• Journal of Welding and Joining
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• v.33 no.3
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• pp.47-53
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• 2015

By the trends of electronic package to be more integrative, the fine Cu trace pitch of organic PCB is required to be a robust design. In this study, the short circuit failure mechanism of PCB with a Cl element under the Temperature humidity bias test ($85^{\circ}C$/85%RH/3.5V) was examined by micro-structural study. A focused ion beam (FIB) and an electron probe micro analysis (EPMA) were used to polish the cross sections to reveal details of the microstructure of the failure mode. It is found that $CuCl_x$ were formed and grown on Cu trace during the $170^{\circ}C$/3hrs and that $CuCl_x$ was decomposed into Cu dendrite and $Cl_2$ gas during the $85^{\circ}C$/85%RH/3.5V. It is suggested that Cu dendrites formed on Cu trace lead to a short circuit failure between a pair of Cu traces.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.13 no.11
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• pp.969-975
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• 2000

Laser direct writing of micro-patterned copper lines has been achieved by pyrolytic decomposition of copper formate films (Cu(HCOO)$_2$.4$H_2O$), as a metallo-organic precursor, using a focused CW Ar$^{+}$ laser beam (λ=514nm) on PCB boards and glass substrates. The linewidth and thickness of the lines wee investigated as a functin of laser power and scan speed. The profiles of the lines were measured by scanning electron microscope (SEM), surface profiler ($\alpha$-step) and atomic force measured by scanning electron microscope (SEM), surface profiler ($\alpha$-step) and atomic force microscopy (AFM). The electrical resistivities of the patterned lines were also investigated as a function of laser parameters using probe station and semiconductor analyzer. We compared resistivities of the patterned copper lines with these of the Cu bulk. Resistivities decreased due to changes in morphology and porosity of the deposit, which were about 3.8 $\mu$$\Omega$cm and 12$\mu$$\Omega$cm on PCB and glass substrates after annealing at 30$0^{\circ}C$ for 5 minutes.s.

• Proceedings of the Korea Air Pollution Research Association Conference
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• 2002.11a
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• pp.139-140
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• 2002

반 휘발성 유기화합물(Semivolatile organic compounds; 이하 SOCs)은 높은 중기압과 낮은 반응성 때문에 지구 전역에 폭넓게 존재하고 있다. SOCs중 Polychlorinatd Biphenyls(이하 PCBs)는 난분해성 및 친지질성에 특성으로 환경중에서 순환하기 때문에 최근 들어 맡은 관심의 대상이 되고 있다. 이들 대부분은 태초의 환경과 모든 matrix(예, 토양, 식물, 대기, 수계 등)에서 발견되어 지고 있다 이처럼 PCBs는 독성 유발물질로 관리되고 있으며 먹이연쇄를 통해 생농축성(bioaccumulation)을 야기 시킬 수 있다. (중략)

• Journal of the Korean Society for Precision Engineering
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• v.24 no.5
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• pp.89-96
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• 2007

Inkjet printing has become one of the most attractive manufacturing techniques in industry. Especially inkjet printing technology will soon be part of the PCB (Printed Circuit Board) fabrication processes. Traditional printing on PCB includes screen printing and photolithography. These technologies involve high costs, time-consuming procedures and several process steps. However, by inkjet technology manufacturing time and production costs can be reduced, and procedures can be more efficient. PCB manufacturers therefore willingly accept this inkjet technology to the PCB industry, and are quickly shifting from conventional to inkjet printing. To produce the printed circuit board by the inkjet technology, it must be harmonized with conductive nano ink, printing process, system, and inkjet printhead. In this study, micro patterning of conductive line has been investigated using the piezoelectric printhead driven by a bipolar voltage signal is used to dispense 20-40 ${\mu}m$ diameter droplets and silver nano ink which consists of 1 to 50 nm silver particles that are homogeneously suspended in an organic carrier. To fabricate a conductive line used in PCB with high precision, a printed line width was calculated and compared with printing results.

• Korean Journal of Metals and Materials
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• v.47 no.4
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• pp.261-266
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• 2009

The mechanical and electrical properties of ball grid array (BGA) solder joints were measured, consisting of Sn-3.5Ag, with organic solderability preservative (OSP)-finished Cu pads and Electroless Nickel/Immersion Gold (ENIG) surface finishes. The mechanical properties were measured by die shear test. When ENIG PCB was upper joint and OSP PCB was lower joint, the highest shear force showed at the third reflow. When OSP PCB was upper joint and ENIG PCB was lower joint, the highest shear force showed at the forth reflow. For both joints, after the die shear results reached the highest shear force, shear force decreased as a function of increasing reflow number. Electrical property of the solder joint decreased with the function of increasing reflow number. The scanning electron microscope results show that the IMC thickness at the bonding interface gets thicker while the number of reflow increases.

• Analytical Science and Technology
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• v.16 no.2
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• pp.166-173
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• 2003

To determine levels of PCBs in food, beef, pork, chicken, egg, mackerel, yellow croaker, anchovy, common squid and little neck clam were chosen and collected at markets in Seoul, Busan and Kwangju. Among 209 PCB congeners, 7 congeners (#28, #52, #101, #118, #138, #153 and #180) were selected as target compounds that were known as indicator congeners. Samples were homogenized, treated in alkali solution for 1 hour, and extracted with organic solvents. After extraction, extracts were cleaned up by sulfuric acid, purified on silica gel column chromatography, analyzed by dual column-HRGC/ECD and then confirmed by HRGC/MSD. As results, PCBs were detected in fish samples ranged from 0.0002 to 0.001 mg/kg. Both PCB #101 and PCB #118 were the major contributors among 7 congeners.

