• Journal of Sensor Science and Technology
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• v.24 no.3
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• pp.202-207
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• 2015

As a feasibility study on development of a gamma imaging probe, we developed a scintillating film-based gamma imaging detector that can obtain scintillation images with information of gamma-ray distribution. The scintillating film-based gamma imaging detector was composed of a sensing probe, an image intensifier, and a beam profiler. To detect and transmit scintillation image, the sensing probe was fabricated by coupling a scintillating film, a fiber-optic image conduit, and a fiber-optic taper, consecutively. First, the optical images of USAF 1951 resolution target were obtained and then, modulation transfer function values were calculated to test the image quality of the sensing probe. Second, we measured the scintillation images according to the activity of the 137Cs and the distance between the surface of 137Cs and the distal-end of sensing probe. Finally, the intensities of scintillating light as functions of the activity and the distance were evaluated from the region of interest in the scintillation image. From the results of this study, it is expected that a fiber-optic gamma imaging detector can be developed to detect gamma-rays emitted from radiopharmaceuticals during radioimmunoguided surgery.

• The korean journal of orthodontics
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• v.45 no.6
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• pp.299-307
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• 2015

Objective: The aims of this study were to compare the shear bond strength between orthodontic metal brackets and glazed zirconia using different types of primer before applying resin cement and to determine which primer was more effective. Methods: Zirconia blocks were milled and embedded in acrylic resin and randomly assigned to one of four groups: nonglazed zirconia with sandblasting and zirconia primer (NZ); glazed zirconia with sandblasting, etching, and zirconia primer (GZ); glazed zirconia with sandblasting, etching, and porcelain primer (GP); and glazed zirconia with sandblasting, etching, zirconia primer, and porcelain primer (GZP). A stainless steel metal bracket was bonded to each target surface with resin cement, and all specimens underwent thermal cycling. The shear bond strength of the specimens was measured by a universal testing machine. A scanning electron microscope, three-dimensional optical surface-profiler, and stereoscopic microscope were used to image the zirconia surfaces. The data were analyzed with one-way analyses of variance and the Fisher exact test. Results: Group GZ showed significantly lower shear bond strength than did the other groups. No statistically significant differences were found among groups NZ, GP, and GZP. All specimens in group GZ showed adhesive failure between the zirconia and resin cement. In groups NZ and GP, bonding failed at the interface between the resin cement and bracket base or showed complex adhesive and cohesive failure. Conclusions: Porcelain primer is the more appropriate choice for bonding a metal bracket to the surface of a full-contour glazed zirconia crown with resin cement.

• Proceedings of the Materials Research Society of Korea Conference
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• 2009.05a
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• pp.26.2-26.2
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• 2009

