• Title/Summary/Keyword: Non-uniform plasma

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Study of Transient Response in Non-uniform Plasma Layer with Optically-Controlled Microwave Pulses (광-마이크로파 기반 유도플라즈마의 과도응답 특성에 관한 연구)

  • Wang, Xue;Choi, Yue-Soon;Park, Jong-Goo;Kim, Yong-K.
    • The Transactions of The Korean Institute of Electrical Engineers
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    • v.58 no.6
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    • pp.1174-1179
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    • 2009
  • In this paper we develop the characteristic of density on non-uniform plasma in different layer of the semiconductor with optically controlled microwave pulses. The transient response of the microwave pulses in different plasma layer has been evaluated by calculating the variation of the reflection function of dielectric microstrip lines. The lines has used under open-ended termination containing optically induced plasma region, which has illuminated a laser source. The characteristics impedances resulting from the presence of plasma are evaluated by the transmission line model. The analyzes the variation of transient response in a 0.01cm layer near the surface for frequency range from 1GHz to 128GHz. The diffusion length LD is larger than compared to the absorption depth $l/_{\alpha}l$. The variation of characteristic response in plasma layer with microwave pulses which has in deferentially localized has been evaluated analytically.

Study of Non-uniform Plasma Layer Variation with Optically-Controlled Microwave Pulses

  • Wang, Xue;Yun, Ji-Hun;Kim, Yong-K.
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2009.06a
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    • pp.90-91
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    • 2009
  • We study of the variation on non-uniform plasma in different layer of the semiconductor. The transient response in different plasma layer has been evaluated theoretically. The reflection function of dielectric microstrip lines resulting from the presence of plasma are evaluated by the transmission line model. The diffusion length is small compared to the absorption depth. The variation of characteristic response in plasma layer with microwave pulses which has in localized has been evaluated.

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Influence of the Density Gradient on the Current of the Electrode Immersed in the Non-uniform Plasma (플라즈마 삽입전극의 전류에 미치는 밀도 구배의 영향)

  • Hwang, Hui-Dong;Gu, Chi-Wuk;Chung, Kyung-Jae;Choe, Jae-Myung;Kim, Gon-Ho;Ko, Kwang-Cheol
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.24 no.6
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    • pp.504-509
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    • 2011
  • The conducting current of non-uniform plasma immersed electrode consists of ion current and secondary electron emission current caused by the impinging ion current. The ion current is determined by the ion dose passing through the sheath in front of electrode and the ion distribution in front of the electrode plays an important role in the secondary electron emission. The investigation of the distributed plasma and secondary electron effect on electrode ion current was carried out as the stainless steel electrode plugged with quartz tube was immersed in the inductively coupled Ar plasma using the antenna powered by 1 kw and the density profile was measured. After that, the negative voltage was applied by 1 kV~6 kV to measure the conduction current for the analysis of ion current.

Study of transient response in dielectric microstrip line with opto-microwave pulses

  • Wang, Xue;Kim, Ji-Hyoung;Yun, Ji-Hun
    • The Journal of Korea Institute of Information, Electronics, and Communication Technology
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    • v.2 no.2
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    • pp.63-68
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    • 2009
  • We study on the transient response in non-uniform microstrip lines with optically controlled microwave pulses. The transient response of the microwave pulses in plasma layer has been evaluated by reflection function of dielectric microstrip lines. The variation of characteristic response in plasma layer with localized pulses has been evaluated analytically. Reflection the change of the reflection amplitude has been observed.

