• Proceedings of the Korea Contents Association Conference
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• 2005.11a
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• pp.393-397
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• 2005

In this paper, we constructed data transformation system because data designed in CAD is not portable in PCB product line. interface for the automation of PCB product. To do this, we analyze the information of PCB components and construct the information of It components. We also developed two kinds of algorithm; one is to detect human error and another is to exchange itself for the data which is suitable for PCB assembly line. Also our system is compared with existing systems.

• 제어로봇시스템학회:학술대회논문집
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• 2000.10a
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• pp.302-302
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• 2000

This paper presents the measurement and correction of PCB alignment errors for PCB-manufacturing machines. The conventional PCB-manufacturing machine doesn't have enough accuracy to accommodate the demand for high-resolution circuit pattern and high-density mounting capacity of electronic chips. It is because of alignment errors of PCB loaded to the PCB-manufacturing machine. Therefore, this study focuses on the development of the system which is able to measure and correct alignment errors whit high-accuracy. An automatic optical inspection part measures the PCB alignment error using two cameras, and the high-accuracy 3-axis stage makes correct of these error. The operating system is run in the environment of Window 98 (or NT). Finally we implemented this system to PCB screen printer and PCB exposure system.

• The Journal of Information Technology
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• v.3 no.4
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• pp.13-21
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• 2000

The thesis is for the analysis of the current trend adapted for the method of the test information exchange in the environment of the internal circuit in case of PCB design, The design process is most powerful for improving test characteristics among the entire process of PCB. The PCB is more and more difficult to test as the processes proceed because the nodes become more and more complicated. The data exchange for improving PCB test performance should be easy in order to provide more reliable products in the shorter period. The design technology oriented for the test makes the PCB and its components tested reliably and quickly so that it can effectively improve the quality of the PCB and largely reduce the time and cost of the test development, In addition it can make the substantial standardization In improve the speed of the repeated test and treatment so that the Period of development can be shorter. Also, it helps to effectively detect the potential defects of the products, so that highly reliable PCB can be produced.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.4
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• pp.31-39
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• 2021

In this paper, warpage analysis that separates PCB for PoP (Package on Package) into unit and substrate using FEM (Finite Element Method), analysis of the effect of layer thickness on warpage, and SN (Signal-to-Noise) ratio by Taguchi method was carried. According to the analysis result, the contribution of the circuit layer on warpage was very high in the unit PCB, and the contribution of the outer layer was particularly high. On the other hand, the substrate PCB had a high influence of the circuit layer on warpage, but it was relatively low compared to the unit PCB, and the influence of the solder resist was rather increased. Therefore, considering the unit PCB and the substrate PCB at the same time, it is desirable to design the PCB for PoP layer-by-layer structure so that the outer and inner circuit layers are thick, the top solder resist is thin, and the thickness of the bottom solder resist is between 5 ㎛ and 25 ㎛.

• Environmental Analysis Health and Toxicology
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• v.4 no.1_2
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• pp.11-17
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• 1989

A quantitative analytical method of highly concentrated PCB is established in the research. With the quantitative analytical method PCB of insulating oil was examined. The following conclusions are derived from this research. 1. The recovery ratio was 95.7% with the quantitative analytical method, which indicates it can be used for the analysis of PCB. 2. PCB concentration of insulation oil in waste condenser was found to be 21.2% thru 13.85% , which was highly concentrated. 3. PCB insulation oil in waste condenser was same as PCB-42.

• Applied Chemistry for Engineering
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• v.4 no.4
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• pp.746-752
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• 1993

Quantitative measurements have been made by using equilibrium dialysis techniques on the extent of complexation between PCB and dissoved humic acid(HA). This research investigates the effectiveness of activated carbon adsorption for the removal of PCB from organic free water and humid acid background solution by using bench-scale equilibrium and rate tests. It was found that the extent of complexation depended on the pH, calcium concentration, ionic strength, and the concentration of humic acid. When HA was present, activated carbon capacity was greatly reduced due to complexation and competitive adsorption effects and the adsorption characteristics became complicated by the presence of various species such as the unassociated HA, PCB, and PCB-HA complexes.

• Korean Journal of Computational Design and Engineering
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• v.9 no.4
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• pp.416-424
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• 2004

In this paper, the heat transfer analysis and thermal stress analysis of the PCB(Printed Circuit Board) equipped in electronic Packages are carried out for various may types of chips on the PCB. And two structural PCB models are used in the analyses. The electronic chips on the PCB usually emit heat and this heat generates the thermal stress around the chip. The thermal load due to the heat generation of chips on the PCB may cause the malfunction of the electronic packages such as a monitor. a computer etc. Hence, the PCB should be designed to withstand these thermal loads. In this paper, the heat transfer analysis and thermal stress analysis are executed for the PCB model with pins and the analysis results are compared with the results for the PCB model without pins. The analysis results show that the PCB model without pins is not good for the thermal stress analysis of PCB, even though these two models have similar heat transfer characteristics. The analysis results also show that the highest thermal stress occurs in the pin especially attached to the highest temperature chip, and the PCB constrained to the electronic package on the long side is structurally more stable than other cases. The analyses of the PCB are executed using the finite element analysis code, NISA.

