A Study on the Characteristics of Stick-slip Friction in CMP
![]() |
Lee, Hyunseop
(부산대학교 정밀기계공학과)
Park, Boumyoung (부산대학교 정밀기계공학과) Seo, Heondeok (부산대학교 정밀기계공학과) Park, Kihyun (부산대학교 정밀기계공학과) Jeong, Haedo (부산대학교 정밀정형 및 금형가공 연구소) |
1 | Israelachvili, J. N. and Wennerstrom, 'Hydration or steric forces between amphihilic surfaces', Langmuir, Vol. 6, p. 873, 1990 |
2 | 김구연, 김형재, 박범영, 이현섭, 박기현, 정해도, 'CMP 연마입자의 마찰력과 연마율에 관한 영향', 전기전자재료학회논문지, 17권,10 호, .p 1049, 2004 |
3 | P. Powell, 'Engineering with polymers', Champman and Hall, New York, p. 89, 1983 |
4 | 이충훈, 송형수, 명중재, 박진구, '반도체 평탄화 CMP 기술', 북스힐, p. 100, 2001 |
5 | H. J. Kim, 'A Study on the Interfacial Characteristics and Its Effect on Material Removal in CMP' , ph. D. qualifying dissertation of Pusan National University, p. 62, 2003 |
6 | Naga Chandrasekaran, 'Material removal mechanism of oxide and nitride CMP with ceria and silica-based slurries - analysis of slurry particles pre-and post-dielectric CMP', Mat. Res. Soc. Symp. Proc., Vol. 816, PP K9.2.1- K9.2.12, 2004 |
7 | 박범영, 이현섭, 김형재, 서헌덕, 김구연, 정해도, 'CMP 결과에 영향을 미치는 마찰 특성에 관한 연구', 전기전자재료학회논문지, 17권, 10호, p. 1041, 2004 |
8 | Ara Philipossian and Scott Olsen , 'Effect of slurry flow rate on pad life during interlayer dielectric CMP', J. Electrochem. Soc., Vol. 151, No.6, p. 436, 2004 |
9 | Rabinowich, 'Friction and Wear of Materials', John Wiley, Chap. 4, 1965 |
10 | McClelland, 'Adhesion and Friction', Springer, 1989 |
11 | McClelland and Cohen, 'Chemistry and Physics of Solid Surfaces VII', Springer, 1990 |
12 | Bo N. J. Persson, 'Sliding Friction', Springer, 2000 |
13 | Tomlinson, 'A molecular theory of friction', Philos. Mag., Vol. 7, p. 905, 1929 |
![]() |