• Title/Summary/Keyword: Oxide Deposition

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Electrical Characteristic of IGZO Oxide TFTs with 3 Layer Gate Insulator

  • Lim, Sang Chul;Koo, Jae Bon;Park, Chan Woo;Jung, Soon-Won;Na, Bock Soon;Lee, Sang Seok;Cho, Kyoung Ik;Chu, Hye Yong
    • Proceedings of the Korean Vacuum Society Conference
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    • 2014.02a
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    • pp.344-344
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    • 2014
  • Transparent amorphous oxide semiconductors such as a In-Ga-Zn-O (a-IGZO) have advantages for large area electronic devices; e.g., uniform deposition at a large area, optical transparency, a smooth surface, and large electron mobility >10 cm2/Vs, which is more than an order of magnitude larger than that of hydrogen amorphous silicon (a-Si;H).1) Thin film transistors (TFTs) that employ amorphous oxide semiconductors such as ZnO, In-Ga-Zn-O, or Hf-In-Zn-O (HIZO) are currently subject of intensive study owing to their high potential for application in flat panel displays. The device fabrication process involves a series of thin film deposition and photolithographic patterning steps. In order to minimize contamination, the substrates usually undergo a cleaning procedure using deionized water, before and after the growth of thin films by sputtering methods. The devices structure were fabricated top-contact gate TFTs using the a-IGZO films on the plastic substrates. The channel width and length were 80 and 20 um, respectively. The source and drain electrode regions were defined by photolithography and wet etching process. The electrodes consisting of Ti(15 nm)/Al(120 nm)/Ti(15nm) trilayers were deposited by direct current sputtering. The 30 nm thickness active IGZO layer deposited by rf magnetron sputtering at room temperature. The deposition condition is as follows: a rf power 200 W, a pressure of 5 mtorr, 10% of oxygen [O2/(O2+Ar)=0.1], and room temperature. A 9-nm-thick Al2O3 layer was formed as a first, third gate insulator by ALD deposition. A 290-nm-thick SS6908 organic dielectrics formed as second gate insulator by spin-coating. The schematic structure of the IGZO TFT is top gate contact geometry device structure for typical TFTs fabricated in this study. Drain current (IDS) versus drain-source voltage (VDS) output characteristics curve of a IGZO TFTs fabricated using the 3-layer gate insulator on a plastic substrate and log(IDS)-gate voltage (VG) characteristics for typical IGZO TFTs. The TFTs device has a channel width (W) of $80{\mu}m$ and a channel length (L) of $20{\mu}m$. The IDS-VDS curves showed well-defined transistor characteristics with saturation effects at VG>-10 V and VDS>-20 V for the inkjet printing IGZO device. The carrier charge mobility was determined to be 15.18 cm^2 V-1s-1 with FET threshold voltage of -3 V and on/off current ratio 10^9.

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Optical and Hydrophobic Properties of Ag Deposited ZnO Nanorods on ITO/PET (ITO/PET 기판 위에 성장된 산화아연 나노로드에 형성된 은 입자의 광학적 특성 및 소수성 표면 연구)

  • Ko, Yeong-Hwan;Kim, Myung-Sub;Yu, Jae-Su
    • Journal of the Korean Vacuum Society
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    • v.21 no.4
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    • pp.205-211
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    • 2012
  • We investigated the optical and hydrophobic properties of the deposited silver (Ag) zinc oxide (ZnO) nanorods (NRs) on flexible indium tin oxide (ITO) coated polyethylene terephthalate (PET) substrates (i.e., ITO/PET). The ZnO NRs were grown by an electrochemical deposition using a sputtered ZnO seed layer and the Ag was deposited by using a thermal evaporator. For comparison, the same fabrication process was carried out on the bare ITO/PET without ZnO NRAs. Due to the discrete surface of ZnO NRs, the deposited Ag was formed as nano-scale particles, while the Ag became film-like for bare ITO/PET. In order to control the size and amount of Ag particles, the Ag deposition time was changed from 100 to 600 s. When the deposition time was increased, the Ag particles became larger and denser, and the absorptance was increased. This enhanced absorptance may be due to the localized surface plasmon resonance of Ag particles. Furthermore, the relatively high hydrophobicity was observed for the deposited Ag on the ZnO NRs/ITO/PET. These improved optical and surface properties are expected to be useful for flexible photovoltaic and optoelectronic devices.

Effect of Heat Treatments on Tungsten Polycide Gate Structures (텅스텐 폴리사이드 게이트 구조에서의 열처리 효과)

  • 고재석;천희곤;조동율;구경완;홍봉식
    • Journal of the Korean Vacuum Society
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    • v.1 no.3
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    • pp.376-381
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    • 1992
  • Tungsten silicide films were deposited on the highly phosphorus-doped poly Si/SiO2/Si substrates by Low Pressure Chemical Vapor Deposition. They were heat treated in different conditions. XTEM, SIMS and high frequency C-V analysis were conducted for characterization. It can be concluded that outdiffusion of phosphours impurity throught the silicide films lead to its depletion in the poly-Si gate region near the gate oxide, resulting in loss of capacitance and increase of effective gate oxide thickness.

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EPD Thick Film Formation of Ceramic Powder Materials (세라믹 분말재료의 EPD 후막형성 기술)

  • Soh, Dea-Wha;Jeon, Yong-Woo
    • Journal of the Speleological Society of Korea
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    • no.75
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    • pp.49-54
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    • 2006
  • Electrophoretic Deposition (EPD) is the most convenient technology to deposit natural or oxide powders of nonconductive materials in alcoholic suspension solution with adding electrolyte of iodine to form ceramic thick film on metal substrate under applied electric field with double electric layer between electrode and metal substrate. In this research work, the important parameters and technical ways were studied to form EPD thick films of typical oxide ceramics of Al2O3, YBCO and tourmaline powders.

