• 한국기계가공학회지
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• 제14권4호
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• pp.151-159
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• 2015

In this study, we developed an automated contact-type thickness measurement machine that continuously and precisely measures the thickness of a PCB module product using multi-LVDT sensors. The system contains a measurement part to automatically measure the thickness in real time according to the set conditions with an alignment supply unit and unloading unit to separate OK and NG products. The sensors were calibrated before assembly in the measuring machine, and precision and accuracy performance tests were also performed to reduce uncertainty errors in the measurement machine. In the calibration test, the precision errors of the LVDT sensor were determined to be $1-3{\mu}m$ as 0.1% at the measuring range. A measurement error of 0.8 mm and 1.0 mm thickness test standards were found to be $1{\mu}m$ and $4{\mu}m$, and the standard deviations of two 1.0 mm products were measured as $14{\mu}m$ and $8{\mu}m$, respectively. In the measurement system analysis, the accuracies of test PCB standards were found to be $2{\mu}m$ and $3{\mu}m$, respectively. From the results of gage repeatability and reproducibility (R & R) crossed, we found that the machine is suitable for the measurement and process control in the mass production line as 7.92% of total gage R & R and in seven distinct categories. The maximum operating speed was limited at 13 pcs/min, showing a value good enough to measure.

• 한국생물공학회:학술대회논문집
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• 한국생물공학회 2004년도 학술대회지
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• pp.1-20
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• 2004

Polychlorinated biphenyls (PCBs), one a group of persistent and widespread environmental pollutants, have been considered to be involved in immunotoxicity, carcinogenesis, and apoptosis. However, the toxic effects and physical properties of a PCB congener are dependent on the structure. In the present study, we investigate the toxic effects and action mechanisms of PCBs In cells. Among the various congeners tested, 2,2',4,6,6'-PeCB-pentachlorobiphenyl (PeCB), a highly ortho-substituted congener having negligible binding affinity for aryl hydrocarbon receptor (AhR), caused the most potent toxicity and specific effects in several cell types. 2,2',4,6,6'-PeCB induced apoptotic cell death of human monocytic cells, suggesting that PCB-induced apoptosis may be linked to immunotoxicity. In addition, 2,2',4,6,6'-PeCB induced mitotic arrest by interfering with mitotic spindle assembly in NIH3T3 fibroblasts, followed by genetic instability which triggers p53 activation. Which suggests that 2,2',4,6,6'-PeCB may be involved in cancer development by causing genetic instability through mitotic spindle damage. On the other hand, 2,2',4,6,6'-PeCB increased cyclooxygenase-2 (COX-2) involved in cell survival through ERK1/2 MAPK and p53 in Rat-1 fibroblasts and mouse embryonic fibroblasts, triggering compensatory mechanism for abating its toxicity. Taken together, these results demonstrate that PCB congeners of different structure have distinct mechanism of action and 2,2',4,6,6'-PeCB causes several toxicity as well as compensatory mechanism in cells.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1991년도 하계학술대회 논문집
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• pp.47-50
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• 1991

LPM(Linear Pulse Motor) provide direct and precise position control of bidirectional linear motion. LPM is not subject to the same linear velocity and acceleration limitations inherent in systems converting rotary to linear motion such as lead screws, rack and pinion, belt and pulley drives. With LPM, all the thrust force generated by the motor is efficiently applied directly to the load. And speed, distance, and acceleration are easily programmed in a highly repeatable fashion. Potential industrial and application fields of LPM include PCB assembly, industrial sewing machines, automatic inspection, coil winder, medical uses, conveyer system, laser cut and trim systems, semiconductor wafer processing, OA instruments etc. This paper describes various design parameter of LPM such as magnetic ciucuit construction methods, phase number and tooth number per pole, permanent magnet and coil mmf, tooth geometries. And to solve the problems of existing control methods, in this paper, a new control method of the LPM is proposed throughout modern control theory.

