• 제목/요약/키워드: Overall thermal performance

검색결과 250건 처리시간 0.021초

Development of Monopropellant Propulsion System for Low Earth Orbit Observation Satellite

  • Lee, Kyun-Ho;Yu, Myoung-Jong;Choi, Joon-Min
    • International Journal of Aeronautical and Space Sciences
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    • 제6권1호
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    • pp.61-70
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    • 2005
  • The currently developed propulsion system(PS) is composed of propellant tank, valves, thrusters, interconnecting line assembly and thermal hardwares to prevent propellant freezing in the space environment. Comprehensive engineering analyses in the structure, thermal, flow and plume fields are performed to evaluate main design parameters and to verify their suitabilities concurrently at the design phase. The integrated PS has undergone a series of acceptance tests to verify workmanship, performance, and functionality prior to spacecraft level integration. After all the processes of assembly, integration and test are completed, the PS is integrated with the satellite bus system successfully. At present, the severe environmental tests have been carried out to evaluate functionality performances of satellite bus system. This paper summarizes an overall development process of monopropellant propulsion system for the attitude and orbit control of LEO(Low Earth Orbit) observation satellite from the design engineering up to the integration and test.

Design of 1500V solar inverter stack beyond megawatt in NPC1 topology

  • Hao, Xin;Ma, Kwok-Wai;Zhao, Jia;Sun, Xin-Yu
    • 전력전자학회:학술대회논문집
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    • 전력전자학회 2017년도 전력전자학술대회
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    • pp.7-11
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    • 2017
  • This paper describes a design concept of NPC1 power stack for 1500VDC megawatt level solar inverter. This stack uses three latest half-bridge IGBT modules with highest power density and operation junction temperature, which enable realization of power level beyond 1MW without paralleling. Critical design concept on loop inductance is explained. Dynamic characteristics are verified by double-pulse test. Thermal characteristics and output power limits are verified by thermal test. Temperature-sensitive component on PCB as output power constraint is identified. Different PCB repositioning solutions are tested to give the overall output power thermal derating curves, which enable output power of 1.15MW at $T_A=55^{\circ}C$ with $15^{\circ}C$ thermal margin. The power stack characteristic and performance change under different thermal environment is further analyzed.

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항공기 시스템 레벨 열관리 기술개발 동향 (The Trend of System Level Thermal Management Technology Development for Aero-Vehicles)

  • 김영진;손창민
    • 한국군사과학기술학회지
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    • 제19권1호
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    • pp.35-42
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    • 2016
  • Modern aircraft is facing the increase of power demands and thermal challenges. In accordance with the application of more electric technology and advanced mission requirement, aircraft system requires increase of power generation and it cause increase of internal heat generation. Simultaneously, restrictions have significantly been imposed to the thermal management system. Modern aircraft must maintain low radar observability and infra-red signature. In addition, new composite aircraft skins have reduced the amount of heat that can be rejected to the environment. The combination of these characteristics has increased the challenges faced by thermal management. In order to mitigate the thermal challenges, the concept of system level thermal management should be applied and new modeling and simulation tools need to be developed. To develop and utilize system level thermal management technology, three key points are considered. Firstly, the performance changes of subsystems and components must be assessed at an integrated thermal system. It is because that each subsystem and component interacts with other subsystems or components and it can directly effects on overall system performance. Secondly, system level thermal management requirements and solutions must be evaluated early in conceptual design process as vehicle and propulsion system configuration decisions are being made. Finally, new component level thermal management technologies must focus on reducing heat generation and increasing the availability of heat sinks.

조합형 윅을 사용한 히트파이프의 작동특성에 관한 실험적 연구 (Experimental study on the working characteristic of a heat pipe with combined wick)

  • 홍진관;부준홍;정원복
    • 설비공학논문집
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    • 제11권2호
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    • pp.236-243
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    • 1999
  • Aluminum/Freon-22 heat pipes were manufactured and tested which have a special wick geometry combining axial groove and screen mesh. There were 14 axial grooves in a cross-section and these were covered by two layers of 350 mesh screens to enhance the thermal performance. The performance test was conducted by varying the thermal load and tilt angle. Furthermore, the operation limits and overall heat transfer coefficient were investigated. The experimental results will be useful in a variety of applications, especially in design and manufacturing of a high-efficiency heat exchanger and energy recovery systems.

