• Journal of the Korea Institute of Information and Communication Engineering
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• v.18 no.1
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• pp.103-108
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• 2014

The flash memory which is exploited on hand-held devices such as smart phones is a non-volatile storage and has the benefit that it can store mass data at a small sized chip. To process queries on the mass data stored in the flash memory, the index scheme should be exploited. However, since the write operation of the flash memory is slower than the read operation and the overwrite is not supported, it is required to reevaluate the performance of the index and find out the drawbacks. In this paper, we evaluate the performance of a space division typed index scheme on the flash memory. To do this, we implement the fixed grid file and measure the average speeds of the query and update processing on a various condition and compare the value of the flash memory with that of the magnetic disk.

• JSTS:Journal of Semiconductor Technology and Science
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• v.17 no.4
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• pp.505-513
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• 2017

As mobile systems are performing various functionality in the IoT (Internet of Things) era, network-on-chip (NoC) plays a pivotal role to support communication between the tens and in the future potentially hundreds of interacting modules in system-on-chips (SoCs). Owing to intensive research efforts more than a decade, NoCs are now widely adopted in various SoC designs. Especially, studies on application-specific NoCs (ASNoCs) that consider the heterogeneous nature of modern SoCs contribute a significant share to use of NoCs in actual SoCs, i.e., ASNoC connects non-uniform processing units, memory, and other intellectual properties (IPs) using flexible router positions and communication paths. Although it is not difficult to find the prior works on ASNoC synthesis and optimization, little research has addressed the issues how to convert different protocols and data widths to make a NoC compatible with various IPs. Thus, in this paper, we address important issues on ASNoC implementation to support and convert multiple interfaces. Based on the in-depth discussions, we finally introduce our FPGA-proven full-custom ASNoC.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.4
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• pp.45-50
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• 2012

A family of multi-die DRAM packages was developed that incorporate the full functionality of an SODIMM into a single package. Using a common ball assignment analogous to the edge connector of an SODIMM, a broad range of memory types and assembly structures are supported in this new package. In particular DDR3U, LPDDR3 and DDR4RS are all supported. The center-bonded DRAM use face-down wirebond assembly, while the peripherybonded LPDDR3 use the face-up configuration. Flip chip assembly as well as TSV stacked memory is also supported in this new technology. For the center-bonded devices (DDR3, DDR4 and LPDDR3 ${\times}16$ die) and for the face up wirebonded ${\times}32$ LPDDR3 devices, a simple manufacturing flow is used: all die are placed on the strip in a single machine insertion and are sourced from a single wafer. Wirebonding is also a single insertion operation: all die on a strip are wirebonded at the same time. Because the locations of the power signals is unchanged for these different types of memories, a single consolidated set of test hardware can be used for testing and burn-in for all three memory types.

• Journal of the Korean Magnetics Society
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• v.18 no.3
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• pp.103-108
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• 2008

Magnetoresistive random access memory (MRAM) don't get very public face on the field of non-volatile memory. Because recording capacity of MRAM is smaller than other non-volatile memory and structurally, magnetic efficiency of MRAM is very bad. We diminish a size of one cell in order to make MRAM of high recording capacity. But It don't make high recording field in general structures consisting of two current wire. Accordingly, We make a cell of small size is impossible. In this paper, we suggest new MRAM that it have two pole of high permeability on both ends of recording layer. Because magnetic efficiency of new MRAM is higher than exiting MRAM, it can make high recording field. And we can diminish the size of one cell due to recording layer of high coercivity. We used three-dimension finite element method to prove the reliability.

• Nuclear Engineering and Technology
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• v.53 no.10
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• pp.3327-3334
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• 2021

