• Title/Summary/Keyword: Optical package

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Measurement of Junction Temperature in High Power LED Module with Property Analysis of Single Package (단일 패키지의 특성 분석을 통한 고출력 발광 다이오드 모듈의 접합 온도 측정)

  • Lee, Se-IL;Kim, Woo-Young;Jeong, Young-Gi;Yang, Jong-Kyung;Park, Dae-Hee
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.23 no.12
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    • pp.973-977
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    • 2010
  • The temperature of junction in LED affects the life time and performance. however, the measurement of junction temperature in module is very difficult. In this paper, to measure the junction temperature in LED module, optical and electrical properties is measured in single package in temperature from 25 [$^{\circ}C$] to 85 [$^{\circ}C$], and then junction temperature can is estimated in module with measuring the average voltage of single package. As results, the junction temperature of single package is measured the temperature of 61.2 [$^{\circ}C$] in ambient temperature, also, the junction temperature of LED module is measured the temperature of 72.5 [$^{\circ}C$] in ambient temperature.

Development of High Efficiency and High Power LED Package for Applying Silicone-Reflector (실리콘 리플렉터를 적용한 고효율 고출력 LED 패키지 개발)

  • Jeong, Hee-Suk;Lee, Young-Sik;Lee, Jung-Geun;Kang, Han-Lim;Hwang, Myung-Keun
    • Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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    • v.27 no.9
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    • pp.1-5
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    • 2013
  • We developed high-efficient 6W-LED package with simple structure by applying Heat Slug and silicone-reflector. LED package was manufactured in $8.5{\times}8.5mm$ sized multi-chip structure having thickness of $500{\mu}m$ achieved by bonding silicon-reflector with prepreg on top of the plate after implementing the reflector placed on copper substrate Half Etching by thickness of $200{\mu}m$. The luminous flux, luminous efficacy, correlated color temperature, color rendering index and thermal resistance of developed LED was evaluated, and it verified the application of products by applying it to 120W-LED road luminaires through simulation. The luminous efficacy of LED package reached over 130lm/W, and it is possible to be manufactured into 120W-LED road luminaires using 18 packages. In addition, the simulation results showed average of horizontal illuminance and overall illuminance uniformity that is suitable for three-lane road.

The Optical Properties of Sb2O3/Na3AlF6/Sb2O3/Cr Multi Layered Thin Films by EMP Simulation (EMP시뮬레이션을 활용한 Sb2O3/Na3AlF6/Sb2O3/Cr 다층박막의 광 특성)

  • Kim, Jun-Sik;Jang, Gun-Eik
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.21 no.4
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    • pp.376-380
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    • 2008
  • The optical properties of multi layered thin films with $Sb_2O_3/Na_3AlF_6/Sb_2O_3/Cr$ were simulated by using EMP(Essential Macleod Program). EMP is a comprehensive software package to design and analyse the optical characteristics of multi-layered thin film. $Sb_2O_3$ and $Na_3AlF_6$ were selected as a high refractive index and low refractive index material respectively. Additionally Cr was chosen as mid reflective material. Optical properties including color effect were systematically studied in terms of different optical thickness of low refractive index material. The optical thickness of $Na_3AlF_6$ was changed as 0.25, 0.5, 0.75 and $1.0\lambda$. The film with 0.25, 0.5, 0.75 and $1.0\lambda$ of optical thickness showed mixed color range between purple and red range, yellowish green and bluish green, purple and mixed color range of green and purple respectively.

Development of Curing Process for EMC Encapsulation of Ultra-thin Semiconductor Package (초박형 반도체 패키지의 EMC encapsulation을 위한 경화 공정 개발)

  • Park, Seong Yeon;On, Seung Yoon;Kim, Seong Su
    • Composites Research
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    • v.34 no.1
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    • pp.47-50
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    • 2021
  • In this paper, the Curing process for Epoxy Molding Compound (EMC) Package was developed by comparing the performance of the EMC/Cu Bi-layer package manufactured by the conventional Hot Press process system and Carbon Nanotubes (CNT) Heater process system of the surface heating system. The viscosity of EMC was measured by using a rheometer for the curing cycle of the CNT Heater. In the EMC/Cu Bi-layer Package manufactured through the two process methods by mentioned above, the voids inside the EMC was analyzed using an optical microscope. In addition, the interfacial void and warpage of the EMC/Cu Bi-layer Package were analyzed through C-Scanning Acoustic Microscope and 3D-Digital Image Correlation. According to these experimental results, it was confirmed that there was neither void in the EMC interior nor difference in the warpage at room temperature, the zero-warpage temperature and the change in warpage.

New Packaging and Characteristics of PIN PD for CWDM Transmission (저밀도 파장분할 다중화용 PIN PD 제작 및 특성)

  • Kang, Jae-Kwang;Chang, Jin-Heyon
    • Journal of the Microelectronics and Packaging Society
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    • v.12 no.4 s.37
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    • pp.323-330
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    • 2005
  • We fabricate PIN PD (Positive Intrinsic Negative Photo-Diode) for CWDM optical repeater and optical transmission system, and analyze theoretically the characteristics to verify the capability of device fabricated. Furthermore, we integrate CWDM filter into PD package to enhance the cost and the performance when compared to the conventional system, in which CWDM filter and PD package are linked by optical fusion splicing. The integrated CWDM PD is fabricated by three steps as follows: CWDM filter design, PD packaging, and product assembly and test. The results of measurement for PD fabricated reveal 0.5 dB bandwidth of 17 nm, isolation over 60 dB at transmission port and over 20 dB at reflection port. Also, the IMD3 for wireless communication is over 63 dBc, and the responsivity of PD presents over 0.9 A/W for 20 samples of the total 23 PD. The total insertion loss reduces about 0.4${\~}$0.7 dB due to the integrated assembly of CWDM and PD.

