• Korean Journal of Environmental Agriculture
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• v.14 no.3
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• pp.272-281
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• 1995

The residual Polychlorinated biphenyls(PCBs) in the sediment of the Kumho River basin were measured because the Nakdong River was considered to be affected by the environmental quality of Kumho River. PCBs in the sediment were chlorinated and converted into Decachlorinated biphenyl(DCB) which showed the single peak in the GC-ECD chromatogram. The detectable concentrations of PCBs was 0.5ng/g in the sediment. PCBs in the 21 sediment samples was of Kumho River located at 7.5km from conjunction of Nakdong River were not detected from 100 samples. 49% of samples was showed lower than 50ng/g, and 9% did more than 400ng/g. The mean of PCBs concentrations was 131ng/g. The means of COD and organic carbon were 14.5mg/g and 3.41%, respectively. The relationship between PCBs were concentration and the distance from conjunction with Nakdong River was not significant. The concentration of PCBs were varied with the depth of the sediment down to the 250cm depth. The concentrations of PCBs in the depth 0-20cm and 50-90cm were higher than the mean concentration of PCBs. Along the cross of the stream, the concentrations of PCBs were 142ng/g at the center and 126 and 131ng/g at the river sides.

• Korean Journal of Materials Research
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• v.12 no.9
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• pp.750-760
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• 2002

In this study, three solders, Sn-37Pb, Sn-3.5Ag, and Sn-3.8Ag-0.7Cu were screen printed on both electroless Ni/Au and OSP metal finished micro-via PCBs (Printed Circuit Boards). The interfacial reaction between PCB metal pad finish materials and solder materials, and its effects on the solder bump joint mechanical reliability were investigated. The lead free solders formed a large amount of intermetallic compounds (IMC) than Sn-37Pb on both electroless Ni/Au and OSP (Organic Solderabilty Preservatives) finished PCBs during solder reflows because of the higher Sn content and higher reflow temperature. For OSP finish, scallop-like $Cu_{6}$ /$Sn_{5}$ and planar $Cu_3$Sn intermetallic compounds (IMC) were formed, and fracture occurred 100% within the solder regardless of reflow numbers and solder materials. Bump shear strength of lead free solders showed higher value than that of Sn-37Pb solder, because lead free solders are usually harder than eutectic Sn-37Pb solder. For Ni/Au finish, polygonal shaped $Ni_3$$Sn_4$ IMC and P-rich Ni layer were formed, and a brittle fracture at the Ni-Sn IMC layer or the interface between Ni-Sn intermetallic and P-rich Ni layer was observed after several reflows. Therefore, bump shear strength values of the Ni/Au finish are relatively lower than those of OSP finish. Especially, spalled IMCs at Sn-3.5Ag interface was observed after several reflow times. And, for the Sn-3.8Ag-0.7Cu solder case, the ternary Sn-Ni-Cu IMCs were observed. As a result, it was found that OSP finished PCB was a better choice for solders on PCB in terms of flip chip mechanical reliability.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.3
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• pp.81-88
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• 2019

In this study, the effects of graphene oxide (GO) addition on electromigration (EM) lifetime of Sn-3.0Ag-0.5Cu Pb-free solder joint between a ball grid array (BGA) package and printed circuit board (PCB) were investigated. After as-bonded, $(Cu,Ni)_6Sn_5$ intermetallic compound (IMC) was formed at the interface of package side finished with electroplated Ni/Au, while $Cu_6Sn_5$ IMC was formed at the interface of OSP-treated PCB side. Mean time to failure of solder joint without GO solder joint under $130^{\circ}C$ with a current density of $1.0{\times}10^3A/cm^2$ was 189.9 hrs and that with GO was 367.1 hrs. EM open failure was occurred at the interface of PCB side with smaller pad diameter than that of package side due to Cu consumption by electrons flow. Meanwhile, we observed that the added GO was distributed at the interface between $Cu_6Sn_5$ IMC and solder. Therefore, we assumed that EM reliability of solder joint with GO was superior to that of without GO by suppressing the Cu diffusion at current crowding regions.

