• 폴리머
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• 제32권4호
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• pp.372-376
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• 2008

유기발광소자(OLED)에서 정공 주입층으로 사용되는 4,4',4"-tris(N-(2-naphthyl)-N-phenylamino)-triphenylamine(2-TNATA)가 전극으로 사용되는 ITO(indium tin oxide)와 홀 수송층(hole transport layer, HTL)사이에 박막으로 진공 증착되었다. 공증착에 의해 C60이 약 20 wt% 도핑된 2-TNATA:C60 층을 제조하였으며, AFM과 XRD를 이용하여 2-TNATA:C60 박막의 분자 배향성 및 토폴로지를 관찰하였다. 또한, 다층 소자의 J-V, L-V 및 전류 효율 특성이 고찰되었다. C60은 분자 배향성을 가지고 있으나, 2-TNATA:C60 박막은 C60 분자의 균일한 분산에 의해 분자 배향성이 확인되지 않았다. C60의 도핑에 의해서 2-TNATA 박막이 더욱 조밀해지고 균일해지는 것을 확인하였으며, 이로 인하며 박막 내의 전류 밀도가 증가됨을 확인하였다. 2-TNATA:C60 하이브리드 박막을 이용하여 ITO/2-TNATA:C60/NPD/$Alq_3$/LiF/Al 다층 소자를 제조하였을 때 소자의 휘도가 향상되었으며 소자 효율도 약 4.7에서 약 6.7 cd/A로 증가하였다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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• pp.363-363
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• 2014

Ruthenium (Ru) has attractive material properties due to its promising characteristics such as a low resistivity ($7.1{\mu}{\Omega}{\cdot}cm$ in the bulk), a high work function of 4.7 eV, and feasibility for the dry etch process. These properties make Ru films appropriate for various applications in the state-of-art semiconductor device technologies. Thus, it has been widely investigated as an electrode for capacitor in the dynamic random access memory (DRAM), a metal gate for metal-oxide semiconductor field effect transistor (MOSFET), and a seed layer for Cu metallization. Due to the continuous shrinkage of microelectronic devices, better deposition processes for Ru thin films are critically required with excellent step coverages in high aspect ratio (AR) structures. In these respects, atomic layer deposition (ALD) is a viable solution for preparing Ru thin films because it enables atomic-scale control of the film thickness with excellent conformality. A recent investigation reported that the nucleation of ALD-Ru film was enhanced considerably by using a zero-valent metallorganic precursor, compared to the utilization of precursors with higher metal valences. In this study, we will present our research results on the synthesis and characterization of novel ruthenium complexes. The ruthenium compounds were easy synthesized by the reaction of ruthenium halide with appropriate organic ligands in protic solvent, and characterized by NMR, elemental analysis and thermogravimetric analysis. The molecular structures of the complexes were studied by single crystal diffraction. ALD of Ru film was demonstrated using the new Ru metallorganic precursor and O2 as the Ru source and reactant, respectively, at the deposition temperatures of $300-350^{\circ}C$. Self-limited reaction behavior was observed as increasing Ru precursor and O2 pulse time, suggesting that newly developed Ru precursor is applicable for ALD process. Detailed discussions on the chemical and structural properties of Ru thin films as well as its growth behavior using new Ru precursor will be also presented.

• 한국재료학회지
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• 제20권12호
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• pp.676-680
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• 2010

