• Title/Summary/Keyword: PCB Module

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Broadband power amplifier design utilizing RF transformer (RF 트랜스포머를 사용한 광대역 전력증폭기 설계)

  • Kim, Ukhyun;Woo, Jewook;Jeon, Jooyoung
    • Journal of IKEEE
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    • v.26 no.3
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    • pp.456-461
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    • 2022
  • In this paper, a two-stage single-ended power amplifier (PA) with broadband gain characteristics was presented by utilizing a radio frequency (RF) transformer (TF), which is essential for a differential amplifier. The bandwidth of a PA can be improved by designing TF to have broadband characteristics and then applying it to the inter-stage matching network (IMN) of a PA. For broadband gain characteristics while maintaining the performance and area of the existing PA, an IMN was implemented on an monolithic microwave integrated circuit (MMIC) and a multi-layer printed circuit board (PCB), and the simulation results were compared. As a result of simulating the PA module designed using InGaP/GaAs HBT model, it has been confirmed that the PA employing the proposed design method has an improved fractional bandwidth of 19.8% at a center frequency of 3.3GHz, while the conventional PA showed that of 11.2%.

Development and Performance Test of Preamplifier and Amplifier for Gamma Probe (감마프로브용 전단증폭기와 주증폭기의 개발과 성능 평가)

  • Bong, Jung-Kyun;Kim, Hee-Joung;Lee, Jong-Doo;Kwon, Soo-Il
    • The Korean Journal of Nuclear Medicine
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    • v.33 no.1
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    • pp.100-109
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    • 1999
  • Purpose: Preamplifier and amplifier are very important parts for developing a portable counting or imaging gamma probe. They can be used for analyzing pulses containing energy and position information for the emitted radiations. The commercial Nuclear Instrument Modules (NIMs) can be used for processing these pulses. However, it may be improper to use NIMs in developing a portable gamma probe, because of its size and high price. The purpose of this study was to develop both preamplifier and amplifier and measure their performance characteristics. Materials and Methods: The preamplifier and amplifier were designed as a charge sensitive device and a capacitor resistor-resistor capacitor (CR-RC) electronic circuit, respectively, and they were mounted on a print circuit board (PCB). We acquired and analyzed energy spectra for Tc-99m and Cs-137 using both PCB and NIMs. Multichannel analyzer (Accuspec/A, Canberra Industries Inc., Meriden Connecticut, U.S.A) and scintillation detectors (EP-047(Bicron Saint-Gobain/Norton Industrial EP-047 (Ceramics Co., Ohio, U.S.A) with $2"{\times}2"$ NaI(T1) crystal and R1535 (Hamamatsu Photonics K.K., Electron Tube Center, Shizuoka-ken, Japan) with $1"{\times}1"$ NaI(T1) crystal were used for acquiring the energy spectra. Results: Using PCB, energy resolutions of EP-047 detectors for Tc-99m and Cs-137 were 12.92% and 5.01%, respectively, whereas R1535 showed 13.75% and 5.19% of energy resolution. Using the NIM devices, energy resolutions of EP-047 detector for Tc-99m and Cs-137 were measured as 14.6% and 7.58%, respectively. However, reliable energy spectrum of R1535 detector could not be acquired, since its photomultiplier tube (PMT) requires a specific type of preamplifier. Conclusion: We developed a special preamplifier and amplifier suitable for a small sized gamma probe that showed good energy resolutions independent of PMT types. The results indicate that the PCB can be used in developing both counting and imaging gamma probe.

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High-Efficiency CMOS Power Amplifier using Low-Loss PCB Balun with Second Harmonic Impedance Matching (2차 고조파 정합 네트워크를 포함하는 저손실 PCB 발룬을 이용한 고효율 CMOS 전력증폭기)

  • Kim, Hyungyu;Lim, Wonseob;Kang, Hyunuk;Lee, Wooseok;Oh, Sungjae;Oh, Hansik;Yang, Youngoo
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.30 no.2
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    • pp.104-110
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    • 2019
  • In this paper, a complementary metal oxide semiconductor(CMOS) power amplifier(PA) integrated circuit operating in the 900 MHz band for long-term evolution(LTE) communication systems is presented. The output matching network based on a transformer was implemented on a printed circuit board for low loss. Simultaneously, to achieve high efficiency of the PA, the second harmonic impedances are controlled. The CMOS PA was fabricated using a $0.18{\mu}m$ CMOS process and measured using an LTE uplink signal with a bandwidth of 10 MHz and peak to average power ratio of 7.2 dB for verification. The implemented CMOS PA module exhibits a power gain of 24.4 dB, power-added efficiency of 34.2%, and an adjacent channel leakage ratio of -30.1 dBc at an average output power level of 24.3 dBm.