• Proceedings of the Korea Air Pollution Research Association Conference
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• 2000.11a
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• pp.83-84
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• 2000

식물은 반휘발성유기화합물(Semivolatile organic compounds : 이하 SOCs)의 지구적인 순환과 먹이 연쇄에 있어서 중요한 역할을 한다. 또한 식물은 대기중 가스상 SOCs을 보유하고 입자상 SOCs를 제거하는 역할을 하기 때문에 대기를 정화하는데 중요한 기능을 한다(Lorber et al, 1993). SOCs 화합물 중 PCBs와 BHCs는 친지질성(lipophilic) 유기염소계 화합물로 식물의 뿌리를 통해서는 흡입되지 않고 대기중에서 식물잎의 표면에 존재하는 지질에 침착되므로 식물잎에 침착된 오염물질은 대기의 농도에 의존한다. (중략)

• Proceedings of the Korea Air Pollution Research Association Conference
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• 2000.11a
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• pp.94-95
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• 2000

PCBs(polychlorinated biphenyls)와 BHCs(benzene hexachlorides)와 같은 SOCs(semivolatile organic compounds)는 모든 대륙에서 검출되어지고 있으며, 심지어 장거리 수송에 의해 청정지역인 북극에서도 검출되고 있다. 이들 성분들은 친지질성(lipophilic)으로 대부분이 가스상으로 존재하여 식물의 표면에 존재하는 지질(lipid)에 건성침착(dry deposition) 또는 습성 침착(wet deposition)된다. 이렇게 침착된 성분들의 농도는 대기중 농도와 밀접한 관계가 있다고 보고되고 있다(천만영,1998; Simonich and Mites, 1995). (중략)

• Journal of Environmental Science International
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• v.14 no.10
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• pp.919-928
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• 2005

This study introduces the development of new supercritical water oxidation(SCW)(multiple step oxidation) to destruct recalcitrant organic substances totally and safely by using sodium nitrate as an oxidant. This method has solved the problems of conventional SCW, such as precipitation of salt due to lowered permittivity, pressure increase following rapid rise of reaction temperature, and corrosion of reactor due to the generation of strong acid. Destruction condition and rate in the supercritical water were examined using Polyvinyl Chloride(PVC) and ion exchange resins as organic substances. The experiment was carried out at $450^{\circ}C$ for 30min, which is relatively lower than the temperature for supercritical water oxidation $(600-650^{\circ}C)$. The decomposition rates of various incombustible organic substances were very high [PVC$(87.5\%)$, Anion exchange resin$(98.6\%)$, Cationexchange resin$(98.0\%)$]. It was observed that hetero atoms existed in organic compounds and chlorine was neutralized by sodium (salt formation). However, relatively large amount of sodium nitrate (4 equivalent) was required to raise the decomposition ratio. For complete oxidation of PCB was intended, the amount of oxidizer was an important parameter.

• Korean Chemical Engineering Research
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• v.46 no.6
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• pp.1148-1152
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• 2008

Molten carbonate oxidation (MCO) is one of the promising alternative technologies for the treatment of the chlorinated organic compounds because it is capable of trapping chlorine during a destruction of them. In this study, destructions of chlorinated organic compounds ($C_6H_5Cl$, $C_2HCl_3$ and $CCl_4$) and an insulated oil containing PCBs were performed by using the two stage molten carbonate oxidation system. MCO reactor temperature largely affected the destruction of the chlorinated organic compounds. Destruction of the chlorinated organics very efficient in the primary MCO reactor however a significant amount of CO was emitted from the MCO system. This CO emission was gradually decreased by an increase in the primary reactor temperature and oxidizing air feed rate. The HCl emission from the MCO system was below 7 ppm regardless of tested conditions. The chlorine collection efficiencies were in the range of 99.95-99.99%. The destruction of PCBs in the insulated oil was efficient at a temperature above $900^{\circ}C$ and overall destruction efficiency of them was determined as over 99.9999%.

