• Proceedings of the Korean Society of Precision Engineering Conference
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• 2011.06a
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• pp.1009-1010
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• 2011

• Journal of the Korea Academia-Industrial cooperation Society
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• v.16 no.6
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• pp.3667-3671
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• 2015

Through experiment that does not cause wrinkles in the forming process for the primary purpose for install PCB(Printed circuit board) the thickness variation of the material was investigated. Experimental results was showed that the forming height of the first process had Influence Material thickness variation in the second process, in the first process, the Entrance corner of the die must have round of the product height of 50%, and The height of forming should be as high as the thickness of the material than the original forming. Also as do implement the forming shape in the first process, the thickness of the material is thinned to 85%, Restriking in the second process was that The thickness of the material is thinned to 80%. Therefore, In order to implement a precise shape, Thinking that the material thinning, The die was maintain the shape of the original product, and It was obtain the effect of the compression that the punch is to be longer, as the sum of more than 20% of the material thickness in the depth of the original product.

• Proceedings of the KWS Conference
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• 2006.10a
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• pp.136-138
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• 2006

Recently a lots of problems have observed in high densified and high integrated electronic components. One of them is ion migration phenomena, which induce the electrical short of electrical circuit. Ion migration phenomena has been observed in the field of exposing the specific environment and using for a long time. Also as the RoHS restriction was started in July 1st, 2006, Pb-free solder was utilized in electronics assemblies. In this case, it is very important to compatible between components and printed circuit board(PCB), thus surface treatment materials of PCB was changed to Sn, Sn-3.0Ag-0.5Cu, Cu. Therefore these new application become to need to reevaluate the sensitivity about electrochemical ion migration. This study was evaluated the occurrence time of electrochemical ion migration using by water drop test. We utilized PCB(printed circuit board) having a comb pattern as follows 0.1, 0.318, 0.5, 1.0 mm pattern distance. Sn-3.0Ag-0.5Cu and Sn-37Pb were electroplated on the comb pattern. 6.5V and 15.0V were applied in the comb pattern and then we measured the electrical short time causing by occurring the ion migration. In these results, we evaluate the sensitivity and derived the prediction models of ion migration occurrence time depending on the pattern materials, applied voltage and pattern spacing of PCB conductor.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 1999.11a
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• pp.7-10
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• 1999

• Journal of electromagnetic engineering and science
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• v.14 no.1
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• pp.43-45
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• 2014

We propose a printed circuit board (PCB)-embedded antenna for millimeter-wave chip-to-chip communication. The antenna is 0.18 mm in height which is 1/20 wavelength at 80 GHz. In order to realize such a low profile, a zeroth-order resonator antenna with a periodic array of four unit cells is employed, and its geometry is optimized to cover an 8-GHz bandwidth from 76 to 84 GHz. With this;the antenna is capable of radiating in a direction parallel to the board length despite the short distance between the ground and the radiator. Simulation and measurement results show that the optimized design has low reflection coefficients and consistent radiation patterns throughout the target bandwidth.

• Journal of Korean Society of Industrial and Systems Engineering
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• v.20 no.41
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• pp.177-188
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• 1997

This study describes the important information for establishing Human Computer Interface System for solving the large scale Traveling Saleman Problem in Printed Circuit Board production. Appropriate types and sizes of partitioning of large scale problems are discussed. Optimal tours for the special patterns appeared in PCB's are given. The comparision of optimal solutions of non-Euclidean problems and Euclidean problems shows the possibilities of using human interface in solving the Chebyshev TSP. Algorithm for the large scale problem using described information and coputational result of the practical problem are given.

• 한국전기화학회:학술대회논문집
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• 2005.07a
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• pp.209-212
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• 2005

• Journal of Institute of Control, Robotics and Systems
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• v.6 no.6
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• pp.506-513
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• 2000

This paper proposes a path planning algorithm for dispensers to increase the productivity in printed circuit board assembly lines. We analyze the assembly sequence of the dispenser, and formulate it as an integer programming problem. The mathematical formulation can accomodate multiple heads and different types of heads through extended cost matrix. The TSP algorithms are then applied to the formulated problem to find the near-optimal solution. Simulation results are presented to verify the usefulness of the proposed scheme.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 1992.10a
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• pp.141-146
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• 1992

본 연구에서는 먼저 낙하 충격을 받는 전자 제품을 수학적인 모델링을 행하 므로서 낙하 충격시 제품이 받게되는 충격력을 정량화하였고, 전자 제품내 많은 부품들의 낙하충격에 대한 동특성해석의 일환으로 핵심 부품인 PCB(printed circuit board)를 해석하였다. PCB 해석을 위하여 유한요소법을 사용하였고, PCB에 작용하는 half-sine pulse의 속도 변화에 다른 가속도 응 답 및 최대 충격가속도, 주기의 변화에 다른 PCB의 가속도 응답을 해석하였 다. 제시된 해석 기법은 낙하충격에 대비한 적절한 electric component의 layout및 최적의 PCB 취부조건등의 결정을 가능케 함으로써, 설계단계에서 낙하 충격을 고려한 PCB설계가 될 수 있도록 그 활용 방안을 제시하였고 반복된 낙하충격 실험을 줄일 수 있으므로 경비 절감 및 개발 소요기간도 절감할 수 있다.

• Aerospace Engineering and Technology
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• v.4 no.2
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• pp.203-208
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• 2005

Electronic components for space launch vehicles are exposed to a severe vibrational environment at launch and flight. The structural reliability of each component can be verified using mathematical approaches. In order to verify the structural reliability, an important parameter is the natural frequency of PCB(Printed Circuit Board) assembly mounted electronic components on and housing mounted PCB assembly in. In this paper, in order to find natural frequencies of PCB assemblies and the housing of hydrazine TCU(Thruster Control Unit), FEM(Finite Element Method) is adapted. The analytical result of FEM is verified by experimental method.