• 한국재료학회지
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• 제17권2호
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• pp.81-85
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• 2007

Embedded capacitor technology can improve electrical perfomance and reduce assembly cost compared with traditional discrete capacitor technology. To improve the capacitance density of the $Al_2O_3$ based embedded capacitor on Cu cladded fiber reinforced plastics (FR-4), the specific surface area of the $Al_2O_3$ thin films was enlarged and their surface morphologies were controlled by anodization process parameters. From I-V characteristics, it was found that breakdown voltage and leakage current were 23 V and $1{\times}10^{-6}A/cm^2$ at 3.3 V, respectively. We have also measured C-V characteristics of $Pt/Al_2O_3/Al/Ti$ structure on CU/FR4. The capacitance density was $300nF/cm^2$ and the dielectric loss was 0.04. This nano-porous $Al_2O_3$ is a good material candidate for the embedded capacitor application for electronic products.

• 제어로봇시스템학회논문지
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• 제15권9호
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• pp.916-921
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• 2009

The technology to inspect and measure an inner structure of micro parts has become an important tool in the semi-conductor industrial field with the development of automation and precision manufacturing. Especially, the inspection skill on the inside of highly integrated electronic device becomes a key role in detecting defects of a completely assembled product. X-ray inspection technology has been focused as a main method to inspect the inside structure. However, there has been insufficient research done on the customized inspection technology for the flip-chip assembly due to the interior connecting part of flip chip which connects the die and PCB electrically through balls positioned on the die. In this study, therefore, it is implemented to detect shape error of flip chip bonding without damaging chips using an x-ray inspection system. At this time, it is able to monitor the solder bump shape by introducing an edge-extracting algorithm (exponential approximation function) according to the attenuating characteristic and detect shape error compared with CAD data. Additionally, the bonding error of solder bumps is automatically detectable by acquiring numerical size information at the extracted solder bump edges.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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• pp.431-432
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• 2012

In the era of 20 nm scaled semiconductor volume manufacturing, Microelectronics Manufacturing Engineering Education is presented in this paper. The purpose of microelectronic engineering education is to educate engineers to work in the semiconductor industry; it is therefore should be considered even before than technology development. Three Microelectronics Manufacturing Engineering related courses are introduced, and how undergraduate students acquired hands-on experience on Microelectronics fabrication and manufacturing. Conventionally employed wire bonding was recognized as not only an additional parasitic source in high-frequency mobile applications due to the increased inductance caused from the wiring loop, but also a huddle for minimizing IC packaging footprint. To alleviate the concerns, chip bumping technologies such as flip chip bumping and pillar bumping have been suggested as promising chip assembly methods to provide high-density interconnects and lower signal propagation delay [1,2]. Aluminum as metal interconnecting material over the decades in integrated circuits (ICs) manufacturing has been rapidly replaced with copper in majority IC products. A single copper metal layer with various test patterns of lines and vias and $400{\mu}m$ by $400{\mu}m$ interconnected pads are formed. Mask M1 allows metal interconnection patterns on 4" wafers with AZ1512 positive tone photoresist, and Cu/TiN/Ti layers are wet etched in two steps. We employed WPR, a thick patternable negative photoresist, manufactured by JSR Corp., which is specifically developed as dielectric material for multi- chip packaging (MCP) and package-on-package (PoP). Spin-coating at 1,000 rpm, i-line UV exposure, and 1 hour curing at $110^{\circ}C$ allows about $25{\mu}m$ thick passivation layer before performing wafer level soldering. Conventional Si3N4 passivation between Cu and WPR layer using plasma CVD can be an optional. To practice the board level flip chip assembly, individual students draw their own fan-outs of 40 rectangle pads using Eagle CAD, a free PCB artwork EDA. Individuals then transfer the test circuitry on a blank CCFL board followed by Cu etching and solder mask processes. Negative dry film resist (DFR), Accimage$^{(R)}$, manufactured by Kolon Industries, Inc., was used for solder resist for ball grid array (BGA). We demonstrated how Microelectronics Manufacturing Engineering education has been performed by presenting brief intermediate by-product from undergraduate and graduate students. Microelectronics Manufacturing Engineering, once again, is to educating engineers to actively work in the area of semiconductor manufacturing. Through one semester senior level hands-on laboratory course, participating students will have clearer understanding on microelectronics manufacturing and realized the importance of manufacturing yield in practice.

