• Title/Summary/Keyword: On-chip inductor

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Study on the Vision Algorithm for the Inspection of RF-Chip Inductor (RF-Chip Inductor 외관검사 알고리즘에 관한 연구)

  • 김기순;김기영;김준식
    • Proceedings of the Korea Institute of Convergence Signal Processing
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    • 2000.08a
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    • pp.261-264
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    • 2000
  • 본 논문에서는 이동 통신용 단말기에 주로 사용되는 RF-chip inductor의 자동 외관검사를 위한 시스템 개발에 필요한 알고리즘을 제안하였다. 본 논문에서 제안한 방법은 영상취득 후 처리과정에서 동적 이진화 방법, 가산투영 등 영상처리에 관련된 방법을 이용해 코일 부분과 코어부분을 분리한 후 세선화 방법, 라벨링 방법 등을 적용하여 분리된 코일부분에 대해 코일의 감긴 회수와 피치간격의 불균일 검사를 수행하고 기준값 이상의 오차를 갖는 소자를 불량으로 처리하는 보다 개선된 처리방법을 제안하였으며 모의실험을 통해 성능을 검증하였다.

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A Design of Low Noise RF Front-End by Improvement Q-factor of On-Chip Spiral Inductor (On-Chip 나선형 인덕터의 품질계수 향상을 통한 저잡음 RF 전치부 설계)

  • Ko, Jae-Hyeong;Jung, Hyo-Bin;Choi, Jin-Kyu;Kim, Hyeong-Seok
    • The Transactions of The Korean Institute of Electrical Engineers
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    • v.58 no.2
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    • pp.363-368
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    • 2009
  • In the paper, we confirmed improvement Noise figure of the entire RF front-end using spiral inductor with PGS(Patterned Ground Shield) and current bleeding techniques. LNA design is to achieve simultaneous noise and input matching. Spiral inductor in input circuit of LNA inserted PGS for betterment of Q-factor. we modeling inductor using EM simulator, so compared with inductor of TSMC 0.18um. We designed and simulation the optimum structure of PGS using Taguchi's method. We confirmed enhancement of noise figure at LNA after substituted for inductor with PGS. Mixer designed using current bleeding techniques for reduced noise. We designed LNA using inductor with PGS and Mixer using current bleeding techniques, so confirmed improvement of noise figure.

Double rectangular spiral thin-film inductors implemented with NiFe magnetic cores for on-chip dc-dc converter applications (이중 나선형 NiFe 자성 박막인덕터를 이용한 원칩 DC-DC 컨버터)

  • Lee, Young-Ae;Kim, Sang-Gi;Do, Seung-Woo;Lee, Yong-Hyun
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2009.11a
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    • pp.71-71
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    • 2009
  • This paper describes a simple, on-chip CMOS compatible the thin-film inductor applied for the dc-dc converters. A fully CMOS-compatible thin-film inductor with a bottom NiFe core is integrated with the DC-DC converter circuit on the same chip. By eliminating ineffective top magnetic layer, very simple process integration was achieved. Fabricated monolithic thin film inductor showed fairly high inductance of 2.2 ${\mu}H$ and Q factor of 11.2 at 5MHz. When the DC-DC converter operated at $V_{in}=3.3V$ and 5MHz frequency, it showed output voltage $V_{out}=8.0V$, and corresponding power efficiency was 85%.

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On-chip Inductor Modeling in Digital CMOS technology and Dual Band RF Receiver Design using Modeled Inductor

  • Han Dong Ok;Choi Seung Chul;Lim Ji Hoon;Choo Sung Joong;Shin Sang Chul;Lee Jun Jae;Shim SunIl;Park Jung Ho
    • Proceedings of the IEEK Conference
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    • 2004.08c
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    • pp.796-800
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    • 2004
  • The main research on this paper is to model on-chip inductor in digital CMOS technology by using the foundry parameters and the physical structure. The s-parameters of a spiral inductor are extracted from the modeled equivalent circuit and then compared to the results obtained from HFSS. The structure and material of the inductor used for modeling in this work is identical with those of the inductor fabricated by CMOS process. To show why the modeled inductor instead of ideal inductor should be used to design a RF system, we designed dual band RF front-end receiver and then compared the results between when using the ideal inductor and using the modeled inductor.

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A Simple Model Parameter Extraction Methodology for an On-Chip Spiral Inductor

  • Oh, Nam-Jin;Lee, Sang-Gug
    • ETRI Journal
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    • v.28 no.1
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    • pp.115-118
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    • 2006
  • In this letter, a simple model parameter extraction methodology for an on-chip spiral inductor is proposed based on a wide-band inductor model that incorporates parallel inductance and resistance to model skin and proximity effects, and capacitance to model the decrease in series resistance above the frequency near the peak quality factor. The wide-band inductor model does not require any frequency dependent elements, and model parameters can be extracted directly from the measured data with some curve fitting. The validity of the proposed model and parameter extraction methodology are verified with various size inductors fabricated using $0.18\;{\mu}m$ CMOS technology.