이 논문은 반응성 $BCl_3$ 플라즈마로 GaAs의 건식 식각을 진행한 후 그 결과에 대하여 연구 분석 한 것이다. 이 때 사용한 식각 공정 변수는 $BCl_3$ 플라즈마에서의 가스유량, 공정 압력과 RIE 척 파워의 변화이다. 먼저 공정 압력을 75 mTorr 고정시킨 후 $BCl_3$ 유량을 변화 (2.5~10 sccm)해서 실험하였다. 또한 BCl3의 유량을 5 sccm으로 고정시킨 후 공정압력을 변화(47~180 mTorr)해서 식각 실험을 실시하였다. 마지막으로 47 mTorr와 100 mTorr 의 각각의 공정압력에서 RF 척 파워를 변화시켜 (50~200 W) 실험하였다. GaAs 플라즈마 식각이 끝난 후 표면단차 측정기 (Surface profiler)를 사용하여 표면의 단차와 거칠기를 분석하였다. 그 후 그 결과를 이용하여 식각율 (Etch rate), 식각 표면 거칠기 (RMS roughness), 식각 선택비 (Selectivity) 등의 식각 특성평가를 하였다. 또한 식각 공정 중에 샘플 척에 발생하는 자기 바이어스와 $BCl_3$ 플라즈마 가스를 광학 발광 분석기 (Optical Emission Spectroscopy)를 이용하여 플라즈마의 상태를 실시간으로 분석하였다. 이 실험 결과에 따르면 공정 압력의 증가는 샘플 척의 자기 바이어스의 값을 감소시켰다. $BCl_3$ 압력 변화에 의한 GaAs의 식각 결과를 정리하면 5 sccm의 $BCl_3$ 가스유량과 RF 척 파워를 100 W로 고정시켰을 때 식각율은 47 mTorr에서 가장 높았으며, 그 값은 $0.42{\mu}m/min$ 이었다. GaAs의 식각 속도는 공정압력이 증가할수록 감소하였으며 180 mTorr에서는 식각율이 $0.03{\mu}m/min$로 거의 식각되지 않았다. 또한 공정압력을 75 mTorr, RF 척 파워를 100 W로 고정시키고, $BCl_3$ 가스유량을 2.5 sccm에서 10 sccm까지 변화시켰을 때, 10 sccm 의 $BCl_3$ 가스유량에서 가장 높은 식각율인 $0.87{\mu}m/min$이 측정되었다. 압력에 따른 GaAs의 식각 후 표면 거칠기는 최대 2 nm 정도로 비교적 매끈하였으며, 거의 식각되지 않은 180mTorr의 조건에서는 약 1 nm로 낮아졌다. 본 실험 조건에서 GaAs의 감광제에 대한 식각 선택비는 최대 약 3:1 이내였다.

• Proceedings of the Materials Research Society of Korea Conference
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• 2009.05a
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• pp.39.1-39.1
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• 2009

본 실험은 연성과 광 투명도가 뛰어난 아크릴 (PMMA) 과 폴리카보네이트 (Polycabonate) 기판의 축전 결합형 플라즈마 (CCP) 건식 식각 연구에 관한 것이다. 특히 식각 반응기 내부의 압력 변화에 따른 두 기판의 건식 식각 특성 분석에 초점을 맞추었다. 실험에 사용된 기판은 두께 1mm의 아크릴 (PMMA) 과 폴리카보네이트 (Polycabonate)를 $1.5\times1.5\;cm^2$로 절단하여 Photo-lithography 공정을 통하여 감광제 (Photo-resist)로 패턴하였다. 식각 반응기 내부에 패턴 된 아크릴(PMMA) 과 폴리카보네이트 (Polycabonate)를 넣은 후 반응기 내부 진공 상태로 만들었다. 그 후 5 sccm $O_2$ 가스를 유량조절기 (Mass flow controller)를 통하여 식각 반응기 내부로 유입하여 실험을 하였다. 이때 식각 공정 변수는 식각 반응기 내부 압력과 샘플 척 파워이다. 특성평가 항목은 식각 후 기판 (Substrate)의 식각율 (Etch rate), 식각 선택비 (Selectivity) 그리고 기판 표면 거칠기 (RMS roughness)이다. 실험 결과는 표면 단차 분석기(Surface profiler)를 이용하여 기판 (Substrate)의 표면을 분석 하였다. 또한 OES (Optical Emission Spectroscopy) 를 이용하여 식각 중 내부 플라즈마의 상태를 분석하였다. 본 실험 결과에 따르면 5 sccm $O_2$ 가스와 100 W 척 파워를 고정한 후 반응기 내부의 압력을 25 mTorr에서 180 mTorr까지 변화시켜 실험한 결과 40 mTorr의 반응기 내부 압력에서 실험 자료 중 가장 높은 식각율로 아크릴 (PMMA)은 $0.46\;{\mu}m/min$, 폴리카보네이트 (Polycabonate)는 $0.28\;{\mu}m/min$의 결과를 얻었다. 또한 이 자료를 바탕으로 5 sccm $O_2$ 가스와 반응기 내부 압력을 40 mTorr로 고정시키고 RIE 척 파워를 25 W에서 150 W로 증가시켰을 때 아크릴 (PMMA)의 식각율은 $0.15\;{\mu}m/min$에서 $0.72\;{\mu}m/min$까지 증가하였고, 폴리카보네이트 (Polycabonate) 의 식각율은 $0.1\;{\mu}m/min$에서 $0.36\;{\mu}m/min$까지 증가하였다.

