• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.11a
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• pp.360-361
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• 2005

Rapid progress in IC fabrication technology has strong demand in polishing of silicon wafer to meet the tight specification of nanotopography and surface roughness. One of the important issues in Si CMP is the stabilization of polishing pad. If a polishing pad is not stabilized before main Si wafer polishing process, good polishing result can not be expected. Therefore, new pad must be subjected into break-in process using dummy wafers for a certain period of time to enhance its performance. After the break-in process, the main Si wafer polishing process must be performed. In this study, the characteristics of break-in process were investigated in Si wafer polishing. Viscoelastic behavior, temperature variation of pad and friction were measured to evaluate the break-in phenomenon. Also, it is found that the characteristic of the break-in seems to be related to viscoelastic behavior of pad.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.17 no.3
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• pp.622-628
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• 2016

As the suction pad-supporting bike carrier attached to a car may be subject to an excessive dynamic load due to random vibrations and centrifugal forces during driving, its structural safety is of great concern. To examine this, the finite-element method with a fluid-structure interaction should be used because the pressure on the pad bottom is changed in real time according to the fluctuations of the force or the moment applied on the pad. This method, however, has high computing costs in terms of modeling efforts and software expense. Moreover, the accuracy of computation is not easily guaranteed. Therefore, a new method combining the experiment and computation is proposed in this paper: the bottom pressure and contact area of the pad under varying loads was measured in real time and the acquired data are then used in the nonlinear elastic finite-element calculations. The computational and experimental results obtained with the product under development showed that the safety margin of the pad under the axial loading is relatively sufficient, whereas with an excessive rotational loading, the pad is vulnerable to separation or a local surface damage; hence, the safety margin may not be secured. The predicted contact behavior under the variation of the magnitude and type of the loading were in good agreement with the one from the experiment. The proposed analysis method in this study could be used in the design of similar vacuum pad systems.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.18 no.4
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• pp.313-320
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• 2005

Stick-slip friction is one of the material removal mechanisms in tribology. It occurs when the static friction force is larger than the dynamic friction force, and make the friction curve fluctuated. In the friction monitoring of chemical mechanical polishing(CMP), the friction force also vibrates just as stick-slip friction. In this paper, an attempt to show the similarity between stick-slip friction and the friction of CMP was conducted. The prepared hard pa(IC1000/Suba400 stacked/sup TM/) and soft pad(Suba400/sup TM/) were tested with SiO₂ slurry. The friction force was measured by piezoelectric sensor. According to this experiment, it was shown that as the head and table velocity became faster, the stick-slip time shortened because of the change of real contact area. And, the gradient of stick-slip period as a function of head and table speed in soft pad was more precipitous than that of hard one. From these results, it seems that the fluctuating friction force in CMP is stick-slip friction caused by viscoelastic behavior of the pad and the change of real contact area.

• Transactions of Materials Processing
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• v.13 no.3
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• pp.225-229
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• 2004

Chemical Mechanical Polishing(CMP) process becomes one of the most important semiconductor processes. But the basic mechanism of CMP still does not established. Slurry fluid dynamics that there is a slurry film between a wafer and a pad and contact mechanics that a wafer and a pad contact directly are the two main studies for CMP. This paper based on the latter one, especially on the abrasion wear model. Material Removal Rate(MRR) is calculated using the trajectory length of every point on a wafer during the process time. Both the rotational velocity of a wafer and a pad and the wafer oscillation velocity which has omitted in other studies are considered. For the purpose of the verification of our simulation, we used the experimental results of S.H.Li et al. The simulation results show that the tendency of the calculated MRR using the relative velocity is very similar to the experimental results and that the oscillation effect on MRR at a real CMP condition is lower than 1.5%, which is higher than the relative velocity effect of wafer, and that the velocity factor. not the velocity itself, should be taken into consideration in the CMP wear model.

