• 대한전자공학회논문지SD
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• 제45권4호
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• pp.72-77
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• 2008

본 논문에서는 Embedded resistor 적용을 위한 오개닉 기판 위에 캐버티(Cavity) 공정에 의해서 형성된 균일한 두께를 갖는 저항체의 제조 방법과 저항편차에 대해서 조사했다. 기존의 스크린 프린팅에 의해서 발생하는 PCB의 위치에 따른 저항값의 편차를 개선하기 위하여 캐버티 공정을 소개했다. 원하는 모양과 부피를 갖는 저항은 스크린 프린팅과 페이스트를 이용하여 cavity 공정에 의해 정확하게 형성되어 졌다. 이 방법은 PCB의 생산 공정시간을 줄일 수 있고, 스크린 프린팅의 정밀도에 의한 큰 영향 없이 빠르게 공정 조건을 배치할 수 있으므로써 생산량을 개선시킬 수 있다.

• 한국해양학회지:바다
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• 제12권1호
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• pp.24-31
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• 2007

본 연구에서는 다매체 환경모델인 Globe-POP(persistent organic pollutant)을 이용하여, 1930년대부터 대기 중으로 배출된 polychlorinated biphenyl(PCB)의 전 지구적 환경거동에 대해서 살펴보고, 다매체 환경모델의 보완사항을 논의하였다. 각 환경매체의 PCB 축적은 대기 중으로의 배출패턴에 직접적인 영향을 받는 것이 확인되었으며, 이 외에도 환경매체의 면적, 분배계수, 분해율 등에 따라서 결정되었다. 지난 70년 동안 각 기후대의 배출량 분포는 일정하게 유지되었으나, 고위도 환경매체로의 축적량이 시간에 따라 증가하는 저온응축 현상을 확인하였다. 북반구 온대지역은 PCB 배출량과 환경매체로의 축적량에 있어서 가장 중요한 지역으로 평가되었으며, 대부분의 PCB는 토양과 해양으로 축적되는 것으로 예측되었다. 한편, 남극에는 중요한 오염원이 없음에도 불구하고, 매우 낮은 온도로 인해 전 지구적인 오염원 위치와는 크게 상관없이 POPs가 축적되는 것으로 추정되었다. 남극을 포함한 극지와 계절적 강설이 있는 북반구 고위도 지역의 POPs 거동을 신뢰성 있게 파악하기 위하여, 설빙을 포함한 water balance의 작성을 제안하였다. 이와 같이 개선된 다매체 환경모델은 미래의 기후변화에 따른 전 지구적 POPs 거동을 예측하는데 유용하게 사용될 수 있을 것이다.

• 한국환경과학회지
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• 제14권5호
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• pp.513-520
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• 2005

For the destruction of toxic chlorinated organic compounds, this study proposes improved supercritical water oxidation method (multistep oxidation) using sodium nitrate as an oxidizer. This method solves the problems involved in the existing supercritical water oxidation method. Multistep oxidation means that $NaNO_3$ is oxidized to $N_2\;via\;NaNO_2$ and NO. Toxic and hard to destroy organic substances like para-dichlorobenzen(4-DCBz), polychlorinate biphenyl(PCB) ware oxidized to non toxic substances in a condition, in which rapid pressure and temperature rise is restrained as much as possible. 4-dichlorobenzene(4-DCBz) and Polychlorinate biphenyl(PCB) in condition$(450^{\circ}C,\;p_w=0.25g/cm^3,\;30min)$ Was discomposed perfectly.

• 공업화학
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• 제4권4호
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• pp.746-752
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• 1993

PCB와 HA 사이의 착화합 정도에 대한 양적인 측정을 위해 투석막을 이용한 평형실험이 여러 가지 변수에 대해 먼저 수행되었다. 활성탄에 대한 PCB의 흡착특성 파악을 위해서 HA가 용해된 물과 용해되지 않은 물을 이용하여 PCB에 대한 흡착평형 및 속도실험을 행하였다. 실험결과 HA에 대한 PCB의 착화합 정도는 PH, $Ca^{2+}$농도, 이온세기 및 HA의 농도에 큰 영향을 받는 것을 확인하였다. PCB의 활성탄에 대한 흡착능력은 HA가물에 존재할 때 크게 감소하였으며 흡착특성은 HA, PCB와 HA에 착화합된 PCB 등의 물질이 서로 경쟁적으로 활성탄에 흡착하게 되는 복잡한 특성을 보일 것으로 판단되었다.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2002년도 추계기술심포지움논문집
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• pp.21-26
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• 2002