Most TCOs such as ITO, AZO(Al-doped ZnO), FTO(F-doped $SnO_2$) etc., which have been widely used in LCD, touch panel, solar cell, and organic LEDs etc. as transparent electrode material reveal n-type conductivity. But in order to realize transparent circuit, transparent p-n junction, and introduction of transparent p-type materials are prerequisite. Additional prerequisite condition is optical transparency in visible spectral region. Oxide based materials usually have a wide optical bandgap more than ~3.0 eV. In this study, single-phase transparent semiconductor of $SrCu_2O_2$, which shows p-type conductivity, have been synthesized by 2-step solid state reaction at $950^{\circ}C$ under $N_2$ atmosphere, and single-phase $SrCu_2O_2$ thin films of p-type TCOs have been deposited by RF magnetron sputtering on alkali-free glass substrate from single-phase target at $500^{\circ}C$, 1% $H_2$/(Ar + $H_2$) atmosphere. 3% $H_2$/(Ar + $H_2$) resulted in formation of second phases. Hall measurements confirmed the p-type nature of the fabricated $SrCu_2O_2$ thin films. The electrical conductivity, mobility of carrier and carrier density $5.27{\times}10^{-2}S/cm$, $2.2cm^2$/Vs, $1.53{\times}10^{17}/cm^3$ a room temperature, respectively. Transmittance and optical band-gap of the $SrCu_2O_2$ thin films revealed 62% at 550 nm and 3.28 eV. The electrical and optical properties of the obtained $SrCu_2O_2$ thin films deposited by RF magnetron sputtering were compared with those deposited by PLD and e-beam.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2013년도 제45회 하계 정기학술대회 초록집
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• pp.78-78
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• 2013

Recently, many platinoid metals like platinum and ruthenium have been used as an electrode of microelectronic devices because of their low resistivity and high work-function. However the material cost of Ru is very expensive and it usually takes long initial nucleation time on SiO2 during chemical deposition. Therefore many researchers have focused on how to enhance the initial growth rate on SiO2 surface. There are two methods to deposit Ru film with atomic layer deposition (ALD); the one is thermal ALD using dilute oxygen gas as a reactant, and the other is plasma enhanced ALD (PEALD) using NH3 plasma as a reactant. Generally, the film roughness of Ru film deposited by PEALD is smoother than that deposited by thermal ALD. However, the plasma is not favorable in the application of high aspect ratio structure. In this study, we used a bis(ethylcyclopentadienyl)ruthenium [Ru(EtCp)2] as a metal organic precursor for both thermal and plasma enhanced ALDs. In order to reduce initial nucleation time, we use several methods such as Ar plasma pre-treatment for PEALD and usage of sacrificial RuO2 under layer for thermal ALD. In case of PEALD, some of surface hydroxyls were removed from SiO2 substrate during the Ar plasma treatment. And relatively high surface nitrogen concentration after first NH3 plasma exposure step in ALD process was observed with in-situ Auger electron spectroscopy (AES). This means that surface amine filled the hydroxyl removed sites by the NH3 plasma. Surface amine played a role as a reduction site but not a nucleation site. Therefore, the precursor reduction was enhanced but the adhesion property was degraded. In case of thermal ALD, a Ru film was deposited from Ru precursors on the surface of RuO2 and the RuO2 film was reduced from RuO2/SiO2 interface to Ru during the deposition. The reduction process was controlled by oxygen partial pressure in ambient. Under high oxygen partial pressure, RuO2 was deposited on RuO2/SiO2, and under medium oxygen partial pressure, RuO2 was partially reduced and oxygen concentration in RuO2 film was decreased. Under low oxygen partial pressure, finally RuO2 was disappeared and about 3% of oxygen was remained. Usually rough surface was observed with longer initial nucleation time. However, the Ru deposited with reduction of RuO2 exhibits smooth surface and was deposited quickly because the sacrificial RuO2 has no initial nucleation time on SiO2 and played a role as a buffer layer between Ru and SiO2.

• 대한환경공학회지
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• 제38권12호
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• pp.647-655
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• 2016