Present electric grids are advanced to integrate smart grids, distributed resources, high-speed sensing and control, and other advanced metering technologies. Cybersecurity is one of the challenges of the smart grid and nuclear plant digital system. It affects the advanced metering infrastructure (AMI), for grid data communication and controls the information in real-time. The research article is emphasized solving the nuclear and smart grid hardware security issues with the integration of field programmable gate array (FPGA), and implementing the latest Time Authenticated Cryptographic Identity Transmission (TACIT) cryptographic algorithm in the chip. The cryptographic-based encryption and decryption approach can be used for a smart grid distribution system embedding with FPGA hardware. The chip design is carried in Xilinx ISE 14.7 and synthesized on Virtex-5 FPGA hardware. The state of the art of work is that the algorithm is implemented on FPGA hardware that provides the scalable design with different key sizes, and its integration enhances the grid hardware security and switching. It has been reported by similar state-of-the-art approaches, that the algorithm was limited in software, not implemented in a hardware chip. The main finding of the research work is that the design predicts the utilization of hardware parameters such as slices, LUTs, flip-flops, memory, input/output blocks, and timing information for Virtex-5 FPGA synthesis before the chip fabrication. The information is extracted for 8-bit to 128-bit key and grid data with initial parameters. TACIT security chip supports 400 MHz frequency for 128-bit key. The research work is an effort to provide the solution for the industries working towards embedded hardware security for the smart grid, power plants, and nuclear applications.

• Proceedings of the IEEK Conference
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• 2003.07b
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• pp.1141-1144
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• 2003

For proper communication with various types of IC-Card, multiple IC-Card interface complying with the IC-Card standard (ISO7816) is embedded and realized as a peripheral on the 32-bit RISC based system-on-a-chip. It provides the generation of either 3.3V or 5V power supply for the operation of the inserted IC-Card as well. IC-Card interface is divided into an analog front-end (AFE) and a digital back-end (DBE). The embedded DC-DC converters suitable for driving IC-Cards are incorporated in the AFE. The chip design for multiple IC-Card interface is implemented on a standard 0.35${\mu}{\textrm}{m}$ triple-metal double-poly CMOS process and is packaged in a 352-pin plastic ball grid array (PBGA). The total gate count is about 400,000, excluding the internal memory. Die area is 7890${\mu}{\textrm}{m}$ $\times$ 7890${\mu}{\textrm}{m}$.

• JSTS:Journal of Semiconductor Technology and Science
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• v.13 no.2
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• pp.114-126
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• 2013

In this paper, we present a set of methodologies to model the electromagnetic susceptibility (EMS) testing of I/O buffers for mobile system memory based on the bulk current injection (BCI) method. An efficient equivalent circuit model is developed for the current injection probe, line impedance stabilization network (LISN), printed circuit board (PCB), and package. The simulation results show good correlation with the measurements and thus, the work presented here will enable electromagnetic susceptibility analysis at the integrated circuit (IC) design stage.

• Journal of information and communication convergence engineering
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• v.17 no.4
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• pp.279-284
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• 2019

This paper presents processing-node status-based message scattering and gathering algorithms for multi-processor systems on chip to reduce the communication time between processors. In the message-scattering part of the message-passing interface (MPI) scatter function, data transmissions are ordered according to the proposed linear algorithm, based on the processor status. The MPI hardware unit in the root processing node checks whether each processing node's status is 'free' or 'busy' when an MPI scatter message is received. Then, it first transfers the data to a 'free' processing node, thereby reducing the scattering completion time. In the message-gathering part of the MPI gather function, the data transmissions are ordered according to the proposed linear algorithm, and the gathering is performed. The root node receives data from the processing node that wants to transfer first, and reduces the completion time during the gathering. The experimental results show that the performance of the proposed algorithm increases at a greater rate as the number of processing nodes increases.

• Proceedings of the IEEK Conference
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• 2005.11a
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• pp.651-654
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• 2005

In this paper, we designed ECC(Elliptic Curve Cryptographic) Processor with Bus-splitting mothod for embedded SoC. ECC SIP is designed by VHDL RTL modeling, and implemented reusably through the procedure of logic synthesis, simulation and FPGA verification. To communicate with ARM9 core and SIP, we designed SIP bus functional model according to AMBA AHB specification. The design of ECC Processor for platform-based SoC is implemented using the design kit which is composed of many devices such as ARM9 RISC core, memory, UART, interrupt controller, FPGA and so on. We performed software design on the ARM9 core for SIP and peripherals control, memory address mapping and so on.

• Proceedings of the IEEK Conference
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• 2008.06a
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• pp.333-334
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• 2008

With the role of cell phones in today's society as a digital personal assistant as well as the primary tool for personal communication, it is possible to imagine the involvement of cell phones in almost any type of crime. The progression of a criminal investigation can hinge on vital clues obtained from a cell phone. This paper will be concentrated on CDMA system phones and focus on the data extraction for cell phone forensics. Especially, the data acquisition method of JTAG interface access to memory chip will be covered.