Solder flip chip bumping and subsequent coining processes on PCB were investigated to solve the warpage problem of organic substrates for high pin count flip chip assembly by providing good co-planarity. Coining of solder bumps on PCB has been successfully demonstrated using a modified tension/compression tester with height, coining rate and coining temperature variables. It was observed that applied loads as a function of coined height showed three stages as coining deformation : (1) elastic deformation at early stage, (2) linear increase of applied load, and (3) rapid increase of applied load. In order to reduce applied loads for coining solder bumps on PCB, effects of coining process parameters were investigated. Coining loads for solder bump deformation strongly depended on coining rates and coining temperatures. As coining rates decreased and process temperature increased, coining loads decreased. Among the effect of two factors on coining loads, it was found that process temperature had more significant effect to reduce applied coining loads during the coining process. Lower coining loads were needed to prevent substrate damages such as micro-via failure and build-up dielectric layer thickness change during applying loads. For flip chip assembly, 97Pb/Sn flip chip bumped devices were successfully assembled on organic substrates with 37Pb/Sn coined flip chip bumps.

• 한국환경과학회지
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• 제9권6호
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• pp.523-529
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• 2000

Attempts have been made to use Supercritical fluids for industrial purpose in a variety of fields and some of them, are already in practice. However, basic chemical properties of supercritical fluids have not been understood well. The present pater presents the results of physicochemical studies on Supercritical fluids as well as the application of supercritical fluids to industry. The detail is as follows PCB and organic compounds.

• 한국재료학회지
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• 제13권4호
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• pp.239-245
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• 2003

In order to explore the possibility to extract precious metals from PCB(Printed Circuit Board) scrap by gravity separation, a high temperature melting process was adopted, from the recycling view point, to investigate the influence of viscosity on A1$_2$$O_3$-CaO$-SiO_2$ slag system composed of PCB scrap. For optimizing the pre-treatment process of PCB scrap, an experimental condition for the complete calcination and oxidation of organic materials in PCB scrap was established and a quantitative analysis of oxidized PCB scrap was also carrie out. It was found that 6 hours were enough for the complete oxidation of PCB scrap at 1273 K in an atmosphere condition. A slag, l5wt%$A1_2$$O_3$-45wt%CaO-40wt%SiO$_2$, was chosen as a basic slag composition which is determined based on the quantitative analysis of PCB scrap. Viscosities were measured in slag systems both made from pure fluxes and from PCB scrap with additional fluxes. Slag viscosities composed of pure fluxes were measured to be 5.29 poise and 30.52 poise at temperatures of 1773 and 1573 K, whereas that of PCB scrap with additional fluxes were 3.37 poise and 69.89 poise, respectively.

• Ocean and Polar Research
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• 제29권4호
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• pp.297-302
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• 2007

Atmospheric levels of polychlorinated biphenyls (PCBs) at the King Sejong station were monitored for one year using passive air samplers. Low-chlorinated PCB homologues were predominant in all samples. PCB levels were observed to decrease with distance from the station, which may indicate that a significant part of PCBs could be of local origin. Although the level of PCBs at the King Sejong station is very low (${\Sigma}_9PCB$ (18, 52, 101, 118, 128, 138, 153, 180, 187): $2.3\;pg\;m^{-3}$) probably due to decrease in the global PCB emissions, it is one order of magnitude higher than a background level in the Antarctic. Based on this preliminary study, more interpretation on PCB data and meteorological conditions is required.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2002년도 학술대회논문집
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• pp.23-33
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• 2002

• 한국표면공학회지
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• 제46권4호
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• pp.153-157
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• 2013

The defect like the void or seam is frequently generated in the PCB (Printed Circuit Board) Via-Filling plating inside via hole. The organic additives including the accelerating agent, inhibitor, leveler, and etc. are needed for the copper Via-Filling plating without this defect for the plating bath. However, the decomposition of the organic additive reduces the lifetime of the plating bath during the plating process, or it becomes the factor reducing the reliability of the Via-Filling. In this paper, the interaction of each organic additives and the decomposition of additive were discussed. As to the accelerating agent, the bis (3-sulfopropyl) disulfide (SPS) and leveler the Janus Green B (JGB) and inhibitor used the polyethlylene glycol 8000 (PEG). The research on the interaction of the organic additives and decomposition implemented in the galvanostat method. The additive decomposition time was confirmed in the plating process from 0 Ah/l (AmpereHour/ liter) to 100 Ah/l with the potential change.