• Asia-Pacific Journal of Business Venturing and Entrepreneurship
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• v.8 no.4
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• pp.57-66
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• 2013

Domestic PCB industry formed by orders of demand companies is extremely vulnerable in its innovation infrastructure including high value-added technology development and information exchange. The majority of PCB products produced in the country relies on the imports from abroad and it causes its vulnerability to external market changes. Due to the negative perceptions about the industry (e.g., 3D job), low treatment (especially SMEs) and expertise employment avoidance in PCB industry, the job market conditions of PCB industry is not so good. In these circumstances, the PCB industry is completely dependent on the demand market such as cellular phones, and tablet PC, and as a result the responsiveness of PCB industry to the changes in demand market is also vulnerable. In this PCB industry, Korean government is trying to build the research infrastructure for PCB industry that realizes the sharing of information among companiesthrough the operation of the PCB industry innovation forum (information innovation), builds SME suppot platform and supports quality improvement (technology innovation), and supports enterprise collaboration processes (material-process-equipment) utilizing PCM open laboratory. The PCB industry technology infratstructure project is going to be promoted by the government(1.3 billion won, each year) and the private investmen(434 million won each year) from 2013 to 2017(5 years project)(table 1). This study analyzes the feasibility of the project, by using the AHP analysis and the results shows that this project is considered feasible because the AHP overall score is evaluated as 0.841, the overall score is greater than or equal to 0.55.

• The Korean Journal of Pesticide Science
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• v.20 no.3
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• pp.203-210
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• 2016

Polychlorinated biphenyls (PCBs) are ubiquitous environmental contaminants, found in the many environments. PCBs exerts various toxicological effects, including endocrine-disrupting activity. Most researches with these toxicants performed with soil matrix with mixtures of congeners, namely Aroclor, while the biological activities have been tested with animals. However, studies with pure congeners are limited. In this study, 5 congeners were synthesized and their fates (bioaccumulation, degradation, kinetics) were studied in carrot-soil system. The soil half-lives of biphenyl, PCB-1, PCB-3, PCB-77, and PCB-126 were 20.2, 16.0, 11.6, 46.5, 198.0 days, respectively. In general, the longer half-lives were observed with the higher hydrophoicity of PCBs. Times, required for maxium accumulation of PCBs in carrot (Tmax) were 10-20 days for most congeners and the concentrations were 0.4-2.6 mg/kg. The concentrations of PCBs in carrot were kept as constant after Tmax, except PCB-126. The concentration ratio between carrot and soil after 90 days of treatment were 1.7, 8.1, 1.9, 1.8, and 5.9 for biphenyl, PCB-1, PCB-3, PCB-77, and PCB-126. Because of the increase of biomass, the total residual amount of PCBs in carrots however, increased till the end of experiment. The portions of PCB-126 in carrot were 1.1% of the soil residues at 90 days after planting.

• Korean Journal of Fisheries and Aquatic Sciences
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• v.31 no.1
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• pp.95-103
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• 1998

Acute and chronic responses to PCB toxicity of Neomysis awatschensis were studied by measurement of bioassay, growth, oxygen consumption and nitrogen excretion with concentrations of PCB at 10 and $20^{\circ}C$. 96 hr.-$LC_50$ at 10 and $20^{\circ}C$ were 28.7492 pub and 10.6742 pub, respectively. Survival rates during 60 days exposured to chronic PCB concentrations of 0.5 pub, 1.0 pub, 1.5 pub and 2,0 pub at $10^{\circ}C$ were $85\%,\;80\%,\;75\%$ and $75\%$, respectively and suwival rates at $20^{\circ}C$ $85\%,\;75\%,\;75\%$ and $65\%$, respectively. Average daily growth rate of N. awatschensis exposed to chronic PCB concentrations at $10^{\circ}C$ were 0.039 mm/day in control group and 0.036 mm/day at concentration of 2.0 ppb, while their rates at $20^{\circ}C$ showed 0.072 mm/day in central group and 0.039 mm/day at 2,0 ppb. The growth factors were some similarities between the chronic PCB concentrations, but intermolt periods were related to body size of mysids, temperature and PCB toxicity. Changes in oxygen consumption and nitrogen excretion rates during 60 days exposure to PCB toxicity showed higher in high groups of PCB concentrations. Assimilation and feeding rates of N. awatschensis fed Artemia sp. decreased with increase of PCB concentration at 10 and $20^{\circ}C$.