• Fire Science and Engineering
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• v.14 no.2
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• pp.33-38
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• 2000

Flux, essentially used in soldering process of PCB (Printed Circuit Board) in electronics industry, contains IPA (Isopropyl alcohol) and methanol, which are highly inflammable and explosive. Hazard Chemical Controlling Law classified methanol as toxic material and Environmental Law classified methanol as VOC (Volatile Organic Compound). So there have been pressing needs of developing substitutes for the existing Flux. New solvent which is non-flammable and main component is DCP having same specific character of the existing Flux. It's been combirated with proper composition ratio adding stabilizer. As a result, it relieved working Environment Allowance thickness 200 ppm to 470 ppm, chance of not been soldered 0.083% to 0%, spread 85% to 87%, power saving resistance 1.0$\times$$10^{12}$$\Omega$ to 6.9$\times$$10^{12}$$\Omega$, which means a lot better than the existing Flux. Therefore, Flux confirmed the chance of improving productivity, safety, environment safety and quality. Also, Flux got a satisfied result after product quality test and product reliability test.

• Journal of Welding and Joining
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• v.33 no.3
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• pp.19-24
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• 2015

Joint properties of electric control unit (ECU) module using Sn-Cu-(X)Al(Si) lead-free solder alloy were investigated for automotive electronics module. In this study, Sn-0.5Cu-0.01Al(Si) and Sn-0.5Cu-0.03Al(Si) (wt.%) lead-free alloys were fabricated as bar type by doped various weight percentages (0.01 and 0.03 wt.%) of Al(Si) alloy to Sn-0.5Cu. After fabrications of lead-free alloys, the ball-type solder alloys with a diameter of 450 um were made by rolling and punching. The melting temperatures of 0.01Al(Si) and 0.03Al(Si) were 230.2 and $230.8^{\circ}C$, respectively. To evaluation of properties of solder joint, test printed circuit board (PCB) finished with organic solderability perseveration (OSP) on Cu pad. The ball-type solders were attached to test PCB with flux and reflowed for formation of solder joint. The maximum temperature of reflow was $260^{\circ}C$ for 50s above melting temperature. And then, we measured spreadability and shear strength of two Al(Si) solder materials compared to Sn-0.7Cu solder material used in industry. And also, microstructures in solder and intermetallic compounds (IMCs) were observed. Moreover, thickness and grain size of $Cu_6Sn_5$ IMC were measured and then compared with Sn-0.7Cu. With increasing the amounts of Al(Si), the $Cu_6Sn_5$ thickness was decreased. These results show the addition of Al(Si) could suppress IMC growth and improve the reliability of solder joint.

• Korean Journal of Materials Research
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• v.24 no.3
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• pp.166-173
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• 2014

The effects of printed circuit board electroless nickel immersion gold (ENIG) and organic solderability preservative (OSP) surface finishes on the electromigration reliability and shear strength of Sn-3.5Ag Pb-free solder bump were systematically investigated. In-situ annealing tests were performed in a scanning electron microscope chamber at 130, 150, and $170^{\circ}C$ in order to investigate the growth kinetics of intermetallic compound (IMC). Electromigration lifetime and failure modes were investigated at $150^{\circ}C$ and $1.5{\times}10^5A/cm^2$, while ball shear tests and failure mode analysis were conducted under the high-speed conditions from 10 mm/s to 3000 mm/s. The activation energy of ENIG and OSP surface finishes during annealing were evaluated as 0.84 eV and 0.94 eV, respectively. The solder bumps with ENIG surface finish showed longer electromigration lifetime than OSP surface finish. Shear strengths between ENIG and OSP were similar, and the shear energies decreased with increasing shear speed. Failure analysis showed that electrical and mechanical reliabilities were very closely related to the interfacial IMC stabilities.