• Proceedings of the KSME Conference
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• 2004.04a
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• pp.519-524
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• 2004

This study is concerned with the braking distance estimation using frictional energy rate. First, steady state rolling analysis is performed, and using this result, the braking distance is estimated. Dynamic rolling analysis during entire braking time period is impratical, so that this study divides the vehicle velocity by 10km/h to reduce the analysis time. The multiplication of the slip rate and the shear stress provides the frictional energy rate. Using frictional energy rate, total braking distance is estimated, In addition, ABS(Anti-lock Brake System) is considered, and two type of slip ratios are compared, One is 15% slip ratio for the ABS condition, and the other is 100% slip ratio which leads lo the almost same braking distance as the elementary kinematic theory. A slip ratio is controlled by angular velocity in ABAQUS/Explicit, A 15% slip ratio gives the real vehicle's braking distance when the frictional energy occurred al disk pad is included. Disk pad's frictional energy rate is calculated by the theoretical approach.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.28 no.5
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• pp.617-623
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• 2004

This paper describes a dynamic thermal model for a representative dual axis rotational Chemical-Mechanical Polishing (CMP) tool. The model is one-dimensional but configured in the two-dimensional space and consists of three sub-models (pad, wafer and slurry fluid), with the first and the second that are time-dependent heat conduction-convection models with linear stationary (wafer) and nonlinear moving (pad) boundary conditions, and the last one that is a heat transport-convection model (slurry fluid). The modeling approach is validated by comparing the simulation results with available experimental data.

• Journal of the Korean Institute of Intelligent Systems
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• v.20 no.1
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• pp.76-80
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• 2010

It is floating to security of information and the early assignment that it is important it processes and to transmit in inundations of information that I changed suddenly. I used the encryption/decryption process that applied simple substitution and mathematical calculation algorithm at theory and encryption transmission steps protective early information. Hardware and financial loss are using spurious random number to be satisfied with the random number anger that isn't real random number to size so much perfect information protection using One-time pad for applying this. I was transformed into serial test under a test to prove spurious random number anger, and it is into random number anger stronger, and the transformation serial test that proposes is proving it in algorithm speed and efficiency planes.

• KSII Transactions on Internet and Information Systems (TIIS)
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• v.2 no.1
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• pp.5-21
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• 2008

In order to securely transmit multicast data packets in a mobile environment where frequent join/leave events are a characteristic of the environment, there is a need for a new secure and efficient group key management solution. We propose a secure group key generation/distribution solution providing scalability and reliability. Using this solution, when a mobile node, which is in a multicast session, enters a new domain, the agent of the domain joins the multicast session and coordinates its data packets with the mobile node. The agent encrypts and transmits subsequent data packets to the mobile node, using a local one-time pad key. This key is generated with FI sequences, enabling the mobile node to regenerate the same data packet, based on the information sent by the agent. Our performance analysis demonstrates that the proposed solution can significantly reduce the number of key generations and distributions, when it is applied to the hierarchical mobile IPv6 network.

• Journal of Digital Convergence
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• v.11 no.11
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• pp.389-395
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• 2013

As fusing IT and medical technique, the number of patients who adhere medical equipment inside of them is increasing. However there is a problem of for the third person to tap or modulate the patient's biometric data viciously. This paper suggests quantum encryption-based key distribution model to share key for the third person not to tap or modulate the patient's biometric data between patient and hospital staff. The proposed model uses one-time pad key that shares key sending random bits not direct sending message of quantum data. Also, it guarantees patient's anonymity because the biometric data of injected-device in the body doesn't be exposed unnecessarily.

• Journal of the Korea Institute of Information Security & Cryptology
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• v.7 no.2
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• pp.27-42
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• 1997

We propose a new authentication and key distribution protocol which is efficient and reliable for password-based systems. Various guessing attacks have been detected in applying conventional protocols to the password-based systems and additional overheads have been made in refined protocols to defeat those attacks. Using a one-time pad and a strong hash function, our proposed protocol promotes reliability and efficiency. Compared with other protocols, our protocol is secure against various protocol attacks including guessing attacks. In addition, this protocol is efficient in reducing communication and computation costs.