• 제목/요약/키워드: OCP(Open Circuit Potential)

검색결과 48건 처리시간 0.026초

온도 영향을 고려한 RC 구조의 반 전위 및 OCP의 상관성 분석 (Relationship Analysis between Half Cell Potential and Open Circuit Potential Considering Temperature Condition)

  • 윤용식;권성준
    • 한국건설순환자원학회논문집
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    • 제10권1호
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    • pp.124-132
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    • 2022
  • 콘크리트 내의 부식전위는 노출환경 및 배합에 따라 크게 변화한다. 본 연구에서는 피복 두께, 염화물 농도, 물-시멘트 비를 변수로 하여 RC 시편을 제조하였으며, 철근과 표면과의 전위차를 평가하는 HCP 측정을 수행하였다. 또한 매립된 철근과 상대전극을 이용하여 OCP의 측정하였다. 한천과 NaOH 수용액을 이온교환물질로, Hg/HgO를 기준전극으로 사용하여 OCP를 측정하였는데, HCP에 비하여 온도에 더욱 민감하게 작용하였다. 영향 인자 중 존치 기간 및 염화물 농도는 피복 두께 및 물-시멘트 비보다 상대적으로 큰 영향을 가지고 있었다. 또한 전체 측정된 HCP 및 OCP는 피복 두께 및 물-시멘트와 뚜렷한 선형관계를 나타내었다. 다중회귀분석을 통하여 HCP와 OCP의 관계를 정량화하였으며 온도를 고려하여 개선된 상관성을 도출하였다.

식염수에서 내식성 성능에 대한 Al 와이어의 5%Mg 합금 효과 (Effect of 5%Mg alloying in Al wire on corrosion resistance performance in saline solution)

  • 싱 지텐드라 쿠마르;이한승
    • 한국건축시공학회:학술대회논문집
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    • 한국건축시공학회 2022년도 봄 학술논문 발표대회
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    • pp.93-94
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    • 2022
  • The presence of chloride (Cl-) ions in environments causes localized corrosion resulting decrease the durability of the structures. In this study, 5% Mg containing Al alloys (Al-5Mg) wire used vis-à-vis compared its corrosion resistance with pure Al in 3.5wt.% NaCl solution with exposure periods. Initially both wires exhibited identical open circuit potential (OCP) attributed to the presence of native oxide film on the surface but with the exposure periods it shifted towards active direction owing to the dissolution of oxide film. The pure Al continuously shifted the OCP towards active direction while Al-5Mg shows stabilization of OCP after 8 days of exposure. The OCP of Al-5Mg is slightly higher compared to pure Al wire owing to the activeness of Mg. The total impedance of the Al-5Mg alloy is almost three times greater than pure Al with exposure periods in 3.5 wt.% NaCl solution. It might be formation of Al-Mg LDH (layered double hydroxide) thin film onto the surface.

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주기적 염해 시험에 따른 소켓 타입 전극을 활용한 철근 콘크리트의 OCP 특성 (Characteristics of OCP of Reinforced Concrete Using Socket-type Electrodes during Periodic Salt Damage Test)

  • 이상석;권성준
    • 한국구조물진단유지관리공학회 논문집
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    • 제25권4호
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    • pp.28-36
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    • 2021
  • 콘크리트 구조물의 내부의 매립된 철근은 부동태 피막으로 인해 부식으로부터 보호된다고 알려져 있다. 구조물의 경제적인 내구수명 산정을 위해 부식 발생 시기를 지연시키거나 초기 부식 시점을 평가하는 것은 매우 중요하다. 본 연구에서는 3 가지 수준의 피복두께(60 mm, 45 mm, 30 mm), 물-시멘트 비(40.0%, 50.0%, 60.0%), 염화물 농도(0.0%, 3.5%, 7.0%)를 고려한 콘크리트 시편을 대상으로 부식 모니터링을 수행하였는데, 한천(Agar) 기반 소켓 형식 센서를 활용하여 OCP를 측정하였다. OCP 측정 시 습윤 조건에서는 전위가 감소하고 건조 조건에서는 감소된 전위가 일부 회복하는 거동을 확인하였다. 모든 물-시멘트 비에서 피복두께가 30 mm의 경우 가장 낮은 OCP값이 측정되었으며, 피복두께가 30 mm에서 45 mm로 증가할 때 빠르게 OCP가 회복하였다. 이는 피복두께가 염화물 이온의 침투에 효과적인 방어기구로 작용하기 때문이다. 염화물 농도가 증가함에 따라 물-시멘트 비의 영향보다 피복두께에 대한 영향이 더 지배적인 경향을 보이는 것으로 도출되었다. 시편의 해체 후 추가적인 모니터링과 염화물량의 평가를 수행하면 제안된 부식 모니터링 기법의 신뢰성을 높일 수 있을 것으로 판단된다.