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열에너지 저장 암반공동의 형상 및 레이아웃 설계 가이드라인 (Guidelines for Designing the Shape and Layout of Thermal Energy Storage (TES) Rock Caverns)

  • 박도현;박의섭
    • 터널과지하공간
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    • 제25권2호
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    • pp.115-124
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    • 2015
  • 열에너지 저장은 고온 또는 저온의 잉여 열에너지를 저장하여 수요 발생 시 사용하기 위한 기술로서 에너지의 수요와 공급 사이의 불균형을 해소하고, 이를 통해 에너지 시스템의 효율을 향상시킬 수 있다. 특히 간헐적인 신재생에너지 자원을 열에너지 형태로 변환하거나 저장함으로써 에너지 믹스에서 신재생에너지의 비중을 제고할 수 있으며, 이를 위해서는 열에너지 저장 장치와의 조합이 반드시 필요하다. 지하 암반공동을 이용한 열에너지 저장은 높은 건설비용이 수반되어 그 활용이 제한적이지만, 대규모의 열에너지를 장기간 저장할 수 있는 가장 현실적인 방법이다. 또한 기후조건에 따라 외부로의 열손실이 영향을 받는 지상의 열저장소와는 달리, 열저장 지하 암반공동은 장기 운영 시 주변 암반의 히팅에 따른 열손실의 감소를 기대할 수 있다. 본고에서는 열저장 암반공동의 형상 및 다중배치 설계 시 고려해야 할 주요 인자들을 소개하고, 저장공간의 설계에 대한 가이드라인을 제안하였다.

Measurement of Heat Transfer Coefficient in Dimpled Channel: Effect of Dimple Arrangement and Channel Height

  • Lee, K.S.;Shin, S.M.;Park, S.D.;Kwak, J.S.;Kang, J.S.
    • 한국추진공학회:학술대회논문집
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    • 한국추진공학회 2008년 영문 학술대회
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    • pp.39-44
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    • 2008
  • In this paper, heat transfer coefficients were measured in a channel with one side dimpled surface. The sphere type dimples were fabricated and the diameter and depth of dimple was 16mm and 4mm, respectively. Two channel heights of about 0.6 and 1.2 time of the dimple diameter, two dimple configuration were tested. The Reynolds numbers based on the channel hydraulic diameter was varied from 30000 to 50000. The improved hue detection based transient liquid crystal technique was used in the heat transfer measurement. Heat transfer measurement results showed that high heat transfer was induced downstream of dimples due to flow reattachment. Due to the flow recirculation on the upstream side in the dimple, the heat transfer coefficient was very low. As the Reynolds increased, the overall heat transfer coefficients also increased. With same dimple arrangement, the heat transfer coefficients and the thermal performance factor were higher for the lower channel height. As the distance between dimples became smaller, the overall heat transfer coefficient and the thermal performance factor were increased.

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열응답 시험과 변수 평가 모델을 이용한 그라우트/토양 혼합층의 열전도도 산정 (Evaluation of Thermal Conductivity for Grout/Soil Formation Using Thermal Response Test and Parameter Estimation Models)

  • 손병후;신현준;안형준
    • 설비공학논문집
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    • 제17권2호
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    • pp.173-182
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    • 2005
  • The Performance of U-tube ground heat exchanger for geothermal heat Pump systems depends on the thermal properties of the soil, as well as grout or backfill materials in the borehole. In-situ tests provide a means of estimating some of these properties. In this study, in-situ thermal response tests were completed on two vertical boreholes, 130 m deep with 62 mm diameter high density polyethylene U-tubes. The tests were conducted by adding a monitored amount of heat to water over a $17\~18$ hour period for each vertical boreholes. By monitoring the water temperatures entering and exiting the loop and heat load, overall thermal conductivity values of grout/soil formation were determined. Two parameter estimation models for evaluation of thermal response test data were compared when applied on the same temperature response data. One model is based on line-source theory and the other is a numerical one-dimensional finite difference model. The average thermal conductivity deviation between measured data and these models is of the magnitude $1\%$ to $5\%$.