Sol-Gel Processing for Preparation of Metal Oxide Films

  • Korobova Natalya;Soh, Dea-Wha
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2000.07a
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    • pp.259-264
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    • 2000
  • Systematic research of metal alkoxide electrophoretic deposition has been developed. The formation mechanism of electrophoretic deposits has been offered. The structure study of dry and heat-treated electrophoretic deposits has been established. The concrete examples of one and bi-component oxide thin film formation were considered. The new approaches for thin film technology have developed on various substrates of different shapes and sizes. The correlation between thin film structure, mechanism of their formation, and physico-chemical properties has been determined.

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The Properties of RF Sputtered Zirconium Oxide Thin Films at Different Plasma Gas Ratio

  • Park, Ju-Yun;Heo, Jin-Kook;Kang, Yong-Cheol
    • Bulletin of the Korean Chemical Society
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    • v.31 no.2
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    • pp.397-400
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    • 2010
  • Zirconium oxide thin films deposited on the p-type Si(100) substrates by radio-frequency (RF) reactive magnetron sputtering with different plasma gas ratios have been studied by using spectroscopic ellipsometry (SE), atomic force microscopy (AFM), X-ray diffraction (XRD), and X-ray photoelectron spectroscopy (XPS). The deposition of the films was monitored by the oxygen gas ratio which has been increased from 0 to 80%. We found that the thickness and roughness of the zirconium oxide thin films are relatively constant. The XRD revealed that the deposited thin films have polycrystalline phases, Zr(101) and monoclinic $ZrO_2$ ($\bar{1}31$). The XPS result showed that the oxidation states of zirconium suboxides were changed to zirconia form with increasing $O_2$ gas ratio.

Improvement of bolometric properties of vanadium oxide by addition of tungsten (텅스텐 첨가에 의한 적외선 소자용 바나듐 옥사이드의 특성 향상)

  • Han, Yong-Hui;Choi, In-Hun;Kim, Geun-Tae;Shin, Hyeon-Jun;Chi, En;Moon, Seong-Uk
    • Proceedings of the Materials Research Society of Korea Conference
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    • 2003.11a
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    • pp.207-207
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    • 2003
  • Uncooled infrared(IR) detectors that use a microbolometer with a large focal-plane array(FPA) have been developed with surface micromachining technology. There are many materials for microbolometers, such as metals, vanadium oxide, semiconductors and superconductors. Among theses, vanadium oxide is a promising material for uncooled microbolometers due to it high temperature coefficient of resistance(TCR) at room temperature. It is, however, is very difficult to deposit vanadium oxide thin films having a high TCR and low resistance because of the process limits in microbolometer fabrication. In general, vanadium oxides have been applied to microbolometer in mixed phases formed by ion beam deposition methods at low temperature with TCR in the range from -1.5 to -2.0%K.

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ZnO on Thiolated Graphene Oxide as Efficient Photocatalyst for Degradation of Methylene Blue

  • Kim, Yu Hyun;Choi, Hyun Chul
    • Bulletin of the Korean Chemical Society
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    • v.34 no.12
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    • pp.3586-3590
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    • 2013
  • We present here an efficient and simple method for preparation of highly active heterogeneous ZnO photocatalyst (graphene oxide-zinc oxide: GO-ZnO), specifically by deposition of ZnO nanoparticles onto thiolated GOs. The resultant GO-ZnO sample was characterized by TEM, XRD, Auger, XPS, and Raman measurements, revealing that the size-similar and quasi-spherical ZnO nanoparticles were anchored to the thiolated GO surfaces. The average particle diameter was about 2.5 nm. In the photodegradation of methylene blue (MB) under ultraviolet (UV) light, GO-ZnO exhibited remarkably enhanced photocatalytic efficiency compared with thiolated GO and pure ZnO particles. This strong photocatalytic performance of GO-ZnO can be attributed to the suppression of electron recombination and the enhancement of mass transportation. The results showed that thiolated GO is the preferable supporting material.

Multicomponent wide band gap oxide semiconductors for thin film transistors

  • Fortunato, E.;Barquinha, P.;Pereira, L.;Goncalves, G.;Martins, R.
    • 한국정보디스플레이학회:학술대회논문집
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    • 2006.08a
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    • pp.605-608
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    • 2006
  • The recent application of wide band gap oxide semiconductors to transparent thin film transistors (TTFTs) is making a fast and growing (r)evolution on the contemporary solid-state electronics. In this paper we present some of the recent results we have obtained using wide band gap oxide semiconductors, like indium zinc oxide, produced by rf sputtering at room temperature. The devices work in the enhancement mode and exhibit excellent saturation drain currents. On-off ratios above $10^6$ are achieved. The optical transmittance data in the visible range reveals average transmittance higher than 80 %, including the glass substrate. Channel mobilities are also quite respectable, with some devices presenting values around $25\;cm^2/Vs$, even without any annealing or other post deposition improvement processes. The high performances presented by these TTFTs associated to a high electron mobility, at least two orders of magnitude higher than that of conventional amorphous silicon TFTs and a low threshold voltage, opens new doors for applications in flexible, wearable, disposable portable electronics as well as battery-powered applications.

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