• Journal of Institute of Convergence Technology
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• v.1 no.2
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• pp.16-24
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• 2011

The angular electrostatic microactuator using skewed electrode array (SEA) scheme was proposed. The moving and fixed electrodes are arranged to make the driving force perpendicular to the rotating moment of arm. By changing the electrode overlap length, the magnitude of electrostatic force and stable displacement will be changed. In order to optimize the design, electrostatic FE analysis were carried out and the empirical force model was established for SEA. Simulation was performed to make the comparison between conventional actuators and SEA. The proposed SEA generates actuating torque 2 times greater than a comb-drive and stable actuator displacement 40% greater than a parallel plate type actuator. The angular electrostatic microactuator using skewed SEA scheme was designed and fabricated using SoG process.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.05a
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• pp.774-777
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• 2002

There are various methods to join mechanical structures together. They typically include welding, mechanical joints by bolts and other processes depending on specific needs. Analyses of joints in the mechanical structures are essential in understanding the dynamic characteristics of the structures. In this research an impulse technique is applies to investigate the dynamic behavior of joints produced by bolts. The length overlap in the joints was varied as the number of the bolts in the joins was changed. Also, the torque applied to the bolts were adjusted. Resonance frequencies were determined for the joints to evaluate the relationship between the increase in the applied torque and the increase in the number of bolts used in the joints. The results have demonstrated that the resonance frequencies of the joints increase with the increasing torque.

• Journal of the Korean Society for Precision Engineering
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• v.21 no.10
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• pp.42-49
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• 2004

Electrical discharge machining (EDM) is one of the most extensively used non-conventional material removal process. The recent trend in reducing the size of product has given micro EDM a significant amount of research attention. Micro EDM is capable of machining not only micro holes and micro shafts as small as a few micrometers in diameter but also complex three dimensional micro cavities. But, longitudinal tool wear by electrical discharge is indispensable and this affects the machining accuracy in micro EDM process. Therefore, newly developed tool wear compensation strategy called round trip method is suggested and verified by experiment. In this method, machining depth of cut, overlap effect and critical travel length are also considered.

• Laser Solutions
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• v.2 no.3
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• pp.52-61
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• 1999

The laser induced forward transfer(LIFT) technique employs a pulsed laser to transfer parts of a thin metal film from an optically transparent target onto an arbitrary substrate in close proximity to the metal film on the target. In this work, a two-step method, the combination of LIFT process, in which a Au film deposited on the $Al_2$O$_3$ substrate by Nd:YAG laser and subsequent Au electroless metal plating on the by LIFT process generated Au seed, was presented. The influence of laser parameters, wavelength, laser power, film thickness and overlap ratio of pulse tracks, on the shapes of deposit and conductor line after electroless plating is experimentally studied. As a results, the threshold power densities for ablation, deposition and metallization were determined and comparison of threshold value between the wave length 1064nm and the second harmonic generated 532nm. In odor to determine a possible application in the electronic industry, a smallest conduct spot size, line width and isolated line space were generated.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.33A no.11
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• pp.128-139
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• 1996

In this paper, we propose an algorithm to solve the problem of placement of rectangular blocks whose sizes and shpaes are pre-determined. The proposed method solves the placement of many retangular blocks of different sizes and shapes in a hierarchical manner, so as to minimize the chip area. The placement problem is divided into several sub-problems: hierarchical partioning, hierarchical area/shape estimation, hierarchical pattern pacement, overlap removal, and module rotation. After the circuit is recursively partitioned to build a hierarchy tree, the necessary wiring area and module shpaes are estimated using the resutls of the partitioning and the pin information before the placement is performed. The placement templaes are defined to represent the relative positions of the modules. The area and the connectivity are optimized separately at each level of hierachy using the placement templates, so the minimization of chip area and wire length can be achieved in a short execution time. Experiments are made on the MCNC building block benchmark circuits and the results are compared with those of other published methods. The proposed technique is shown to produce good figures in tems of execution time and chip area.

• 한국전산유체공학회:학술대회논문집
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• 1999.11a
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• pp.95-107
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• 1999

The spatial error due to the non-conservative interpolation become first-order when second-order conservative schemes are used, discontinuities are located away from the overlapped regions, and if the length of the overlapped region is not proportional to the grid spacing. Therefore, the solution accuracy is ensured if two domains overlap each other with a fixed grid point and the interpolation is occurred in smooth flow regions. To validate the spatial and temporal accuracy due to the non-conservative interpolation, inviscid and viscous problems are tested.