EFFECTS OF PROCESS INDUCED DEFECTS ON THERMAL PERFORMANCE OF FLIP CHIP PACKAGE

  • Park, Joohyuk;Sham, Man-Lung
    • 한국마이크로전자및패키징학회:학술대회논문집
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    • 한국마이크로전자및패키징학회 2002년도 추계기술심포지움논문집
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    • pp.39-47
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    • 2002
  • Heat is always the root of stress acting upon the electronic package, regardless of the heat due to the device itself during operation or working under the adverse environment. Due to the significant mismatch in coefficient of thermal expansion (CTE) and the thermal conductivity (K) of the packaging components, on one hand intensive research has been conducted in order to enhance the device reliability by minimizing the mechanical stressing and deformation within the package. On the other hand the effectiveness of different thermal enhancements are pursued to dissipate the heat to avoid the overheating of the device. However, the interactions between the thermal-mechanical loading has not yet been address fully. in articular when the temperature gradient is considered within the package. To address the interactions between the thermal loading upon the mechanical stressing condition. coupled-field analysis is performed to account the interaction between the thermal and mechanical stress distribution. Furthermore, process induced defects are also incorporated into the analysis to determine the effects on thermal conducting path as well as the mechanical stress distribution. It is concluded that it feasible to consider the thermal gradient within the package accompanied with the mechanical analysis, and the subsequent effects of the inherent defects on the overall structural integrity of the package are discussed.

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FAPO 제올라이트 흡착제 코팅을 통한 핀-관 열교환기 운전조건별 열전달 성능특성 (Heat Transfer Characteristics of Fin-Tube Heat Exchanger Coated with FAPO Zeolite Adsorbent at Different Operating Conditions)

  • 정철기;김용찬;배경진;차동안;권오경
    • 동력기계공학회지
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    • 제21권3호
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    • pp.93-101
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    • 2017
  • In conventional adsorption chamber, adsorbent is embedded in between heat exchanger fins by wire mesh. This method impedes heat and mass transfer efficiency. So in this study, to improve the heat transfer performance of heat exchanger, a fin-tube exchanger was coated with FAPO (Ferroaluminophosphate) zeolite adsorbent. The fin-tube heat exchanger has a fin pitch of 1.8 mm with a variation of adsorbent coating thickness of about 0.1 mm, 0.15 mm and 0.2 mm. By varying cooling water temperature and chilled water temperature respecively, heat transfer rate and overall heat transfer coefficient were investigated. As a result, the heat transfer rate and overall heat transfer coefficient increase with decreasing cooling water temperature and increasing chilled water temperature. Under the basic conditions, the heat transfer rate of heat exchanger with 0.2 mm coating thickness is 11% and 43% higher than that of 0.1 mm and 0.15 mm, respectively. The overall heat transfer coefficient is $189.1W/m^2{\cdot}^{\circ}C$, it is two times lager than that of 0.1 mm.

액체식 직접 접촉 냉각장치의 노즐배열 최적화 : 정풍량 해석 (Optimization of Nozzle Arrangement in a Liquid Direct Contact Cooling System : Constant Inlet Flowrate Analysis)

  • 김원년;김서영
    • 설비공학논문집
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    • 제18권5호
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    • pp.402-409
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    • 2006
  • For the design of a liquid direct contact cooling system, thermal and hydraulic analysis has been carried out. Well-known Zukauskas correlations are used to estimate the Nusselt number between the liquid refrigerant columns and the inlet airflow. The inlet air velocity is set at a typical value used in an actual showcase. For a constant column number, the best nozzle arrangement is determined for the maximum heat transfer. Heat transfer increases as the transverse pitch of the refrigerant column decreases. Among all the cases dealt with in the present study, the staggered arrangement with 140-columns of $14{\times}10$ shows the best thermal peformance and the expected temperature drop is $27.8^{\circ}C$. The effect of downstream refrigerant columns on the overall thermal performance is investigated as well.