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http://dx.doi.org/10.3795/KSME-A.2004.28.5.617

A Dynamic Thermal Modeling of Chemical Mechanical Polishing Process  

Seok, Jong-Won (삼성전자주식회사)
Publication Information
Transactions of the Korean Society of Mechanical Engineers A / v.28, no.5, 2004 , pp. 617-623 More about this Journal
Abstract
This paper describes a dynamic thermal model for a representative dual axis rotational Chemical-Mechanical Polishing (CMP) tool. The model is one-dimensional but configured in the two-dimensional space and consists of three sub-models (pad, wafer and slurry fluid), with the first and the second that are time-dependent heat conduction-convection models with linear stationary (wafer) and nonlinear moving (pad) boundary conditions, and the last one that is a heat transport-convection model (slurry fluid). The modeling approach is validated by comparing the simulation results with available experimental data.
Keywords
CMP; Dynamic Thermal Modeling; Material Removal Model; Transient Thermal Analysis;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
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