• 제목/요약/키워드: Optical Displacement measurement

검색결과 151건 처리시간 0.018초

레이저 다이오드를 이용한 정현파 위상변조 간섭에 의한 실시간 극미세 진동 측정에 관한 연구 (A study on real time measuring microscopic movements in sinusoidal phase modulating interferometry using a laser diode)

  • 구자남;염정덕;지철근
    • 한국조명전기설비학회:학술대회논문집
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    • 한국조명전기설비학회 1990년도 추계학술발표회논문집
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    • pp.23-27
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    • 1990
  • A new signal processing system for real time displacement measurement in sinusoidal phase modulating interferometry is described. Although sinusoidal phase modulating interferometry is effective in measuring with high accuracy the displacement of an object, conventional signal processing takes a long time. In this method, detection of the object's displacement is easily achieved by sampling the interference signal at those times that satisfy certain conditions and by processing the sampled signals with electric circuits in real time. The delay time of this signal processing system is < 45${\mu}$s. Specially in this paper we describe all electronic circuit and optical system design

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레이저 다이오드를 이용한 정현파 위상변조 간섭에 의한 실시간 극미세 진동 측정에 관한 연구 (A study on real time measuring microscopic movements in sinusoidal phase modulating interferometry using a laser diode)

  • 강성철;진상규;지철근
    • 한국조명전기설비학회:학술대회논문집
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    • 한국조명전기설비학회 1991년도 추계학술발표회논문집
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    • pp.33-37
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    • 1991
  • A now signal precessing system for real time displacement measurement in sinusoidal phase modulating interferometry is described. Although sinusoidal phase modulating interferometry is effective in measuring with high accuracy the displacement of an object, conventional signal processing takes along time. In this method, detection of the object's displacement is easily achieved by sampling the interference signal at those times that satisfy certain conditions and by processing the sampled signals with electric circuits in real time. the delay time of this signal processing system is < 45 $\mu$s. Specially in this paper we describe all electronic circuit and optical system design

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Measurement Resolution of Edge Position in Digital Optical Imaging

  • Lee, Sang-Yoon;Kim, Seung-Woo
    • International Journal of Precision Engineering and Manufacturing
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    • 제1권1호
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    • pp.49-55
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    • 2000
  • The semiconductor industry relies on digital optical imaging for the overlay metrology of integrated circuit patterns. One critical performance demand in the particular application of digital imaging is placed on the edge resolution that is defined as the smallest detectable displacement of an edge from its image acquired in digital from. As the critical feature size of integrated circuit patterns reaches below 0.35 micrometers, the edge resolution is required to be less than 0.01 micrometers. This requirement is so stringent that fundamental behaviors of digital optical imaging need to be explored especially for the precision coordinate metrology. Our investigation reveals that the edge resolution shows quasi-random characteristics, not being simply deduced from relevant opto-electronic system parameters. Hence, a stochastic upper bound analysis is made to come up with the worst edge resolution that can statistically well predict actual indeterminate edge resolutions obtained with high magnification microscope objectives.

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레이저의 간섭무늬를 이용한 리니어 엔코더에 관한 연구 (High resolution Linear Encoder Using Interference Fringe)

  • 박윤창
    • 한국생산제조학회지
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    • 제8권4호
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    • pp.130-135
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    • 1999
  • The main scale of linear encoder greatly effects on the precision of displacement measurement. Especially when needing the long range measurement the length of main scale should be increased accordingly. In this paper we propose a linear encoder that uses laser interference pattern as main scale for long range measurement. The linear encoder is similar to Michelson interferometer excepting that the reference mirror is tilted so as to obtain interference fringe pattern and a grating panel is attached on a quadratic photo diodes. Four kinds of grating having phase difference of 0. $\pi$/4, $\pi$/2, 3$\pi$/4 are arranged on the panel. The experimental results show that signals of quadratic photo diode A, B, {{{{ {-}atop {A } }}}} and {{{{ {- } atop {B } }}}} are cosine wavelike and successive signals have phase difference of $\pi$/4 each other. So the proposed method can achieve improved measurement resolution.