• Journal of the Korean institute of surface engineering
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• v.47 no.5
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• pp.263-268
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• 2014

Nanocrystalline diamond(NCD) coated SiC balls were applied in a ball-on-disk tribometer. After seeding in an ultrasonic bath containing nanometer diamond powders, $2.2{\mu}m$ thick NCD films were deposited on sintered 3 mm diameter SiC balls at $600^{\circ}C$ in a 2.45 GHz microwave plasma CVD system. Bare $ZrO_2$ and SiC balls were prepared for comparison as test balls. Tribology tests were performed in air with pairs of three different balls and mirror polished steel(SKH51) disk. The wear tracks on balls and disks were examined by optical microscope and alpha step profiler. Under the load of 3 N, the friction coefficients of steel against $ZrO_2$, SiC and NCD-coated balls were between 0.4 and 0.8. After a few thousands sliding laps, the friction coefficient of NCD-coated balls dropped from 0.45 to below 0.1 and maintained thereafter. Under a higher load of 10 N or 20 N with a long sliding distance of 2 km, $ZrO_2$ and SiC balls exhibited the similar friction coefficients as above. The friction coefficient of NCD-coated balls was less than 0.1 from the beginning and increased to above 0.1 steadily or with some fluctuations as sliding distance increased. NCD coating layers were found worn out after long duration and/or high load sliding test, which resulted in the friction coefficient higher than 0.1.

• 한국신재생에너지학회:학술대회논문집
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• 2010.06a
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• pp.78.2-78.2
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• 2010

Cu(In,Ga)Se2 (CIGS)박막태양전지는 간단한구조와 가격경쟁력 및 고효율화 가능성에 대한 기대감에 의해 많은 연구가 수행되어오고 있다. 특히 높은 흡수계수와 적절한 밴드갭, 큰 결정크기와 같은 물질의 특성들이 장점으로 작용하고 있기 때문이다. 또한 CIGS박막태양전지는 다른 태양전지에 비해 광열화가 적다는 장점도 가지고 있다. CIGS 박막은 CuInSe2내의 In 사이트에 Ga을 도핑함으로서 형성이 되는데 그때의 밴드갭은 약 1.4eV이며 이를 형성하기 위해 많은 방법들이 제안되고 있는데, CIGS박막 형성 시 가장 중요시 여겨야 될 인자는 구성원소로부터 최적화된 조성비를 찾는 것이다. 이러한 관점에서 볼때 evaporation법이나 sputtering법같은 진공방식의 공정법이 비진공방식에 비해 최적의 조성비를 찾는 것이 수월할 것으로 생각된다. selenization을 하기전에, 동시증착이나 다층박막형성을 통해 Cu-In-Se의 조합이 일반적으로 이루어진다. 어떤방법이든 Se의 부가적인 공급이 이루어지는데 시작 전구체의 조합에서 그 해법을 제시하는 것에 대한 논의가 많이 부족한 현실로서, CuInSe2의 단일전구체에 의한 박막형성과 특성평가에 대해 구체적인 논의가 필요하다. 본 실험에서는 Cu-In-Se 전구체를 CuInSe2 단일 타겟에서부터 RF 마그네트론 스퍼터링법을 이용하여 박막증착을 하여 Se의 Rapid Thermal Process(RTA)법을 통해 Se이 순차적으로 공급되었다. 이때 형성되는 박막의 태양전지 흡수층 적용을 위한 광학적, 전기적 및 구조적에 대한 논의된다. Soda lime glass(SLG)와 Corning 1737 유리를 기판으로 하여 아세톤-에탄올을 이용, 초음파세척을 실시하였다. 스퍼터 공정을 하기전에 흡착된 물분자를 제거하기 위하여 약 30분간 $120^{\circ}C$로 열을 가해주었으며, 공정을 위한 총 아르곤 가스의 양은 약 50sccm이며 이때의 공정압력은 20mtorr로 고정하였다. 우선 RF power와 기판온도에 따른 단일전구체 형성을 관찰하기 위하여 각각 30~80W, RT~$400^{\circ}C$로 변화를 주어 박막을 형성한 후 모든 sample에 대하여 $500^{\circ}C$분위기에 effusion cell을 이용하여 Se 분위기에서 결정화를 실시하였다. 샘플의 두께는 Surface profiler로 측정하였고 단면은 전자주사현미경으로 관찰되었다. 동시에 SEM이미지를 통하여 morphology와 grain size 및 EDX를 통하여 조성분석을 하였다. 밴드갭, 투과율 및 흡수계수는 UV-VIS-NIR분광분석법을 통하여 수행되었으며, 전기적 특성분석을 위해 4-point-probe와 Hall effect측정을 수행하였다. 공정변수에 따른 단일타겟으로 얻어 결정화된 CuInSe2박막의 자세한 결과와 논의에 대하여 발표한다.

