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http://dx.doi.org/10.14775/ksmpe.2015.14.4.151

Development of Contact-Type Thickness Measurement Machine using LVDT Sensors  

Shin, Ki-Yeol (School of Mechanical Engineering, Yeungnam UNIV.)
Hwang, Seon (School of Mechanical Engineering, Yeungnam UNIV.)
Publication Information
Journal of the Korean Society of Manufacturing Process Engineers / v.14, no.4, 2015 , pp. 151-159 More about this Journal
Abstract
In this study, we developed an automated contact-type thickness measurement machine that continuously and precisely measures the thickness of a PCB module product using multi-LVDT sensors. The system contains a measurement part to automatically measure the thickness in real time according to the set conditions with an alignment supply unit and unloading unit to separate OK and NG products. The sensors were calibrated before assembly in the measuring machine, and precision and accuracy performance tests were also performed to reduce uncertainty errors in the measurement machine. In the calibration test, the precision errors of the LVDT sensor were determined to be $1-3{\mu}m$ as 0.1% at the measuring range. A measurement error of 0.8 mm and 1.0 mm thickness test standards were found to be $1{\mu}m$ and $4{\mu}m$, and the standard deviations of two 1.0 mm products were measured as $14{\mu}m$ and $8{\mu}m$, respectively. In the measurement system analysis, the accuracies of test PCB standards were found to be $2{\mu}m$ and $3{\mu}m$, respectively. From the results of gage repeatability and reproducibility (R & R) crossed, we found that the machine is suitable for the measurement and process control in the mass production line as 7.92% of total gage R & R and in seven distinct categories. The maximum operating speed was limited at 13 pcs/min, showing a value good enough to measure.
Keywords
Thickness Measurement; Contact Type; LVDT Sensor; Measurement System Analysis; Printed Circuit Board;
Citations & Related Records
Times Cited By KSCI : 5  (Citation Analysis)
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