• Korean Chemical Engineering Research
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• v.50 no.4
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• pp.621-626
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• 2012

In this study, the composite coating materials with improved thermal insulation property were prepared by incorporating the hollow micro-spheres with high heat transfer resistance. The UV curable resin system consisting of hexa aliphatic urethane acrylate (UP118), trimethylolpropane triacrylate (TMPTA), 1,6-hexanediol diacrylate (HDDA), and photoinitiator (Irgacure184) was employed as an organic binder. The glass substrates were coated by the prepared composites via bar coating method and cured under UV radiation. The optical transparency, thermal insulation property, adhesion, and surface hardness of the glass coated with composites containing different type of micro-spheres were investigated. The incorporation of micro-spheres with only 20 vol% of content resulted in remarkable improvement in the thermal insulation property of the coated glass. In addition, the transparent coated glass with light transmittance of about 80% could be obtained when silica micro-sphere (SP) was used as a thermal barrier.

• Applied Chemistry for Engineering
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• v.21 no.4
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• pp.417-423
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• 2010

In this study, an effective method to prepare granular binderless ZSM-5 which is as efficient p-xylene separatory adsorbent was explored. Colloidal silica sol 30 wt% solution as an inorganic binder and microcrystalline cellulose as an organic additive were added to ZSM-5 powder ($SiO_2/Al_2O_3$ = 50). Adsorbent with enough strength (0.721 kgf), high crystallinity (94.6%) and high BET specific surface area ($379.2m^2$/g) was obtained by calcination, binderless treatment, ${NH_4}^+$ ion exchange, and activation after spherical granulation process. A batch type adsorption experiment was proceeded with solutions comprising 3 xylene isomers by 1 : 1 : 1 weight ratio to evaluate adsorption characteristics of prepared absorbent. As a result, the obtained binderless ZSM-5 granule showed a higher selective adsorption performance for para-xylene than that of commercial adsorbent.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.160-160
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• 2016

In this study, we applied the low temperature curing Ag paste to replace PVD System. The electrode formation of low temperature curing Ag paste for silicon Hetero-junction solar cells is important for improving device characteristics such as adhesion, contact resistance, fill factor and conversion efficiency. The low temperature curing Ag paste is composed various additives such as solvent, various organic materials, polymer, and binder. it depends on the curing temperature conditions. The adhesion of the low temperature curing Ag paste was decided by scratch test. The specific contact resistance was measured using the transmission line method. All of the Ag electrodes were experimented at various curing temperatures within the temperature range of $160^{\circ}C-240^{\circ}C$, at $20^{\circ}C$ intervals. The curing time was also changed by varying the conditions of 10-50min. In the optimum curing temperature $200^{\circ}C$ and for 20 min, the measured contact resistance is $19.61m{\Omega}cm^2$. Over temperature $240^{\circ}C$, confirmed bad contact characteristic. We obtained photovoltaic parameter of the industrial size such as Fill Factor (FF), current density (Jsc), open-circuit voltage (Voc) and convert efficiency of up to 76.2%, 38.1 mA/cm2, 646 mV and 18.3%, respectively.

• Korean Journal of Materials Research
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• v.20 no.4
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• pp.204-209
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• 2010

Recent high efficiency electronic devices have been found to have heat emission problems. As for LEDs, an excessive increase in the device temperature causes a drop of the luminous efficiency and circuit lifetime. Therefore, heat release in the limited space of such electronic parts is very important. This is a study of the possibility of using a coating of carbon materials as a solution for the thermal emission problem of electronic devices. Powdered carbon materials, cokes, carbon blacks, amorphous graphite, and natural flakes were coated with an organic binder on an aluminum sheet and the subsequent thermal emissivity was measured with an FT-IR spectrometer and was found to be in the range of $5{\sim}20\;{\mu}m$ at $50^{\circ}C$. The emissivity of the carbon materials coated on the aluminum sheet was shown to be over 0.8 and varied according to carbon type. The maximum thermal emissivity on the carbon black coated-aluminum surface was shown to be 0.877. The emissivity of the anodized aluminum sheets that were used as heat releasing materials of the electronic parts was reported to be in the range of 0.7~0.8. Therefore, the use of a coating of carbon material can be a potential solution that facillitates heat dissipation for electronic parts.

• Journal of the Korean Applied Science and Technology
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• v.32 no.3
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• pp.528-535
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• 2015

Humanity has tended pursuing beauty. Pearls has been loved by many people for thousands of years as a symbol of wealth and status. Today, Artificial pearl were made using organic pigment due to bright colors and easy coating process. But the new coating technique is required due to low durability, weather resistance and difficulty of luxurious luster expression. This study, nitrocellulose and urethane were used as binder and inorganic pigment were used to expression of colors. Experimental variable of artificial pearl with nitrocellulose and solvent ratio, urethane and curing agent ratio, the amount of pearl number of coating, drying temperature and time, and coating technology was developed. The coated artificial pearl was evaluated with color-difference meter, ultraviolet ray resistance, promotion weathering. Urethane was better than nitrocellulose when compared with weather resistance, acid-alkalinity resistance.