• Journal of Power System Engineering
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• v.14 no.3
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• pp.64-70
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• 2010

In this study, designing of precise linear transferring device which can be applied to industrial machine and robot industry has been introduced. The direction of power flow and output feature are similar to current Rack-Pinion type. However, unlimited length extensity via rack modulizing, and securing high velocity transportation have been realized by applying Pin-Pinion Gear type at the operation part. The analysis has been calculated to obtain the Pin-Pinion Gear's optimized tooth profile. As a result of research, it is impossible to control precisely even overlap at the teeth of involute and sprocket. Because they have peculiar gearing structure. Therefore, modified cycloid tooth has been proposed to perform high velocity, precise control without backlash.

• KOREAN JOURNAL OF CROP SCIENCE
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• v.41 no.2
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• pp.223-229
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• 1996

To investigate the effect of seeding date, seeding rate, and sprouted seeds on seedling establishment, yield and its components of rice in barley /rice reley cropping as a minimum tillage, Gancheokbyeo rice seeds sowed by hand broadcast in various overlapped days befer barley harvest. The highest rice seedling stand was at sowed on the day just before barley harvest and l00kg per hectare of seeding rate with sprouted seeds. Also number of tiller and panicle showed the similar tendency. Delayed rice heading dates were found 2 days at l0-day overlap, 2 days at 5-day overlap, and 4 days at 0-day overlap before barley harvest compared with machine transplanting rice at just after barley harvest using l0-days old seedling. The culm length of broadcast rice shortened 2∼4cm compared with the transplanting rice. The rice plants lodged slightly at seeding rate l00kg per hectare and at sowed on the day of barley harvest. The rice panicle number increased with later date sowing and higher seeding rate. Number of spikelets per panicle and ripened grains decreased at higher seeding rates. Sprouted seeds and higher seeding rates showed higher rice yield at later sowing dates.

• Journal of Wetlands Research
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• v.25 no.2
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• pp.159-165
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• 2023

This study measured the ecological niche overlap between two deciduous oak species(Quercus acutissmia and Q. dentata) according to the change in growth responses after treating with the moisture and nutrient contents of the soil at four gradients, and interpreted the degree of competition between the two oak species by ordination method. In the moisture environment gradient, the ecological niche overlap of the two species was high in the photosynthesis-related leaf organs and low in plant architecture such as shoot length. In addition, in case of competition between two oaks, Q. dentata was remarkably dominant in soil moisture gradient, but Q. acutissimia slightly was slightly advantageous over Q. dentata in the soil nutrient gradient. These results show that even in a similar taxonomical group growing in a similar habitat, the response to the organ system of the plant varies depending on the type of environment factor, resulting in different competitive differences among plants.

• Advances in aircraft and spacecraft science
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• v.11 no.1
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• pp.83-103
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• 2024

Adhesive bonding is currently widely used in many industrial fields, particularly in the aeronautics sector. Despite its advantages over mechanical joints such as riveting and welding, adhesive bonding is mostly used for secondary structures due to its low peel strength; especially if it is simultaneously exposed to temperature and humidity; and often presence of bonding defects. In fact, during joint preparation, several types of defects can be introduced into the adhesive layer such as air bubbles, cavities, or cracks, which induce stress concentrations potentially leading to premature failure. Indeed, the presence of defects in the adhesive joint has a significant effect on adhesive stresses, which emphasizes the need for a good surface treatment. The research in this field is aimed at minimizing the stresses in the adhesive joint at its free edges by geometric modifications of the ovelapping part and/or by changing the nature of the substrates. In this study, the finite element method is used to describe the mechanical behavior of bonded joints. Thus, a three-dimensional model is made to analyze the effect of defects in the adhesive joint at areas of high stress concentrations. The analysis consists of estimating the different stresses in an adhesive joint between two 2024-T3 aluminum plates. Two types of single lap joints(SLJ) were analyzed: a standard SLJ and another modified by removing 0.2 mm of material from the thickness of one plate along the overlap length, taking into account several factors such as the applied load, shape, size and position of the defect. The obtained results clearly show that the presence of a bonding defect significantly affects stresses in the adhesive joint, which become important if the joint is subjected to a higher applied load. On the other hand, the geometric modification made to the plate considerably reduces the various stresses in the adhesive joint even in the presence of a bonding defect.