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레이저를 이용한 광학식 리니어 스케일의 분해능 향상에 관한 연구 (High resolution linear scale using collimated LASER)

  • 박윤창;정경민
    • 한국공작기계학회:학술대회논문집
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    • 한국공작기계학회 1999년도 춘계학술대회 논문집
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    • pp.170-174
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    • 1999
  • The main scale of linear scale greatly affects on the precision of displacement measurement. Especially when needing the long range measurement, the length of main scale should be increased accordingly. In this paper, we propose a linear scale that uses laser interference pattern as main scale for long range measurement. The linear scale is similar to Michelson interferometer excepting that the reference mirror is tilted so as to obtain interference fringe pattern and a grating panel is attached on a quadratic photo diodes. Four kinds of grating having phase differences of 0, $\pi$ /4, $\pi$ /2, 3 $\pi$ /4 are arranged on the panel. The experimental results show that signals of - quadratic photo diode, A, B,$\overline{A}$ and $\overline{B}$ are cosine wavelike and successive signals have phase difference of $\pi$/4 each other. So the proposed method can achieve improved measurement resolution.

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영상처리기법을 이용한 CCT 시편 균열의 자동관측법에 관한 연구 (The Measurement of the Crack in CCT Specimen Using the Image Processing Techniques)

  • 이현우;문기태;오세종;정병우
    • 대한기계학회논문집A
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    • 제21권3호
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    • pp.528-533
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    • 1997
  • In the analysis of fatigue crack propagation behavior, the crack length is one of the most important factors. In the test of crack propagation, compliance method is widely used to detect crack length. The measurement of surface crack length is not so easy with compliance method. In this study, the image processing technique was applied to measure the surface crack length. CCD(Charge-coupled device) camera was used to observe the crack image and the computer program to detect crack length from stored crack image was developed. CCT(Center Cracked Tension) specimen was used to compare the compliance method with the image processing technique. The crack length which detected by the image processing techniques was found to be well consistent with that from the optical measurement.

헤테로코어 광파이버 노출형 센서모듈과 계측 지연현상 (Hetero-core Optical Fiber Exposure Sensor Module and Instrumentation Delay)

  • 송영용;박익태;이환우
    • 한국전산구조공학회논문집
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    • 제32권6호
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    • pp.401-408
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    • 2019
  • 본 연구는 헤테로코어 광파이버 센서를 활용하여 콘크리트 내부에서 발생되는 변형률의 측정을 통해 콘크리트의 프리스트레스를 직접 평가할 수 있는 새로운 매립형 센서모듈 개발을 최종 목표로 하고 있다. 이를 위하여 노출형 센서모듈을 이용한 성능발현 실험결과는 가력속도 0.12, 1.80mm/min일 때 52.1, 2.6sec로 최대 약 19배의 계측 지연현상이 발생하였다. 계측 지연현상은 구조물의 실시간 변화 상태를 계측하지 못하는 경우로 실시간 계측이 가능한 센서모듈의 개발을 위해서 추가실험이 필요한 것으로 판단하였다. 계측 지연현상 원인규명 실험은 3가지의 실험을 계획하였으며, 실험결과는 마찰저항에 의한 계측 지연이 지배적으로 확인되었다. 마찰이 제거된 장치를 이용한 센서모듈의 실험결과에서는 계측 지연현상이 나타나지 않은 것으로 확인되었다.