• Proceedings of the KWS Conference
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• 2010.05a
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• pp.81-81
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• 2010

전자 패키징은 미세화, 경량화, 저가화를 지향하고 신뢰성의 향상을 위해 발전해 왔다. 이러한 경향은 전자부품 자체의 성능 향상 뿐 아니라 전자부품을 장착, 고정할 수 있게 하는 인쇄회로 기판(PCB : Printed Circuit Board)의 성능에 많은 관심을 가지게 되었다. 전기적 신호의 손실을 줄이기 위해 전기, 전자 산업체에서는 가볍고 굴곡성이 우수한 연성인쇄회로기판(FPCB : Flexible PCB)과 가격이 싸고 신뢰성이 입증된 경성인쇄회로기판(RPCB : Rigid PCB)이 그 대상이다. 본 논문에서는 이 PCB중에서도 RPCB와 FPCB간의 열압착 방식으로 접합 시 전극간의 접합 양상을 보았다. 이 열압착 방식은 기존에 PCB를 접합하는데 사용하고 있는 connector를 이용한 체결법을 대체하는 기술로써 솔더를 중간층(interlayer)로 이용하여 열과 압력으로 접합하는 방식이다. 이 방식을 connector를 사용하는 방식에 비해 그 부피가 작고 I/O개수에 크게 영향 받지 않으며 자동화 공정이 쉬운 장점을 가지고 있다. 접합의 대상 중 RPCB의 경우는 무전해 니켈 금도금(ENIG : Electroless Nickle Immersion Gold)로 제작하였으며 FPCB의 경우는 ENIG와 유기보호피막(OSP : Organic solderability preservation) 처리하였다. 실험에 사용한 PCB는 $300\;{\mu}m$ pitch의 미세피치이며 솔더의 조성은 Sn-3.0Ag-0.5Cu (in wt%)과 Sn-3.0Ag (in wt%)를 사용하였다. 접합 온도와 접합 시간 그리고 접합 압력에 따라 최적의 접합 조건을 도출하였다. 접합 강도는 $90^{\circ}$ Peel Test를 통해서 측정하였으며 접합면 및 파괴면은 SEM과 EDS를 통하여 분석하였다.

• The Korean Journal of Pesticide Science
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• v.20 no.1
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• pp.7-13
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• 2016

As of many organochlorine pesticides, polychlorinated biphenyls are ubiquitous organic contaminants, which can be found in the most environmental matrices. Their toxic effects include endocrinedisrupting activity. Most researches with these toxicants performed with mixtures of congeners, namely Aroclor and related study has been done in complex environmental matrix, rather than single biosystems or pure congeners. 5 congeners were synthesized and their fates in pure microbial culture (Aspergillus niger) were determined in this study. Among biphenyl and synthetic congeners, biphenyl, PCB-1 (2-chlorobiphenyl), and PCB-3 (4-chlorobiphenyl) were rapidly transformed to hydrophilic metabolites, followed by PCB-38 (3,4,5-trichlorobiphenyl), while the degradation of PCB-126 (3,3',4,4',5-pentachlorobiphenyl) was not observed. The amounts of transformation for biphenyl, PCB-1, PCB-3, and PCB-38 were 65, 38, 52, and 2% respectively. The major metabolites of the above congeners were identified as mono- and di-hydroxy biphenyls, which are known to give adverse endocrinological effects.

• Journal of Korean Society for Atmospheric Environment
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• v.19 no.E1
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• pp.1-9
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• 2003

The soil concentrations of polychlorinated biphenyls (PCBs) were measured at 12 sites in Ansung, Kyonggi province, Korea. Correlation coefficient (r) between total PCBs and organic matter content (OM) was significant (r=0.562, p< 0.05). It suggests that organic matter may be a key factor of soil absorption of PCBs. The PCB concentrations of low chlorinated congeners with high vapor pressure were relatively abundant in air but high chlorinated congeners with low vapor pressure were mainly dominated by soil. The results indicated the influence of physicochemical properties of PCBs such as vapor pressure, octanol - air partition coefficient ( $K_{OA}$ ). The calculated soil/air fugacity quotients suggested that the soil may be a source of heavier molecular PCBs (>penta-CBs) to the atmosphere, where lighter molecular PCBs appear to be affected by a movement from air to soil, especially tetra-CBs. Therefore, PCB homologs with low vapor pressure might have been influenced by revolatilization from soil.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.1
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• pp.43-49
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• 2015

By the trends of electronic package to be smaller, thinner and more integrative, organic printed circuit board is required to be finer Cu trace pitch. This paper reports on a study of failure mechanism for PCB with fine Cu trace pitch using biased HAST. In weibull analysis of the biased HAST lifetime, it is found that the acceleration factor (AF) of between $135^{\circ}C/90%RH/3.3V$ and $130^{\circ}C/85%RH/3.3V$ is 2.079. A focused ion beam (FIB) was used to polish the cross sections to reveal details of the microstructure of the failure mode. It is found that $Cu_xO/Cu(OH)_2$ colloids and Cu dendrites were formed at anode (+) and at cathode (-), respectively. Thus, this gives the evidence that Cu dendrites formed at cathode by $Cu^{2+}$ ion migration lead to a short failure between a pair of Cu nets.