Lead dioxide ($PbO_2$)는 전기화학적 고도산화공정(electrochemical advanced oxidation process, EAOP)에서 hydroxyl radical ($^{\bullet}OH$) 발생에 기반한 유기오염물 분해에 효과적인 전극물질이다. $PbO_2$ 전극의 대표적인 제조방법인 전기화학적 증착법(electrodeposition)의 주요 인자로는 전류/전압세기, 온도, 반응시간, Pb(II)의 농도, 전해질 종류 및 농도가 있다. 본 연구에서는 $Ti/PbO_2$ 산화전극을 전기화학적 증착법을 통해 전류인가 시간, 전류밀도, 온도, $HNO_3$ 전해질 농도를 각각 조절하여 제조하였고, $^{\bullet}OH$ 검출물질인 p-Nitrosodimethylaniline (RNO)의 전기화학적 탈색 측면에서 $^{\bullet}OH$ 발생에 대한 $PbO_2$ 증착인자의 영향을 조사하였다. 주요 결과로, $PbO_2$의 $^{\bullet}OH$ 발생 성능은 $PbO_2$ 증착과정에서 대체로 전류인가 시간이 길어질수록(1-90 min), 전류밀도가 감소할수록($0.5-50mA/cm^2$), 증착온도가 증가할수록($5-65^{\circ}C$), $HNO_3$ 전해질 농도(0.01-1.0 M)가 감소할수록 향상되었다. 특히, 0.01 M의 낮은 $HNO_3$ 농도 상에서 $20mA/cm^2$ 전류를 10분 이상 인가하여 증착시킨 $PbO_2$에서$^{\bullet}OH$ 발생이 가장 촉진되었다. RNO 탈색속도 측면에서 가장 성능이 좋은 $PbO_2$와 저조한 $PbO_2$ 사이에 최대 41% 정도 차이가 나타났다. $PbO_2$의$^{\bullet}OH$ 발생 성능을 결정짓는 특성으로 $PbO_2$ 층 전도도, Ti 기판 산화, $PbO_2$ 결정크기를 고려한 결과, $PbO_2$ 층의 전도도 및 Ti 기판의 산화가 $^{\bullet}OH$ 발생에 주요하게 영향을 미치는 것으로 확인되었다. $PbO_2$ 층의 전도도 향상과 Ti 표면 산화 억제로 인한 $Ti/PbO_2$ 계면에서 전도도 향상이 $^{\bullet}OH$ 발생을 촉진시키는 효과를 가져왔다. 그리고 일부 전극에서는 표면에서 $PbO_2$ 결정 크기 증가가 $^{\bullet}OH$ 발생을 저감시키는 역할을 하였다.

• 공업화학
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• 제23권2호
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• pp.131-137
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• 2012

Layer-by-layer 방법을 기초로 기존의 방법보다 간단히 합성된 껍질 두께를 달리한 속이 빈 구형체인 폴리아닐린과 폴리피롤을 리튬이차전지 양극 활물질로 사용하여 껍질 두께에 따른 방전용량에 미친 효과를 조사하였다. 유화중합으로 중합된 음이온계 계면활성제에 의해 표면 개질 된 폴리스타이렌을 지지체로 사용하였다. 아닐린과 피롤의 모노머 양을 각각 다르게 추가하여 합성하여 쉘 두께를 조절하였다. 그 후, 유기용매를 통해 폴리스타이렌을 제거하여 속이 빈 구형체를 제조하였다. 이는 리튬이차전지에서 전해액과의 접촉을 증가시키기 위해 넓은 표면적을 가진 속이 빈 구형체 구조로 제조하고, 분자량 조절이 어렵고 단위부피당 질량이 낮아 용량이 낮은 단점을 가진 고분자를 껍질 두께의 조절로 단점을 보완하고자 하였다. 아닐린 모노머 양을 1.2, 2.4, 3.6, 4.8 및 6.0 mL로 증가시킨 경우 폴리아닐린의 껍질 두께는 30.2, 38.0, 42.2, 48.2 및 52.4 nm이고 피롤 모노머 양이 0.6, 1.2, 2.4 및 3.6 mL일 경우 양극재료는 폴리아닐린의 경우 껍질 두께가 30.2, 42.2 및 52.4 nm 일 때, 10회 후, 방전 용량은 약 ~18, ~29 및 ~62 mAh/g으로 나타났으며, 폴리피롤의 경우 껍질 두께가 16.0, 22.0, 27.0 및 34.0 nm 일 때, 15회 후, 방전용량은 약 ~15, ~36, ~56 및 ~77 mAh/g으로 껍질의 두께가 증가할수록 방전용량 역시 증가하는 것을 알 수 있었다.