• Proceedings of the Korea Database Society Conference
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• 1997.10a
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• pp.215-269
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• 1997

Outline $\textbullet$ Introduction $\textbullet$ Multimedia - Types of Data - Motivation - Key issue - Hardware Products - Application Areas $\textbullet$ Agents - Rationale for Agents - Sedentary vs. Mobile - Functional Categories - Application Areas $\textbullet$ Data Mining - 2-D Framework for Data Mining Tools - Classification of Tool - Application Areas - Learning Methodologies ＊ Case Based Reasoning ＊ Neural Networks ＊ Statistical Learning： Orthogonal Arrays ＊ Multi-strategy Learning $\textbullet$ Case Study - Finbot $\textbullet$ Conclusion

• 한국데이터정보과학회:학술대회논문집
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• 2002.06a
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• pp.97-106
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• 2002

Taguchi parameter design, the product-array approach using orthogonal arrays is mainly used. However, it often requires an excessive number of experiments. An alternative approach, which is called the combined-array approach, was suggested by Welch et. al. and studied by others. In these studies, only single quality characteristic was considered. We propose how to simultaneously optimize multiple quality characteristics using desirability function when we used the combined-array approach to assign control and noise factors. An example is illustrated to the combined-array approach.

• Journal of the Korean Data and Information Science Society
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• v.12 no.2
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• pp.57-64
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• 2001

In the Taguchi parameter design, the product-array approach using orthogonal arrays is mainly used. However, it often requires an excessive number of experiments. An alternative approach, which is called the combined-array approach, was suggested by Welch et al (1990) and studied by Vining and Myers (1990) and others. In these studies, only single respouse variable was considered. We propose how to simultaneously optimize multiple responses when there are correlations among responses.

• Journal of Integrative Natural Science
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• v.10 no.1
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• pp.51-57
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• 2017

The Taguchi parameter design in industry is an approach to reducing performance variation of quality characteristic in products and processes. In the Taguchi parameter design, the product array approach using orthogonal arrays is mainly used. It often requires an excessive number of experiments. An alternative approach, which is called the combined array approach, was studied. In these studies, only single response was considered. In this paper we propose how to simultaneously optimize multiresponse for the robust design using the combined array approach.

• Proceedings of the IEEK Conference
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• 2006.06a
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• pp.191-192
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• 2006

An orthogonal antenna is presented for reader applications of radio frequency identification (RFID) at 433 MHz. The antenna is composed of two $1{\times}2$ sub-arrays orthogonally placed on a ground plane. Two different feeding networks are introduced to control horizontal and vertical radiation current flows for each sub-array, respectively. An inverted-F structure is used as a radiation element with vertical and horizontal currents flowing on the radiator, thereby obtaining two linear polarizations. Antenna gains are 3.71 and 3.43 dBi and isolation between the two input ports is less than 25dB.

• 한국데이터정보과학회:학술대회논문집
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• 2001.10a
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• pp.44-55
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• 2001

In the Taguchi parameter design, the product-array approach using orthogonal arrays is mainly used. However, it often requires an excessive number of experiments. An alternative approach, which is called the combined-array approach, was suggested by Welch et. al. (1990) and studied by others. In these studies, only single response variable was considered. We propose how to simultaneously optimize multiple responses when there are correlations among responses, and when we use the combined-array approach to assign control and noise factors.

• Communications for Statistical Applications and Methods
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• v.3 no.2
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• pp.103-117
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• 1996

In the Taguchi Parameter design, the product-array approach using orthogonal arrays is mainly used. However, it often requires an excessive number of experiments. An alternative approach, which is called the combined- array approach, was suggested by welch et. al. (1990) and studied by Vining and Myers(1990), Box and Jones (1992) and others. In these studies, only single response variable was considered. We propose how to simultaneously optimize multiple responses when there are correlations among responses, and when we use the combined-array approach to assign control and noise factors.

• Journal of Korean Society for Quality Management
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• v.24 no.2
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• pp.142-157
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• 1996

Robust design in industry is an approach to reducing performance variation of quality characteristic values in products and processes. In the Taguchi type robust design, the product array approach using orthogonal arrays is mainly used. However, it often requires an excessive number of experiments. In this paper, for the combined array approach to assign control and noise factors, we propose how to simultaneously optimize multiple quality characteristics. Two examples are illustrated to show the difference between the product-array approach and the combined-array approach.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.11a
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• pp.278-278
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• 2009

A photovoltaic device consisting of arrays of radial p-n junction wires enables a decoupling of the requirements for light absorption and carrier extraction into orthogonal spatial directions. Each individual p-n junction wire in the cell is long in the direction of incident light, allowing for effective light absorption, but thin in orthogonal direction, allowing for effective carrier collection. To fabricate radial p-n junction solar cells, p or n-type vertical Si wire cores need to be produced. The majority of Si wires are produced by the vapor-liquid-solid (VLS) method. But contamination of the Si wires by metallic impurities such as Au, which is used for metal catalyst in the VLS technique, results in reduction of conversion efficiency of solar cells. To overcome impurity issue, top-down methods like noble metal catalytic etching is an excellent candidate. We used noble metal catalytic etching methods to make Si wire arrays. The used noble metal is two; Au and Pt. The method is noble metal deposition on photolithographycally defined Si surface by sputtering and then etching in various BOE and $H_2O_2$ solutions. The Si substrates were p-type ($10{\sim}20ohm{\cdot}cm$). The areas that noble metal was not deposited due to photo resist covering were not etched in noble metal catalytic etching. The Si wires of several tens of ${\mu}m$ in height were formed in uncovered areas by photo resist. The side surface of Si wires was very rough. When the distance of Si wires is longer than diameter of that Si nanowires are formed between Si wires. Theses Si nanowires can be removed by immersing the specimen in KOH solution. The optimum noble metal thickness exists for Si wires fabrication. The thicker or the thinner noble metal than the optimum thickness could not show well defined Si wire arrays. The solution composition observed in the highest etching rate was BOE(16.3ml)/$H_2O_2$(0.44M) in Au assisted chemical etching method. The morphology difference was compared between Au and Pt metal assisted chemical etching. The efficiencies of radial p-n junction solar Cells made of the Si wire arrays were also measured.

• Journal of Korean Society of Industrial and Systems Engineering
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• v.39 no.4
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• pp.90-96
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• 2016

Incremental sheet forming (ISF) is a highly versatile and flexible process for rapid manufacturing of complex sheet metal parts. Compared to conventional sheet forming processes, ISF is of a clear advantage in manufacturing small batch or customized parts. ISF needs die-less machine alone, while conventional sheet forming requires highly expensive facilities like dies, molds, and presses. This equipment takes long time to get preparation for manufacturing. However, ISF does not need the full facilities nor much cost and time. Because of the facts, ISF is continuously being used for small batch or prototyping manufacturing in current industries. However, spring-back induced in the process of incremental forming becomes a critical drawback on precision manufacturing. Since sheet metal, being a raw material for ISF, has property to resilience, spring-back would come in the case. It is the research objective to investigate how geometrical shaping parameters make effect on shape dimensional errors. In order to analyze the spring-back occurred in the process, this study experimented on Al 1015 material in the ISF. The statistical tool employed experimental design with factors. The table of orthogonal arrays of $L_8(2^7)$ are used to design the experiments and ANOVA method are employed to statistically analyze the collected data. The results of the analysis from this study shows that the type of shape and the slope of bottom are the significant, whereas the shape size, the shape height, and the side angle are not significant factors on dimensional errors. More error incurred on the pyramid than on the circular type in the experiments. The sloped bottom showed higher errors than the flat one.