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A Study on the Vision Algorithm for the Inspection of very small RF-Chip Inductor (초소형 RF-chip inductor의 외관 검사 알고리즘에 관한 연구)

  • Kim Kee-Soon;Kim Gi-Young;Kim Joon-Seek
    • Journal of the Institute of Convergence Signal Processing
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    • v.1 no.1
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    • pp.89-96
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    • 2000
  • In this paper, we propose a vision algorithm for the inspection of very small RF-chip inductor which is used in mobile-communication terminal. The proposed method divides coil part from the inductor body by local adaptive thresholding and integral projection method. After dividing work, the coil components are extracted by thinning and labelling techniques. The test items are the number of turns, the intervals in coil, and the measure of uniformity between the extracted lines. If the values of these are more than the specific value a tested product is decided bad one. In the simulation, the proposed method has a good performance.

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An On-Chip Differential Inductor and Its Use to RF VCO for 2 GHz Applications

  • Cho, Je-Kwang;Nah, Kyung-Suc;Park, Byeong-Ha
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.4 no.2
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    • pp.83-87
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    • 2004
  • Phase noise performance and current consumption of Radio Frequency (RF) Voltage-Controlled Oscillator (VCO) are largely dependent on the Quality (Q) factor of inductor-capacitor (LC) tank. Because the Q-factor of LC tank is determined by on-chip spiral inductor, we designed, analyzed, and modeled on-chip differential inductor to enhance differential Q-factor, reduce current consumption and save silicon area. The simulated inductance is 3.3 nH and Q-factor is 15 at 2 GHz. Self-resonance frequency is as high as 13 GHz. To verify its use to RF applications, we designed 2 GHz differential LC VCO. The measurement result of phase noise is -112 dBc/Hz at an offset frequency of 100 kHz from a 2GHz carrier frequency. Tuning range is about 500 MHz (25%), and current consumption varies from 5mA to 8.4 mA using bias control technique. Implemented in $0.35-{\mu}m$ SiGe BiCMOS technology, the VCO occupies $400\;um{\times}800\;um$ of silicon area.

A Small-Area Solenoid Inductor Based Digitally Controlled Oscillator

  • Park, Hyung-Gu;Kim, SoYoung;Lee, Kang-Yoon
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.13 no.3
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    • pp.198-206
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    • 2013
  • This paper presents a wide band, fine-resolution digitally controlled oscillator (DCO) with an on-chip 3-D solenoid inductor using the 0.13 ${\mu}m$ digital CMOS process. The on-chip solenoid inductor is vertically constructed by using Metal and Via layers with a horizontal scalability. Compared to a spiral inductor, it has the advantage of occupying a small area and this is due to its 3-D structure. To control the frequency of the DCO, active capacitor and active inductor are tuned digitally. To cover the wide tuning range, a three-step coarse tuning scheme is used. In addition, the DCO gain needs to be calibrated digitally to compensate for gain variations. The DCO with solenoid inductor is fabricated in 0.13 ${\mu}m$ process and the die area of the solenoid inductor is 0.013 $mm^2$. The DCO tuning range is about 54 % at 4.1 GHz, and the power consumption is 6.6 mW from a 1.2 V supply voltage. An effective frequency resolution is 0.14 kHz. The measured phase noise of the DCO output at 5.195 GHz is -110.61 dBc/Hz at 1 MHz offset.

A 6Gbps 1:2 Demultlplexer Design Using Micro Stacked Spiral inductor in CMOS Technology (Micro Stacked Spiral Inductor를 이용한 6Gbps 1:2 Demultiplexer 설계)

  • Choi, Jung-Myung;Burm, Jin-Wook
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.45 no.5
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    • pp.58-64
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    • 2008
  • A 6Gbps 1:2 demultiplexer(DEMUX) IC using $0.18{\mu}m$ CMOS was designed and fabricated. For high speed performance current mode logic(CML) flipflop was used and inductive peaking technology was used so as to obtain higher speed than conventional Current mode logic flipflop. On-chip spiral inductor was designed to maximize the inductive peaking effect using stack structure. Total twelve inductors of $100{\mu}m^2$ area increase was used. The measurement was processed on wafer and 1:2 demultiplexer with and without micro stacked spiral inductors were compared. For 6Gbps data rate measurement, eye width was improved 7.27% and Jitter was improved 43% respectively. Power consumption was 76.8mW and eye height was 180mV at 6 Gbps