• Korean Journal of Optics and Photonics
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• v.28 no.4
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• pp.135-140
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• 2017

In this paper, we report measured results for an all-fiber $7{\times}1$ pump combiner based on an optical fiber chip for high-power fiber lasers. An optical-fiber chip was fabricated by etching a fiber, having core and cladding diameters of 20 and $400{\mu}m$, in the longitudinal direction. To both ends of the etched chip, we spliced input and output fibers. First, we tied together seven optical fibers, having core and cladding diameters of 105 and $125{\mu}m$ respectively, in a cylindrical bundle and spliced them to the $375-{\mu}m$ end of the optical-fiber chip. Then, we attached an output DCF with core and cladding diameters of 25 and $250{\mu}m$ to the $250-{\mu}m$ end of the optical-fiber chip. Finally, the fabricated $7{\times}1$ pump combiner showed an average optical coupling efficiency of about 90.2% per port. This chip-based pump combiner may replace conventional pump combiners by massive production of fiber chips.

• Journal of the Optical Society of Korea
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• v.13 no.4
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• pp.439-444
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• 2009

Accurate evaluation of polarization characteristics in the integrated optic chip (IOC) for interferometric fiber optic gyroscope was performed. Spatial distribution of optical wavetrains caused by the polarization parameters such as local polarization cross-coupling and polarization rejection coefficient of the IOC were measured utilizing the path-matched optical coherence domain polarimetry (PM-OCDP). With the analytic model deduced from Jones matrix representation, we could accurately identify the polarization characteristics of the IOC. Both degree of measurement error due to the imperfect equipment conditions in PM-OCDP and birefringence of IOC chip were also characterized.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.3
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• pp.7-13
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• 2007

In the optical module for optical communications, the flip chip bonding is used fer the precise alignment of the optical fiber and optical device. In flip chip bonding, the optical device is aligned and welded while observing the alignment mark of substrate and chip by using flip chip bonder in order to bond the optical device at the exact position. In this research, optical passive alignment method of photodiode(PD) flip chip bonding is suggested for low cost optical subassembly. By using the visible He-Ne laser (633nm wavelength), photodiode is easily aligned with emitting spot on the optical fiber with the help of stereoscopic alignment system. We compensated wavelength dependent deviation about 4m to find out real alignment position of 1550nm input laser by ray tracing. The maximum optical coupling efficiency between the optical fiber and photodiode was about 23.3%.

• Korean Journal of Optics and Photonics
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• v.14 no.6
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• pp.600-605
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• 2003

We have experimentally demonstrated a Direct Optical Switching (DOS) CDMA for future wide-band mobile communication systems at the 40 ㎓ band by using orthogonal (crosscorrelation $\leq$2) unipolar type codes with code length of 16 and chip rate of 2.5 Gcps for radio-over-fiber (RoF) systems. Pulse-amplitude-equalized 40 ㎓ laser pulses were provided by rational-harmonically mode-locking a 10 ㎓ fiber ring laser.

• Journal of Sensor Science and Technology
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• v.22 no.6
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• pp.439-443
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• 2013

A wireless optical fiber interferometer arterial pulse wave sensor system is developed for remote sensing. The wireless optical fiber sensor system consists of Zigbee communication modules and an optical fiber interferometer arterial pulse wave sensor. The optical fiber arterial pulse wave sensor is an in-line Michelson interferometer enclosed with steel reinforcement in a heat-shrinkable tube. The Zigbee communication modules are composed of an ATmega128L microprocessor and a CC2420 Zigbee chip. The arterial pulse waves detected by the optical fiber sensor were transmitted and received via the Zigbee communication modules. The experimental results show that the wireless optical fiber sensor system can be used for monitoring the arterial pulse waves remotely.

