• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.27 no.1
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• pp.41-48
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• 2021

In this study, ethylene vinyl acetate (EVA) and low density polyethylene (LDPE) composite films (EVA/LDPE-OSP) containing calcined oyster shell powder (OSP) were prepared using twin-screw extruder as an antimicrobial packaging material. The OSP composite was initially prepared and then incorporated into an EVA/LDPE blend at different ratios (0, 1, 3 and 5%) to develop the EVA/LDPE-OSP composite films. The as-prepared EVA/LDPE-OSP composites films were evaluated using FT-IR, DSC, TGA, OTR, WVTR, SEM and UTM as well as antimicrobial activity was examined using JIS Z 2801:2000 standard. OPS endowed the antimicrobial potency to the composite films against Gram-positive (Staphylococcus aureus) and Gram-negative (Escherichia coli) bacteria. In addition, the incorporation of OSP remarkably enhanced the thermal stability. OSP as a natural biocidal agent can be used as a multifunctional additive in packaging industry such as improving the thermomechanical properties and preventing the microbial contamination of packaged products.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.29 no.2
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• pp.79-86
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• 2023

In this study, poly(lactic acid) (PLA) and Poly(butylene-adipate-co-terephthalate) (PBAT) composite films containing calcined oyster shell powder (OSP) were evaluated for the applicability of antimicrobial packaging. PLA/PBAT-OSP composite films were prepared using twin-screw extruder. The OSP composite was incorporated into PLA/PBAT blend with different ratios (0, 1, 3, 5 and 10%) and the effect of OSP in the PLA/PBAT matrix was evaluated. The PLA/PBAT-OSP composite films were evaluated for properties using FT-IR, SEM, TGA, DSC, UTM, UV-vis, and Contact angle, as well as antimicrobial property was examined according to ISO 22196 - Antimicrobial Plastic Test. As OSP was added, it showed high antimicrobial activities for both Gram-positive (Staphylococcus aureus) and Gram-negative (Escherichia coli) bacteria. On the other hand, it was found that mechanical properties decreased as OSP was added. For the application of PLA/PBAT-OSP composite films as an antimicrobial packaging material, it is necessary to improve the dispersibility of OSP in the PLA/PBAT composite films and their physical properties at the same time.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.1
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• pp.1-9
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• 2007

OSP(organic solderability preservatives) finish has been considered as a very effective process for substituting the metal surface treatment of Ni/Au finish because of lower cost, interface property and environmental issue of OSP finish. However, the discoloration of OSP layer is formed during assembly process consisting of various steps of temperature. The causes of discoloration and the characterization of solder joint were investigated with a degree of discoloration and the assembly process of OSP finished products, which was also compared statistically with that of conventional Ni/Au finished products. As the results, the solution of process trouble for OSP finished products is able to be offered.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.1
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• pp.47-53
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• 2012

Bonding strength of Sn-3.0Ag-0.5Cu solder joint due to degradation characteristic of OSP surface finish was investigated, compared with SnPb finish. The thickness variation and degradation mechanism of organic solderability preservative(OSP) coating were also analyzed with the number of reflow process. To analyze the degradation degree of solder joint strength, FR-4 PCB coated with OSP and SnPb were experienced preheat treatment as a function of reflow number from 1st to 6th pass, respectively. After 2012 chip resistors were soldered with Sn-3.0Ag-0.5Cu on the pre-heated PCB, the shear strength of solder joints was measured. The thickness of OSP increased with increase of the number of reflow pass by thermal degradation during the reflow process. It was also observed that the preservation effect of OSP decreased due to OSP degradation which led Cu pad oxidation. The mean shear strength of solder joints formed on the Cu pads finished with OSP and SnPb were 58.1 N and 62.2 N, respectively, through the pre-heating of 6 times. Although OSP was degraded with reflow process, the feasibility of its application was proven.

• Food Science of Animal Resources
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• v.38 no.4
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• pp.737-748
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• 2018

We evaluated the physicochemical and storage characteristics of Hanwoo Tteokgalbi treated with onion skin powder (OSP) and blackcurrant fruit powder (BFP). The experimental design included seven treatments: a control (ascorbic acid 0.1%), T1: OSP 0.3%, T2: OSP 0.6%, T3: BFP 0.3%, T4: BFP 0.6%, T5: OSP 0.15%+BFP 0.15%, and T6: OSP 0.3%+BFP 0.3%. The OSP was higher in both polyphenol and flavonoid contents compared to BFP (p<0.05). The moisture and ash contents of all Tteokgalbi samples with a large amount of added natural antioxidant powder (0.6%) were higher than those with small amounts of added antioxidant (0.3%). The cooking loss and water holding capacity were outstanding in the T2 treatment compared to the others (p<0.05). The lightness, redness, and yellowness values were reduced on the addition of 0.6% antioxidant powder (p<0.05). The springiness and cohesiveness values of the Tteokgalbi samples were higher for the 0.3% addition than the control and 0.6% addition (p<0.05). The Tteokgalbi samples with natural antioxidants showed similar sensory attribute scores compared to the control. The pH values reduced as the BFP increased (p<0.05), and the total microbial count increased after OSP addition. The 2-thiobarbituric acid reactive substance values of the samples treated with OSP were significantly lower than the control after day 10 (p<0.05). As a result, the addition of OSP or BFP did not have a significant negative influence on the quality characteristics of Hanwoo Tteokgalbi. In particular, the addition of 0.6% OSP was effective in increasing water retentivity and inhibiting lipid oxidation.

