurs.

본 논문은 결합제거용 커패시터가 금속선을 포함한 타 집중 소자들과 함께 장하될 경우 PCB power-bus에 미치는 영향을 살펴본다. 향상된 PCB EMC 대책을 준비하는 일환으로 장하된 PCB power-bus 다양한 경우에 대해 전자장과 임피던스가 엄밀하게 계산되고 결과 분석이 이뤄진다.

Keywords

References

  1. S. Van den Berghe et al., 'Study of the ground bounce caused by power plane resonances', IEEE Trans. EMC, vol. 40, no. 2, pp. 111-119, May 1998
  2. J. Trinkle et al., 'Efficient impedance calculation of loaded power ground planes', in Proc. 15th Zurich Symp. EMC, Zurich, Switzerland, 18, pp. 285-290 Feb. 2003
  3. T. Okoshi, Planar Circuits for Microwaves and Lightwaves, Berlin, Germany: Springer-Verlag, 1985
  4. V. Ricchiuti, 'Supply decoupling on fully populated high-speed digital PCBs', IEEE Trans. EMC, vol. 43, pp. 671-676, Nov. 2001
  5. J. Fan et al., 'DC power-bus modelling and design with an MPIE formulation and circuit extraction', IEEE Trans. EMC, vol. 43, no. 2, pp. 426-436, May 2001
  6. X. Ye et al., 'DC power-bus design using FDTD modeling with dispersive media and surface mount technology', IEEE Trans. EMC, vol. 43, no. 4, pp. 579-587, Nov. 2001