• Journal of Industrial Technology
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• v.22 no.B
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• pp.241-249
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• 2002

Optical fiber is indispensable for optical communication systems that transmit large volumes of data at high speed, but super precision technology in sub-micron units is required for optical axis adjustment. We developed the automatic optical fiber by image processing and automatic loading system. we have developed 6-axis micro stage system for I/O optical fiber arrays, the initial automatic aligning system software for a input optical array by the image processing technique, fast I/O-synchronous aligning strategy, the automatic loading/unloading system and the automatic UV bonding mechanism. In order to adjust the alignment it used on PC based motion controller, a $10{\mu}m$ repeat-detailed drawing of automatic loading system is developed by a primary line up for high detailed drawing. Also, at this researches used the image processing system and algorithm instead of the existing a primary hand-line up and fiber input array and waveguide chip formed in line by automatic.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2001.10a
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• pp.155-160
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• 2001

In the use of glass fiber reinforced plastics(GFRP) it is often necessary to cut the components, but the cutting of GFRP is often made difficult by the delamination of the compositions and short tool life. Experimental investigation was conducted to evaluate the chip formation of the glass fiber reinforced plastics during orthogonal cutting. The chip formation process, cutting force, and thrust force were studied. The chip formation processes were studied through the use of quick-stop device. Chip-tool contact areas were obtained with the use of the quick-stop device, and observed using optical microscopy after polishing. Cutting force and thrust force were measured through the use of the tool dynamometer.

• Korean Journal of Optics and Photonics
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• v.10 no.6
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• pp.500-506
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• 1999

We designed and fabricated a bidirectional optical transceiver module for low cost access network. An integrated chip forming a pin-PD on an 1.3 urn FP-LD was assembled by flip-chip bonding on a Si optical bench, a single mode fiber with an angled end facet was aligned passively with the integrated chip on V-groove of Si-optical bench. Gaussian beam theory was applied to evaluate the coupling coefficients as a function of some parameters such as alignment distance, angle of fiber end facet, vertical alignment error. The theory is also used to search the bottle-neck between transmittance and receiving coupling efficiency in the bi-directional optical system. Tn this paper, we confirmed that reduction of coupling efficiency by the vertical alignment error between laser beam and fiber core axis can be compensated by controlling the fiber facet angle. In the fabrication of sub-module, a'||'&'||' we made such that the fiber facet have a corn shape with an angled facet only core part, the reflection of transmitted laser beam from the fiber facet could be minimized below -35 dE in alignment distance of 2: 30 /J.m. In the same condition, transmitted output power of -12.1 dEm and responsivity of 0.2. AIW were obtained.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.10a
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• pp.536-539
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• 2002

In this paper, we developed the automatic optical fiber aligner by image processing and automatic loading system. Optical fiber is indispensable for optical communication systems that transmit large volumes of data at high speed, but super-precision technology in sub-micron units is required for optical axis adjustment, we have developed 6-axis micro stage system for I/O optical fiber arrays, the initial automatic aligning system/software for a input optical array by the image processing technique, fast I/O-synchronous aligning strategy, the automatic loading/unloading system and the automatic UV bonding mechanism. In order to adjust the alignment it used on PC based motion controller, a $10\mu\textrm{mm}$ repeat-detailed drawing of automatic loading system is developed by a primary line up for high detailed drawing. Also, at this researches used the image processing system and algorithm instead of the existing a primary hand-line up. and fiber input array and waveguide chip formed in line by automatic. Therefore, the developed and manufactured optical aligning system in this research fulfills the great role of support industry for major electronics manufacturers, telecommunications companies, universities, government agencies and other research institutions.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.1
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• pp.7-13
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• 2011

According to increasing of data transfer rate, printed circuit board (PCB) is required improvement of transmission speed. Optical PCB and its packaging technology can be one of the solutions that overcome the limitations of conventional electrical PCB. The data transmission capacity will be increased 10 Tbps at 2015. To this end, studies on various OPCB technologies are being conducted. For cost-effective and high- performance OPCB, studies of optical coupling by polymer replication process are conducted. In this work, optical waveguide and optical fiber array block were sequentially fabricated by polymer pattern replication method. Using this method we successfully demonstrate low loss optical fiber coupling between optical waveguide and optical fiber arrays. And researches on flip chip bonding process and using electro-optic connectors for packaging are conducted.