전기화학적 식각정지에 의한 고수율 실리콘 박막 멤브레인 제작 (Fabrication of High-yield Si Thin-membranes by Electrochemical Etch-stop)

  • 정귀상;박진상;이원재;송재성
    • 한국전기전자재료학회논문지
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    • 제14권3호
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    • pp.223-227
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    • 2001
  • In this paper, the authors present the fabrication of high-yield Si thin-membranes by electrochemical etch-stop in tetramethyl ammonium hydroxide (TMAH): isopropyl alcohol (IPA):pyrazine solutions. The current-voltage (I-V) characteristics of n- and p-type Si in TMAH:IPA;pyrazine solutions were analysed, repsectively. Open circuit potential (OCP)and passivation potential (PP) of n- and p-type Si, respectively, were obtained and applied potential was selected between n- and p-type Si PPs. The electrochemical etch-stop method was applied to the fabrication of 801 micro-membranes with 20.0 $\mu\textrm{m}$ thickness on a 5" Si wafer. The average thickness of fabricated 801 micro-membranes on one wafer 20.03$\mu\textrm{m}$ and the standard deviation was ${\pm}$0.26$\mu\textrm{m}$. The Si surface of the etch-stopped micro-membranes was extremely flat with no noticeable taper or nonuniformity. The results indicate that use of the electrochemical etch-stop method for the etching of Si in TMAH:IPA;pyrazine solutions provides a powerful and versatile alternative process for fabricating high-yield Si micro-membranes.

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강철보호를 위한 폴리아닐린 분산 코팅의 전기화학 및 부식특성 (Electrochemistry and Corrosion Characteristics of Polyaniline Dispersion Coating for Protection of Steels)

  • 허재훈;오응주;조정환
    • 전기화학회지
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    • 제6권2호
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    • pp.113-118
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    • 2003
  • 폴리아닐린 분말과 고분자 계면활성제, cyclohexanone용매를 micro-milling장치내에서 분산시켜 (m입자 크기를 갖는 가공용이한 분산액을 제조하였다. 분산액을 백금 전극 위에 코팅하여 얻은 분산박막의 전기화학적 특성들은 순환전압전류법(CV)을 이용하여 조사하였다. CV의 결과에 의하면 폴리아닐린 분산박막이 순수한 폴리아닐린 박막과 유사한 전기화학적 특성을 갖는 것으로 나타났다. $3wt.\%$ NaCl용액에서 수행한 분극실험과 열린회로전위 측정 실험에서는 PANI분산액을 철표면에 코팅하면 부식전위가 증가하였다. 분산박막/철 전극의 열린회로전위값(OCP, Voc)이 분산액의 제조 조건에 따라 변화가 있음을 관찰하였다. 이러한 결과들은 본 연구에서 사용한 전도성 고분자 분산액이 철의 부식방지코팅물질로서 유용성을 갖고 있다는 것을 보여주고 있다.

철근콘크리트에 매립된 철근의 부식 모니터링에 관한 실험적 연구 (An Experimental Study on the Monitoring of Corrosion of Rebar Embedded in Reinforced Concrete)

  • 박장현;이한승
    • 한국건축시공학회:학술대회논문집
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    • 한국건축시공학회 2019년도 춘계 학술논문 발표대회
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    • pp.262-263
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    • 2019
  • In this study, a sensor for detecting corrosion of rebar embedded in reinforced concrete structures was fabricated and its performance was verified. In order to monitor the open circuit potential(OCP) of the rebar embedded in reinforced concrete, a concrete embedded solid electrode was constructed as a sensor using MnO2. The OCP of the rebar could be observed using a sensor and a data logger. The decrease of the OCP to -510mV (vs.MnO2) or less was judged to be corrosion of the rebar. Since it is a solid-mediated sensor, it is more stable and durable than an electrode using an aqueous solution, and it is considered that the corrosion state of the rebar can be monitored for a long period of time.

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Effect of Post-CMP Cleaning On Electrochemical Characteristics of Cu and Ti in Patterned Wafer

  • Noh, Kyung-Min;Kim, Eun-Kyung;Lee, Yong-Keun;Sung, Yun-Mo
    • 한국재료학회지
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    • 제19권3호
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    • pp.174-178
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    • 2009
  • The effects of post-CMP cleaning on the chemical and galvanic corrosion of copper (Cu) and titanium (Ti) were studied in patterned silicon (Si) wafers. First, variation of the corrosion rate was investigated as a function of the concentration of citric acid that was included in both the CMP slurry and the post-CMP solution. The open circuit potential (OCP) of Cu decreased as the citric acid concentration increased. In contrast with Cu, the OCP of titanium (Ti) increased as this concentration increased. The gap in the OCP between Cu and Ti increased as citric acid concentration increased, which increased the galvanic corrosion rate between Cu and Ti. The corrosion rates of Cu showed a linear relationship with the concentrations of citric acid. Second, the effect of Triton X-$100^{(R)}$, a nonionic surfactant, in a post-CMP solution on the electrochemical characteristics of the specimens was also investigated. The OCP of Cu decreased as the surfactant concentration increased. In contrast with Cu, the OCP of Ti increased greatly as this concentration increased. Given that Triton X-$100^{(R)}$ changes its micelle structure according to its concentration in the solution, the corrosion rate of each concentration was tested.