• Journal of the Korea Institute of Information Security & Cryptology
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• v.20 no.6
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• pp.97-109
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• 2010

Although the primary liability for online copyright infringement may fall on the individual who illegally copies, transfers, and/or distributes the copyrighted content, the issue of indirect liability for Online Service Providers (OSPS) that provide a channel for the distribution of illegal content has recently come under the spotlight. Currently, in an effort to avoid liability for indirect copyright infringement and improve their reputation, most OSPs have voluntarily applied filtering technology. Under the Copyright Act of Korea, special types of OSPS including P2P and Web-based Hard Drive (WebHard) are required to incorporate filtering technology, and may be charged with penalties if found without one. However, despite the clear need for filtering mechanisms, several arguments have been set forth that question the efficacy and appropriateness of the system. As such, this paper discusses the liability theory adopted in the US. -a leader in internet technology development-and analyzes the scope of liability and filtering related regulations in our copyright law. In addition, this paper considers the current applications of filtering as well as limits of the applied filtering technology in OSPS today. Finally, we make four suggestions to improve filtering in Korea, addressing issues such as clarifying the limits and responsibilities of OSPS, searching for cooperative solutions between copyright holders and OSPS, standardizing the filtering technology to enable compatibility among different filtering techniques, and others.

• Proceedings of the PSK Conference
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• 2005.11a
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• pp.231-232
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• 2005

Bacteria of Shigella spp. are responsible for shigellosis in humans, a disease characterized by destruction of the colonic epithelium that is induced by the inflammatory response elicited by invasive bacteria. They use a type III secretion system injecting effector proteins into host cells to induce their entry into epithelial cells and triggers apoptosis in macrophages. We present evidence that the effector OspG is a protein kinase that binds various ubiquitinylated ubiquitin-conjugating enzymes (E2s) and blocks degradation of phospho-$I{\kappa}B{\alpha}$ induced upon entry of bacteria into epithelial cells. Transfection experiments confirmed that OspG interferes with the $NF-{\kappa}B$ activation patway by preventing phospho-$I{\kappa}B{\alpha}$ degradation, suggesting that OspG inactivates a component of the $SCF^{{\beta}-TrCP}$ ubiquitin ligase complex (E3) involved in phospho-$I{\kappa}B{\alpha}$ ubiquitination. Upon infection of ileal loops in rabbits, the ospG mutant induced a stronger inflammatory response compared with the wild-type strain, indicating that OspG down-regulates the host innate response induced by invasive bacteria.

• Journal of Microbiology and Biotechnology
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• v.27 no.3
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• pp.610-615
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• 2017

When Shigella infect host cells, various effecter molecules are delivered into the cytoplasm of the host cell through the type III secretion system (TTSS) to facilitate their invasion process and control the host immune responses. Among these effectors, the S. flexneri effector OspF dephosphorylates mitogen-activated protein kinases and translocates itself to the nucleus, thus preventing histone H3 modification to regulate expression of proinflammatory cytokines. Despite the critical role of OspF, the mechanism by which it localizes in the nucleus has remained to be elucidated. In the present study, we identified a potential small ubiquitin-related modifier (SUMO) modification site within OspF and we demonstrated that Shigella TTSS effector OspF is conjugated with SUMO in the host cell and this modification mediates the nuclear translocation of OspF. Our results show a bacterial virulence factor can exploit host post-translational machinery to execute its intracellular trafficking.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.3
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• pp.25-29
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• 2014

Plasma organic thin film for PCB surface finish is a potential replacement of the conventional PCB finishes because of environment-friendly process, high corrosion-resistance and long shelf life over 1 year. In this study, solder joint properties of the plasma organic surface finish were estimated and compared with OSP surface finish. The plasma surface finish was deposited by chemical vapor deposition from fluorine-based precursors. The thickness of the plasma organic coating was 20 nm. Sn-3.0Ag-0.5Cu (SAC305) solder was used as solder joint materials. From a salt spray test, the plasma organic coating had higher corrosion resistance than the OSP surface finish. The spreadability of SAC305 on plasma organic coating was higher than that on OSP surface finish. SEM and TEM micrographs showed that the interfacial microstructure of the plasma surface finish sample were similar to that of the OSP sample. Solder joint strength of the plasma finish sample was also similar to that of the OSP finished sample.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.6-9
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• 2003

최근 휴대폰, PDA 등의 모바일 전자제품의 수요가 급격히 증가하고 마이크로 전자패키지 부품의 경박단소화에 의해서 고I/O수, 미세피치가 적용된 개발제품이 양산되고 있으나, 마이크로 전자패키지 부품의 생산비 및 솔더볼접합특성 등의 문제는 여전히 크게 이슈화 되고 있다. Organic solderability preservatives(OSPs)는 이러한 모바일용 마이크로 전자패키지 부품의 문제점을 낮은 단가로 해결할 수 있는 공정으로 평가되고 있다. 본 연구에서는 OSP 처리된 CSP의 열적특성, 화학적특성 및 기계적특성을 정량적으로 분석하여 OSP 응용범위를 제시하고자 하였다.