Implementation of High-Power PM Diode Switch Modules and High-Speed Switch Driver Circuits for Wibro Base Stations (와이브로 기지국 시스템을 위한 고전력 PIN 다이오드 스위치 모듈과 고속 스위치 구동회로의 구현)

  • Kim, Dong-Wook;Kim, Kyeong-Hak;Kim, Bo-Bae
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.18 no.4 s.119
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    • pp.364-371
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    • 2007
  • In this paper, the design and implementation of high-power PIN diode switch modules and high-speed switch driver circuits are presented for Wibro base stations. To prevent isolation degradation due to parasitic inductances of conventional packaged PIN diodes and to improve power handling capabilities of the switch modules, bare diode chips are used and carefully placed in a PCB layout, which makes bonding wire inductances to be absorbed in the impedance of a transmission line. The switch module is designed and implemented to have a maximum performance while using a minimum number of the diodes. It shows an insertion loss of ${\sim}0.84\;dB$ and isolation of 80 dB or more at 2.35 GHz. The switch driver circuit is also fabricated and measured to have a switching speed of ${\sim}200\;nsec$. The power handling capability test demonstrates that the module operates normally even under a digitally modulated 70 W RF signal stress.

Study of a Low-Temperature Bonding Process for a Next-Generation Flexible Display Module Using Transverse Ultrasound (횡 초음파를 이용한 차세대 플렉시블 디스플레이 모듈 저온 접합 공정 연구)

  • Ji, Myeong-Gu;Song, Chun-Sam;Kim, Joo-Hyun;Kim, Jong-Hyeong
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.36 no.4
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    • pp.395-403
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    • 2012
  • This is direct bonding many of the metal bumps between FPCB and HPCB substrate. By using an ultrasonic horn mounted on an ultrasonic bonding machine, it is possible to bond gold pads onto the FPCB and HPCB at room temperature without an adhesive like ACA or NCA and high heat and solder. This ultrasonic bonding technology minimizes damage to the material. The process conditions evaluated for obtaining a greater bonding strength than 0.6 kgf, which is commercially required, were 40 kHz of frequency; 0.6MPa of bonding pressure; and 0.5, 1.0, 1.5, and 2.0 s of bonding time. The peel off test was performed for evaluating bonding strength, which was found to be more than 0.80 kgf.

A Study on the Design of Meander Slot Antenna for the Zigbee Module and Improvement of Its Return Loss (지그비 모듈용 미앤더 슬롯 안테나 설계 및 반사손실 개선에 관한 연구)

  • Lee, Young-Soon;Kim, Ui-Jung;Kim, Byoung-Sam;Jang, Bong-Ki
    • Journal of Navigation and Port Research
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    • v.34 no.3
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    • pp.167-173
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    • 2010
  • In order to design small printed antenna restricted within narrow area of $30mm{\times}8mm$ for the Zigbee module and improve its return loss, meander slot antenna with a floating conductor as the parastic element has been proposed. The resonant frequency and bandwidth(VSWR${\leq}$2) of the antenna designed and fabricated in the present study is about 2.44GHz and 113MHz respectively. The radiation pattern is almost similar to that of dipole antenna within the operation frequency range. Also the radiation efficiency and gain of the proposed antenna is more than 60% and 2.7dBi respectively. It has been observed that the characteristics the proposed antenna mentioned above satisfy the specification required of the Zigbee application. In order to validate the proposed antenna, some simulated and measured results are presented and compared.