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슈퍼컴퓨터의 기술발전추세와 미래

  • 유여백
    • 전기의세계
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    • v.38 no.7
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    • pp.46-52
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    • 1989
  • 지금까지 Vector supercomputer를 비롯한 여러종류의 supercomputer의 기술발전 추세를 간단히 살펴보았다. 앞으로의 Supercomputer는 VLSI기술의 발달, GaAs같은 새로운 소재의 chip, optical connection을 이용한 더 나은 Package방식, 보다 큰 memory 그리고 parallel processing을 최대한 이용하여 현재의 supercomputer성능보다 엄청나게 강력한 Test FLOPS급의 성능을 발휘할 것으로 기대된다. 또한 전문분야별 Supercomputer들도 발전을 거듭하면서 성능은 크게 증가하고 값은 떨어져서 과학기술 분야를 포함한 각분야에 일상적으로 쓰이게 될 것이다.

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The optical properties of ZnS/$Na_3AlF_6$/ZnS multi-layered thin film with Co reflection layer (ZnS/$Na_3AlF_6$/ZnS 박막의 Cu 반사층을 이용한 광 특성)

  • Kim, Jun-Sik;Jang, Gun-Ik
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2008.11a
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    • pp.322-323
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    • 2008
  • Multi layered thin films with ZnS/$Na_3AlF_6$/ZnS were deposited on glass substrate by thermal evaporator precess and simulated by using EMP(Essential Macleod Program). EMP is a comprehensive software package to design and analyse the optical characteristics of multi-layered thin film. ZnS and $Na_3AlF_6$ were selected as a high refractive index and low refractive index material respectively. Additionally Cu was chosen as mid reflective material. Optical properties including color effect were systematically studied. in terms of different optical thickness of low refractive index material. The optical thickness of $Na_3AlF_6$ was changed as 0.25, 0.5, 0.75 and $1.0\lambda$. The film with 0.25, 0.5, 0.75 and $1.0\lambda$. of optical thickness showed mixed color range between bluish green and red purple, yellowish green and bluish green, purple and mixed color range of green and purple respectively.

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Design, Fabrication and Frequency Analysis of Transmitter Optical Sub-assembly for a 10 Gb/s XFP Transceiver (10 Gb/s XFP Transceiver용 Transmitter Optical Sub-assembly(TOSA)의 RF 설계/제작 및 주파수 특성 해석)

  • 김동철;심종인;박문규;어영선
    • Korean Journal of Optics and Photonics
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    • v.15 no.4
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    • pp.349-354
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    • 2004
  • As a transmitter sub-assembly in the XFP(10 Gb/s Small Form Factor Pluggable) transceiver module, a transmitter optical sub-assembly(TOSA) is designed, fabricated and characterized in view of electrical and thermal performances. For a low-cost and compact packaging TOSA, the bias-tee and the matching resistor are monolithically integrated on the AlN sub-mount and a newly designed coplanar waveguide is drawn in the TO-stem. All optoelectronic components packaged in the TOSA are modeled by the equivalent circuit, which helps to improve and characterize the TOSA performance. The fabricated TOSA shows the -3㏈ bandwidth as high as 11 GHz at an elevated temperature of 85$^{\circ}C$.

Improvement of Color Temperature Uniformity of Integrated Optic Lens Type LED Packaged using Compression Molding Method (가압성형 방식을 사용한 렌즈 일체형 LED 패키지의 색온도 균일성 향상에 관한 연구)

  • Kim, Wan-Ho;Kang, Young-Rae;Jang, Min-Suk;Joo, Jae-Young;Song, Sang-Bin;Kim, Jae-Pil;Yeo, In-Seon
    • Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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    • v.27 no.4
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    • pp.1-7
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    • 2013
  • Optical characteristics including the view angle and color temperature uniformity of LED packages with an integrated lens fabricated by compression molding method are investigated according to lens shape, lens materials, and phosphor coating methods. Four types of lens shape are designed and their optical output power dependence on the refractive index of silicone encapsulant are evaluated. Also, spatial color temperature uniformities of packages fabricated with different phosphor coating methods-direct coating on a chip vs. uniformly mixed with silicone encapsulant- are compared at various view angles. As the result, it is found that phosphor coating method is more effective on color temperature uniformity than lens shape. The maximum color temperature difference of a package with direct coating of phosphor on a chip is 1,340K according to the view angle at the color temperature of 5,000K, and that of a package with uniformly mixed phosphor is 250K, which indicates 1,090K improvement of color uniformity for the latter case.

The Comparison of Optical Properties with Different Optical Thickness of Materials by EMP-simulation (물질의 광학적 두께에 따른 EMP-simulation을 통한 광특성 대조)

  • Jang, Kang-Jae;Jang, Gun-Ik;Lee, Nam-Il;Jung, Jae-Il;Lim, Kwang-Su
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2007.11a
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    • pp.345-345
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    • 2007
  • ZnS/$Na_3AlF_6$/ZnS/Cu multi-layered thin film were simulated by EMP. EMP is a comprehensive software package for the design and analysis of optical thin film. ZnS and $Na_3AlF_6$ was selected as a high refractive index material and low refractive index material And Cu was selected as mid reflective material. Optical properties including color effect were systematically studied in terms of different low refractive index materials thickness. $Na_3AlF_6$ were changed 0.25, 0.5, 0.75, $1.0{\lambda}$. The thin film showed $0.25{\lambda}$ : blue, purple / $0.5{\lambda}$ : yellow $0.75{\lambda}$ : blue, purple, red / $1.0{\lambda}$ : yellow, green, blue, purple. It was becaused by different optical thickness of $Na_3AlF_6$. The maximum of optical interference by refractive layer.

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