• 마이크로전자및패키징학회지
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• 제12권1호
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• pp.9-16
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• 2005

This paper presents the development of new anisotropic conductive adhesives with enhanced thermal conductivity for the wide use of adhesive flip chip technology with improved reliability under high current density condition. The continuing downscaling of structural profiles and increase in inter-connection density in flip chip packaging using ACAs has given rise to reliability problem under high current density. In detail, as the bump size is reduced, the current density through bump is also increased. This increased current density also causes new failure mechanism such as interface degradation due to inter-metallic compound formation and adhesive swelling due to high current stressing, especially in high current density interconnection, in which high junction temperature enhances such failure mechanism. Therefore, it is necessary for the ACA to become thermal transfer medium to improve the lifetime of ACA flip chip joint under high current stressing condition. We developed thermally conductive ACA of 0.63 W/m$\cdot$K thermal conductivity using the formulation incorporating $5 {\mu}m$ Ni and $0.2{\mu}m$ SiC-filled epoxy-bated binder system to achieve acceptable viscosity, curing property, and other thermo-mechanical properties such as low CTE and high modulus. The current carrying capability of ACA flip chip joints was improved up to 6.7 A by use of thermally conductive ACA compared to conventional ACA. Electrical reliability of thermally conductive ACA flip chip joint under current stressing condition was also improved showing stable electrical conductivity of flip chip joints. The high current carrying capability and improved electrical reliability of thermally conductive ACA flip chip joint under current stressing test is mainly due to the effective heat dissipation by thermally conductive adhesive around Au stud bumps/ACA/PCB pads structure.

• 한국정보처리학회논문지
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• 제7권1호
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• pp.135-145
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• 2000

MMS(Manufacturing Message Specification)는 PLC, NC, 로봇 등과 같이 서로 다른 제조회사의 서로 다른 단위제어기기 제품들간에 통신할 수 있는 ISO/IEC 9506으로 표준화된 공장자동호용 프로토콜이며 OSI 참조 모델의 최상위 층인 응용계층 프로토콜에 해당된다. 본 논문은 MMS를 TCP/IP상에서 동작할 수 있도록 유닉스 환경에서 ASNSI-C 언어로 구현하고, 이 구현된 프로토콜을 JNI(Java Native Interface)를 이용해 JAVA 클래스화한다. JAVA 클래스화함으로써 기존에 제공되는 MMS 라이브러리를 이용하는데 있어 표준화되지 않은 서로 다른 API를 이용하는데 어려움과 GUI를 구현하는데 어려움을 극복하는 기본을 제공한다. 그리고 구현된 JAVA 클래스화된 MMS 라이브러리를 인터넷의 WWW상에서 동작시킬 수 있도록 자동화된 PCB(Printed Circuit Board) 조립라인을 대상 모델로 선정하여 응용 프로그램을 작성하여 구현된 JNI를 이용한 MMS가 인터넷상에서 동작하여 사용자에게 일괄성있는 인터페이스를 제공하는 웹 브라우저를 통해 RMD(Real Manufacturing Device)를 동작${\cdot}$제어${\cdot}$감시할 수 있음을 보여준다.

• 한국전자파학회논문지
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• 제22권3호
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• pp.371-379
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• 2011

최근의 다기능 레이더는 능동 위상 배열 안테나 구조를 이용하고 있다. 열약한 클러터 환경에서 표적을 탐지하기 위해서는 레이더 수신기의 동적 영역이 커야 한다. 능동 위상 배열 안테나 구조를 이용한 구조의 레이더는 SNR(Signal-to-Noise Ratio)를 향상시키지만, SFDR(Spurious Free Dynamic Range)은 개선되지 않는다. 본 논문에서는 높은 SFDR을 갖는 X-밴드 능동 위상 배열 레이더의 다채널 디지털 수신기를 설계하고 제작하였다. 32개의 T/R(Transmit/Receive) 모듈이 한 채널의 디지털 수신기와 연결되어 있다. 디지털 수신기내에 RF부, ADC부, 로컬 분배부 및 디지털 하향변환부가 존재하고, 한 개의 조립체 내에 2채널의 디지털 수신기가 포함되어 있다. 상용 FIFO 보드를 이용하여, 디지털 출력 신호에 대해, 디지털 수신기 주요 특성을 측정하였다. 제작된 디지털 수신기의 이득은 33 dB이고, SFDR은 81 dBc 이상이다.