• Korean Journal of Materials Research
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• v.15 no.3
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• pp.177-182
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• 2005

Large amounts of the waste SiC sludge containing small amounts of Si and organic lubricant were produced during the wire cutting process of the single silicon crystal ingots. The waste SiC sludge was purified by the washing process and the purified SiC powders were used to fabricate continuously porous $SiC-Si_3N_4$ composites using a fibrous monolithic process, in which carbon, $6wt\%\;Y_2O_3-2\;wt\%\;A1_2O_3$ and ethylene vinyl acetate were added as a pore-forming agent, sintering additives, and binder, respectively. In the burning-out process, carbon was fully removed and continuously porous $SiC-Si_3N_4$ composites were successfully fabricated. The green bodies containing SiC, Si particles and sintering additives were nitrided at $1410^{\circ}C$ in a flowing $N_2+10\%\;H_2$ gas mixture. Continuously porous composites were combined with SiC, ${\alpha}Si_3N_4,\;\beta-Si_3N_4$ and a few $\%$ of Fe phases. The pore size of the 2nd and the 3rd passed $SiC-Si_3N_4$ composites was $260\;{\mu}m$ and $35\;{\mu}m$ in diameter, respectively.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.51-51
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• 2008

Carbon nanotubes (CNTs) have long been reported as an ideal material due to their excellent electrical conductivity and chemical and mechanical stability as well as their high aspect ratios for field emission devices. CNT emitters made by screen printing the organic binder-based CNT paste may act as a source to release gases inside a vacuum panel. These residual gases may cause a catastrophic damage by electrical arcing or ion bombardment to the vacuum microelectronic devices and may change their physical or electrical properties by adsorbing on the CNT emitter surface. In this study, we analyzed the composition of residual gases inside the vacuum-sealed panel by residual gas analyzer (RGA), investigating the effects of individual gases of different kinds at several pressures on the field emission characteristics of CNT emitters. The residual gases included $H_2$, CO, $CO_2$, $N_2$, $CH_4$, $H_2O$, $C_2H_6$, and Ar. Effect of residual gases on the field emission was studied by observing the variation of the pulse voltages with the duty ratio of3.3% to keep the constant emission current of $28{\mu}A$. Each gas species was introduced to a vacuum chamber up to three different pressures ($5\times10^{-7}$, $5\times10^{-6}$, and $5\times10^{-5}$ torr) each for 1 h while electron emission was continued. The three different pressure regions were separated by keeping a high vacuum of $\sim10^{-8}$ torr for a 1 h. The emission was terminated 6 h after the third gas exposure was completed. Field emission characteristics under residual gases will be discussed in terms of their adsorption and desorption on the surface of CNTs and the resultant change of work function.

• Composites Research
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• v.29 no.5
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• pp.262-268
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• 2016

In this work, the pitch-based carbon paper (P-CP) was prepared by re-impregnating of binder pitches and PAN-based milled carbon fibers (MCF) at low temperature carbonization process. The influence of MCF content on physicochemical properties of MCF/P-CP was investigated. As a result, the tensile strength of MCF/P-CP was increased sharply from 10 wt.% to 20 wt.% of MCF. Also, the increase of MCF content led to the decrease of interfacial contact resistivity and the improvement of electrical and thermal conductivity of MCF/P-CP. These results were probably due to the increase of density of MCF/P-CP, resulting in the formation of electrically and thermally conductive paths of the carbon paper.

• Proceedings of the Materials Research Society of Korea Conference
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• 2010.05a
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• pp.19.2-19.2
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• 2010

Printed electronics using printing process has broadened in all respects such as electrics (lighting, batteries, solar cells etc) as well as electronics (OLED, LCD, E-paper, transistor etc). Copper is considered to be a promising alternative to silver for printed electronics, due to very high conductivity at a low price. However, Copper is easily oxidized, and its oxide is non-conductive. This is the highest hurdle for making copper inks, since the heat and humidity that occurs during ink making and printing simply accelerates the oxidation process. A variety of chemical treatments including organic capping agents and metallic coating have been used to slow this oxidation. We have established synthetic conditions of copper nanoparticles (CuNPs) which are resistant to oxidation and average diameter of 20 to 50nm. Specific resistivity should be less than $4\;{\mu}{\Omega}{\cdot}cm$ when sintered at lower temperature than $250^{\circ}C$ to be able to apply to conductive patterns of FPCBs using ink-jet printing. Through this study, the parameters to control average diameter of CuNPs were found to be the introduction of additive agent, the feeding rate of reducing agent, and reaction temperature. The CuNPs with various average diameters (58, 40, 26, 20nm) could be synthesized by controlling these parameters. The dispersed solution of CuNPs with an average size of 20 nm was made with nonpolar solvent containing 3 wt% of binder, and then coated onto glass substrate. After sintering the coated substrates at $250^{\circ}C$ for 30 minutes in nitrogen atmosphere, metallic copper film resulted in a specific resistivity of $4.2\;{\mu}{\Omega}{\cdot}cm$.

• Journal of the Korean institute of surface engineering
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• v.42 no.2
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• pp.95-101
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• 2009

This study is the research on the thermal emissivity depending on the bulk graphite's alignment degree. Bulk graphites were manufactured by uni-axial pressing and subsequent heat treatment of natural graphite flakes with organic binder. The samples were prepared to be $0^{\circ}$ (relative to the 002 c-face), $45^{\circ}$, and $90^{\circ}$ (relative to the 100 a-face) for measuring alignment degree. The alignment degree of the sample was measured by XRD. The thermal emissivity was measured by infrared thermal image camera at $100^{\circ}C$ and compared with the value obtained by Infrared spectroscopy. The alignment degree and thermal emissivity of $0^{\circ}$ sample were measured to be 0 and 0.70 respectively. And those of $90^{\circ}$ sample were 0.73 and 0.80 respectively. The emissivity value was correlated with obtained by IR spectroscopy. Therefore it was considered that the thermal emissivity of the bulk graphite is correlated with the alignment degree.