Development of 2-kW Class C Amplifier Using GaN High Electron Mobility Transistors for S-band Military Radars (S대역 군사 레이더용 2kW급 GaN HEMT 증폭기 개발)

  • Kim, Si-Ok;Choi, Gil-Wong;Yoo, Young-Geun;Lim, Byeong-Ok;Kim, Dong-Gil;Kim, Heung-Geun
    • The Journal of the Korea institute of electronic communication sciences
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    • v.15 no.3
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    • pp.421-432
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    • 2020
  • This paper proposes a 2-kW solid-state power amplifier (SSPA) developed by employing power amplifier pallets designed using gallium-nitride high electron mobility transistors, which is used in S-band military radars and to replace existing traveling-wave tube amplifier (TWTA). The SSPA consists of a high-power amplifier module, which combines eight power amplifier pallets, a drive amplifier module, a digital control module, and a power supply unit. First, the amplifier module and component were integrated into a small package to account for space limitations; next, an on-board harmonic filter was fabricated to reject spurious components; and finally, an auto gain control system was designed for various duty ratios because recent military radar systems are all active phase radars using the pulse operation mode. The developed SSPA exhibited a max gain of 48 dB and an output power ranging between 63-63.6 dBm at a frequency band of 3.1 to 3.5 GHz. The auto gain control function showed that the output power is regulated around 63 dBm despite the fluctuation of the input power from 15-20 dBm. Finally, reliability of the developed system was verified through a temperature environment test for nine hours at high (55 ℃) / low (-40℃) temperature profile in accordance with military standard 810. The developed SSPA show better performance such as light weight, high output, high gain, various safety function, low repair cost and short repair time than existing TWTA.

Design and Implementation of Mobile Phone Interface Module for DGPS Correction Message Transmission (DGPS 보정신호 전송을 위한 휴대전화 인터페이스 모듈의 설계 및 구현)

  • Yi, Jae-hoon;Kim, Chang-Soo;Jeong, Seong-Hoon;Lee, Tae-Oh;Yun, Hee-Chul;Yim, Jae-Hong
    • Journal of Navigation and Port Research
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    • v.26 no.4
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    • pp.419-426
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    • 2002
  • The conventional RTK-GPS technique has many problems which are permission using RF wireless modem, influence of geographic obstacle using radio wave, frequency interference, finiteness of frequency resources. To solve these problems, in this paper, we designed the DGPS correction message transmission system as a method to substitute the RF wireless modem of RTK-DGPS receiver. Then the interface module was designed and implemented for linkage of GPS receiver and mobile phone. As a result worked differential surveying using receiving correction message using RS-232C and communication control, users of mobile station were worked differential surveying correction between mobile phones. Interface module system was received the same result of precision which was compared RF wireless modem system.

Electrical Characterization of BGA interconnection for RF packaging (Radio Frequency 회로 모듈 BGA 패키지)

  • Kim, Dong-Young;Woo, Sang-Hyun;Choi, Soon-Shin;Jee, Yong
    • Proceedings of the IEEK Conference
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    • 2000.06b
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    • pp.96-99
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    • 2000
  • We presents a BGA(Ball Grid Array) package for RF circuit modules and extracted its electrical parameters. We constructed a BGA package of ITS(Intelligent Transportation System) RF module and examined electrical parameters with a HP5475A TDR(Time Domain Reflectometry) equipment and compared its electrical parasitic parameters with PCB RF circuits. With a BGA substrate of 3 $\times$ 3 input and output terminals, we have found that self capacitance of BGA solder ball is 68.6fF, self inductance 146pH, mutual capacitance 10.9fF and mutual inductance 16.9pH. S parameter measurement with a HP4396B Network Analyzer showed the resonance frequency of 1.55㎓ and the loss of 0.26dB. Thus, we may improve electrical performance when we use BGA package structures in the design of RF circuit modules.

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Design and Implementation of Down-Converter for WCDMA Digital Optic Repeater (WCDMA 디지털 광 중계기용 Down-Converter 설계 및 제작)

  • 김성수;강원구;장인봉;양승인
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.14 no.9
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    • pp.974-978
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    • 2003
  • The down-converter of the WCDMA Digital Optic Repeater is developed. Based on the system specifications, the structure of the down-converter is accomplished and its block diagram is drawn. The down-converter is implemented according to these block diagrams. Subsequently a low pass filter, an automatic level controlled attenuator, a frequency synthesizer and other components for the down-converter are designed and implemented, and a main board to integrate these modules is also manufactured. To reduce the noise floor of system and suppress the RF spurious noise, a PCB layout is performed carefully. For each module consisting of the down-converter and the entire system, the performance tests are accomplished to check the performance about the specifications.