• Korean Journal of Materials Research
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• v.21 no.5
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• pp.243-249
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• 2011

To reduce manufacturing costs of crystalline silicon solar cells, silicon wafers have become thinner. In relation to this, the properties of the aluminium-back surface field (Al-BSF) are considered an important factor in solar cell performance. Generally, screen-printing and a rapid thermal process (RTP) are utilized together to form the Al-BSF. This study evaluates Al-BSF formation on a (111) textured back surface compared with a (100) flat back surface with variation of ramp up rates from 18 to $89^{\circ}C$/s for the RTP annealing conditions. To make different back surface morphologies, one side texturing using a silicon nitride film and double side texturing were carried out. After aluminium screen-printing, Al-BSF formed according to the RTP annealing conditions. A metal etching process in hydrochloric acid solution was carried out to assess the quality of Al-BSF. Saturation currents were calculated by using quasi-steady-state photoconductance. The surface morphologies observed by scanning electron microscopy and a non-contacting optical profiler. Also, sheet resistances and bulk carrier concentration were measured by a 4-point probe and hall measurement system. From the results, a faster ramp up during Al-BSF formation yielded better quality than a slower ramp up process due to temperature uniformity of silicon and the aluminium surface. Also, in the Al-BSF formation process, the (111) textured back surface is significantly affected by the ramp up rates compared with the (100) flat back surface.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.363-363
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• 2008

The development of dry etching process for sapphire wafer with plasma has been key issues for the opto-electric devices. The challenges are increasing control and obtaining low plasma induced-damage because an unwanted scattering of radiation is caused by the spatial disorder of pattern and variation of surface roughness. The plasma-induced damages during plasma etching process can be classified as impurity contamination of residual etch products or bonding disruption in lattice due to charged particle bombardment. Therefor, fine pattern technology with low damaged etching process and high etch rate are urgently needed. Until now, there are a lot of reports on the etching of sapphire wafer with using $Cl_2$/Ar, $BCl_3$/Ar, HBr/Ar and so on [1]. However, the etch behavior of sapphire wafer have investigated with variation of only one parameter while other parameters are fixed. In this study, we investigated the effect of pressure and other parameters on the etch rate and the selectivity. We selected $BCl_3$ as an etch ant because $BCl_3$ plasmas are widely used in etching process of oxide materials. In plasma, the $BCl_3$ molecule can be dissociated into B radical, $B^+$ ion, Cl radical and $Cl^+$ ion. However, the $BCl_3$ molecule can be dissociated into B radical or $B^+$ ion easier than Cl radical or $Cl^+$ ion. First, we evaluated the etch behaviors of sapphire wafer in $BCl_3$/additive gases (Ar, $N_2,Cl_2$) gases. The behavior of etch rate of sapphire substrate was monitored as a function of additive gas ratio to $BCl_3$ based plasma, total flow rate, r.f. power, d.c. bias under different pressures of 5 mTorr, 10 mTorr, 20 mTorr and 30 mTorr. The etch rates of sapphire wafer, $SiO_2$ and PR were measured with using alpha step surface profiler. In order to understand the changes of radicals, volume density of Cl, B radical and BCl molecule were investigated with optical emission spectroscopy (OES). The chemical states of $Al_2O_3$ thin films were studied with energy dispersive X-ray (EDX) and depth profile anlysis of auger electron spectroscopy (AES). The enhancement of sapphire substrate can be explained by the reactive ion etching mechanism with the competition of the formation of volatile $AlCl_3$, $Al_2Cl_6$ or $BOCl_3$ and the sputter effect by energetic ions.