광변위 계측과 주행하중시험기법에 의한 교량구조의 손상도 추정기법 (Damage Assessment Technique for Bridge Structures By Moving Load Tests and Optical Displacement Measurements)

  • 이형진;김종훈
    • 한국산학기술학회논문지
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    • 제16권1호
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    • pp.769-777
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    • 2015
  • 본 논문에서는 교량 구조의 유지관리에서 계측정보 부족 문제를 극복하기 위하여 주행하중 시험법과 광변위 계측을 이용하는 손상도 추정기법에 대한 연구를 수행하였다. 이 방법을 통한 연속적 계측 변위는 손상 추정을 보다 간단하며 실제적이도록 할 수 있다. 제안된 기법에 의한 대형 사회기간시설물에 대한 보다 현실적인 손상 추정 방법으로의 가능성과 이 방법의 효율성과 정확도를 보이기 위하여 수치모의실험과 실험적 연구가 수행되었다. 예제해석 결과는 실험적 방법에서도 구해진 손상도들이 충분한 정확도를 가지고 있고 특히 실제 손상위치에서는 정확한 값과 거의 같음을 나타내고 있다. 이는 제안된 방법이 손상위치 추정이나 손상정도 추정에 모두 유용하고 실제 현장에서 구현 가능한 실용성이 충분하다는 의미로 해석된다.

Passive 3D motion optical data in shaking table tests of a SRG-reinforced masonry wall

  • De Canio, Gerardo;de Felice, Gianmarco;De Santis, Stefano;Giocoli, Alessandro;Mongelli, Marialuisa;Paolacci, Fabrizio;Roselli, Ivan
    • Earthquakes and Structures
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    • 제10권1호
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    • pp.53-71
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    • 2016
  • Unconventional computer vision and image processing techniques offer significant advantages for experimental applications to shaking table testing, as they allow the overcoming of most typical problems of traditional sensors, such as encumbrance, limitations in the number of devices, range restrictions and risk of damage of the instruments in case of specimen failure. In this study, a 3D motion optical system was applied to analyze shake table tests carried out, up to failure, on a natural-scale masonry structure retrofitted with steel reinforced grout (SRG). The system makes use of wireless passive spherical retro-reflecting markers positioned on several points of the specimen, whose spatial displacements are recorded by near-infrared digital cameras. Analyses in the time domain allowed the monitoring of the deformations of the wall and of crack development through a displacement data processing (DDP) procedure implemented ad hoc. Fundamental frequencies and modal shapes were calculated in the frequency domain through an integrated methodology of experimental/operational modal analysis (EMA/OMA) techniques with 3D finite element analysis (FEA). Meaningful information on the structural response (e.g., displacements, damage development, and dynamic properties) were obtained, profitably integrating the results from conventional measurements. Furthermore, the comparison between 3D motion system and traditional instruments (i.e., displacement transducers and accelerometers) permitted a mutual validation of both experimental data and measurement methods.

Study on the Improvement of the Image Analysis Speed in the Digital Image Correlation Measurement System for the 3-Point Bend Test

  • Choi, In Young;Kang, Young June;Hong, Kyung Min;Kim, Seong Jong;Lee, Gil Dong
    • Journal of the Optical Society of Korea
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    • 제18권5호
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    • pp.523-530
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    • 2014
  • Machine material and structural strain are critical factors for appraising mechanical properties and safety. Particularly in three and four-point bending tests, which appraise the deflection and flexural strain of an object due to external force, measurements are made by the crosshead movement or deflection meter of a universal testing machine. The Digital Image Correlation (DIC) method is one of the non-contact measurement methods. It uses the image analyzing method that compares the reference image with the deformed image for measuring the displacement and strain of the objects caused by external force. Accordingly, the advantage of this method is that the object's surface roughness, shape, and temperature have little influence. However, its disadvantage is that it requires extensive time to compare the reference image with the deformed image for measuring the displacement and strain. In this study, an algorithm is developed for DIC that can improve the speed of image analysis for measuring the deflection and strain of an object caused by a three-point bending load. To implement this algorithm for improving the speed of image analysis, LabVIEW 2010 was used. Furthermore, to evaluate the accuracy of the developed fast correlation algorithm, the deflection of an aluminum specimen under a three-point bending load was measured by using the universal test machine and DIC measurement system.