Galvanic Corrosion of Zn/Steel Couple in Aqueous MgCl2

  • Tada, E.;Katakami, S.;Nishikata, A.
    • Corrosion Science and Technology
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    • 제16권4호
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    • pp.183-186
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    • 2017
  • Galvanic corrosion tests of Zn/steel couples were conducted in 1 M NaCl and $1M\;MgCl_2$ solutions to investigate the impact of magnesium ion on corrosion behavior of the couples. Two types of Zn/steel couples were used for measurements of open circuit potential (OCP) and galvanic current. From the results of OCP transient of Zn/steel couples, the corrosion potential in $1M\;MgCl_2$ was a more positive value than that in 1 M NaCl during the sacrificial dissolution of Zn. However, earlier increase of OCP of the couples in $1M\;MgCl_2$ solution indicates that the sacrificial dissolution rate of Zn in $1M\;MgCl_2$ was enhanced more than that in 1 M NaCl, agreeing with the results on transients of galvanic current. This result is due to that cathodic reaction on the steel surface of the Zn/steel couple was enhanced in $1M\;MgCl_2$ by the occurrence of hydrogen evolution reaction.

The Effect of External DC Electric Field on the Atmospheric Corrosion Behaviour of Zinc under a Thin Electrolyte Layer

  • Liang, Qinqin;YanYang, YanYang;Zhang, Junxi;Yuan, Xujie;Chen, Qimeng
    • Corrosion Science and Technology
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    • 제17권2호
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    • pp.54-59
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    • 2018
  • The effect of external DC electric field on atmospheric corrosion behavior of zinc under a thin electrolyte layer (TEL) was investigated by measuring open circuit potential (OCP), cathodic polarization curve, and electrochemical impedance spectroscopy (EIS). Results of OCP vs. time curves indicated that the application of external DC electric field resulted in a negative shift of OCP of zinc. Results of cathodic polarization curves measurement and EIS measurement showed that the reduction current of oxygen increased while charge transfer resistance ($R_{ct}$) decreased under the external DC electric field. Variation of OCP negative shift, reduction current of oxygen, and $R_{ct}$ increase with increasing of external DC electric field strength as well as the effect of external DC electric field on double-layer structure in the electrode/electrolyte interface and ions distribution in thin electrolyte layer were analyzed. All results showed that the external DC electric field could accelerate the corrosion of zinc under a thin electrolyte layer.

TMAH/IPA/Pyrazine용액에 있어서 전기화학적 식각정지 특성 (Electrochemical Etch-stop Characteristics of TMAH:IPA:Pyrazine Solutions)

  • 정귀상;이채봉
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2000년도 춘계학술대회 논문집 전자세라믹스 센서 및 박막재료 반도체재료 일렉트렛트 및 응용기술
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    • pp.147-151
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    • 2000
  • This paper presents the electrochemical etch-stop characteristics of single-crystal silicon in a tetramethyl ammonium hyciroxide(TMAH):isopropyl alcohol(IPA):pyrazine solution. Addition of pyrazine to a TMAH:IPA etchant increases the etch-rate of (100) silicon, thus the elapsed time for etch-stop was shortened. The current-voltage(I-V) characteristics of n- and p-type silicon in a TMAH:IPA:pyrazine solution were obtained, respectively. Open circuit potential(OCP) and passivation potential(PP) of n- and p-type silicon, respectively, were obtained and applied potential was selected between n- and p-type silicon PP. The electrochemical etch-stop is applied to the fabrication of 801 microdiaphragms having $20\;{\mu}m$ thickness on a 5-inch silicon wafer. The averge thicknesses of 801 microdiaphragms fabricated on the one wafer were $20.03\;{\mu}m$ and standard deviation was ${\pm}0.26{\mu}m$. The silicon surface of the etch-stopped microdiaphragm was extremely flat without noticeable taper or other nonuniformities. The benefits of the electrochemical etch-stop in a TMAH:IPA:pyrazine solution become apparent when reproducibility in the microdiaphragm thickness for mass production is considered. These results indicate that the electrochemical etch-stop in a TMAH:IPA:pyrazine solution provides a powerful and versatile alternative process for fabricating high-yield silicon microdiaphragms.

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