• Journal of the Korean institute of surface engineering
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• v.46 no.2
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• pp.68-74
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• 2013

For the coating of diamond films on WC-Co tools, a buffer interlayer is needed because Co catalyzes diamond into graphite. W and Ti were chosen as candidate interlayer materials to prevent the diffusion of Co during diamond deposition. W or Ti interlayer of $1{\mu}m$ thickness was deposited on WC-Co substrate under Ar in a DC magnetron sputter. After seeding treatment of the interlayer-deposited specimens in an ultrasonic bath containing nanometer diamond powders, $2{\mu}m$ thick nanocrystalline diamond (NCD) films were deposited at $600^{\circ}C$ over the metal layers in a 2.45 GHz microwave plasma CVD system. The cross-sectional morphology of films was observed by FESEM. X-ray diffraction and visual Raman spectroscopy were used to confirm the NCD crystal structure. Micro hardness was measured by nano-indenter. The coefficient of friction (COF) was measured by tribology test using ball on disk method. After tribology test, wear tracks were examined by optical microscope and alpha step profiler. Rockwell C indentation test was performed to characterize the adhesion between films and substrate. Ti and W were found good interlayer materials to act as Co diffusion barriers and diamond nucleation layers. The COFs on NCD films with W or Ti interlayer were measured as less than 0.1 whereas that on bare WC-Co was 0.6~1.0. However, W interlayer exhibited better results than Ti in terms of the adhesion to WC-Co substrate and to NCD film. This result is believed to be due to smaller difference in the coefficients of thermal expansion of the related films in the case of W interlayer than Ti one. By varying the thickness of W interlayer as 1, 2, and $4{\mu}m$ with a fixed $2{\mu}m$ thick NCD film, no difference in COF and wear behavior but a significant change in adhesion was observed. It was shown that the thicker the interlayer, the stronger the adhesion. It is suggested that thicker W interlayer is more effective in relieving the residual stress of NCD film during cooling after deposition and results in stronger adhesion.

• Journal of the Korean Association of Geographic Information Studies
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• v.25 no.4
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• pp.136-150
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• 2022

In this study, a comparative review was conducted on how to use RGB images to obtain river topographic information, which is one of the most essential data for eco-friendly river management and flood level analysis. In terms of the topographic information of river zone, to obtain the topographic information of flow section is one of the difficult topic, therefore, this study focused on estimating the river topographic information of flow section through RGB images. For this study, the river topography surveying was directly conducted using ADCP and RTK-GPS, and at the same time, and orthomosiac image were created using high-resolution images obtained by drone photography. And then, the existing developed regression equations were applied to the result of channel topography surveying by ADCP and the band values of the RGB images, and the channel bathymetry in the study area was estimated using the regression equation that showed the best predictability. In addition, CCHE2D flow modeling was simulated to perform comparative verification of the topographical informations. The modeling result with the image-based topographical information provided better water depth and current velocity simulation results, when it compared to the directly measured topographical information for which measurement of the sub-section was not performed. It is concluded that river topographic information could be obtained from RGB images, and if additional research was conducted, it could be used as a method of obtaining efficient river topographic information for river management.