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Effect by Temperature Distribution of Target Surface during Sputtering by Bipolar Pulsed Dc and Continuous Dc (직류와 양극성 펄스직류에 의한 스퍼터링시 타겟 표면의 온도 분포와 그 영향)

  • Yang, Won-Kyun;Joo, Jung-Hoon;Kim, Young-Woo;Lee, Bong-Ju
    • Journal of the Korean Vacuum Society
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    • v.19 no.1
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    • pp.45-51
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    • 2010
  • We measured the temperature of target surface inducing by various physical phenomenon on magnetron sputtering target and confirmed the possibilities if the temperature distribution could affect plasma and deposited thin film. The target of magnetron sputtering has two types: round type and rectangular type. In a rectangular target, the concentrated discharge area by corner effect by magnetic field and non-uniform erosion of target are generated. And we found the generation of non-uniform temperature distribution on the target surface from this. This area was $10{\sim}20^{\circ}C$ higher than non-sputtering area. And if particles are generated during sputtering process, they were $20^{\circ}C$ higher than the area where is higher than non-sputtering area. These effects result in non-uniformity of thin films, crack of ceramic target, and shortening target life by non-uniform erosion.

A Study of the Properties of Optically Induced Layers in Semiconductors Aided by the Reflection of Optically Controlled Microwave Pulses

  • Wang, Xue;Choi, Yue-Soon;Park, Jong-Goo;Kim, Yong-K.
    • Transactions on Electrical and Electronic Materials
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    • v.10 no.4
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    • pp.111-115
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    • 2009
  • We present a study on the reflection of optically controlled microwave pulses from non uniform plasma layers in semiconductors. The transient response of the microwave pulses in different plasma layers has been evaluated by means of the reflection function of dielectric microstrip lines. The lines were used with an open-ended termination containing an optically induced plasma region, which was illuminated by a light source. The reflection characteristics impedance resulting from the presence of plasma is evaluated by means of the equivalent transmission line model. We have analyzed the variation of the transient response in a 0.01 cm layer with a surface frequency in the region of 128 GHz. In the reflection the variation of the diffusion length $L_D$ is large compared with the absorption depth $1/{\alpha}_l$. The variation of the characteristic response of the plasma layer with differentially localized pulses has been evaluated analytically. The change of the reflection amplitude has been observed at depths of 0.1 cm, 0.01 cm and $0.1{\times}10^{-5}$ cm respectively.

The Study on the Non-Uniformity of PECVD SiO2 Deposition by the Plasma Diagnostics (플라즈마 진단에 의한 PECVD SiO2 증착의 불균일성 원인 연구)

  • Ham, Yong-Hyun;Kwon, Kwang-Ho;Lee, Hyun-Woo
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.24 no.2
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    • pp.89-94
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    • 2011
  • The cause of the thickness non-uniformity in the large area deposition of $SiO_2$ films by PECVD(Plasma Enhanced Chemical Vapor Deposition) was investigated by the plasma diagnostics. The spatial distribution of the plasma species in the chamber was obtained with DLP(Double Langmuir Probe) and the new-designed probe-type QMS(Quadrupole Mass Spectrometer). From the relationship between the spatial distribution of the plasma species and the depositing rate of the $SiO_2$ films, it was conformed that the non-uniform deposition of $SiO_2$ films was related with the spatial distribution of the oxygen radical density and electron temperature.

Non Thermal Plasma Applicable Mechanisms for the Improvement of Air Pollutants Removal Efficiency (대기오염 가스 제거효율 향상을 위한 저온 플라즈마 응용기구 연구)

  • Kim, Dae-Il;Kim, Hyung-Taek
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2004.11a
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    • pp.648-652
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    • 2004
  • A comparative investigation of an experimental and a simulation of chemical kinetics for NOx removal from dielectric barrier discharges is presented. Several types of dielectric barrier discharges were implemented depending upon the configuration of electrodes. The simulation was based on an approximate mathematical model for plasma cleaning of waste gas. The influence of non uniform distributions of species due to the production of primary active particles in the streamer channel was taken into account. A comparison of observed experimental to the calculated removal efficiency of NOx showed acceptable agreement.

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Consideration on the Electromagnetic Wave Absorption Properties of the Plasma for the Stealth Technology (은신기술을 위한 플라즈마의 전자기파 흡수 특성에 대한 고찰)

  • In, S.R.
    • Journal of the Korean Vacuum Society
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    • v.17 no.6
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    • pp.501-510
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    • 2008
  • The stealth technology to conceal an aircraft from the vision of a radar have been accomplished by coating the surface with special paints absorbing the electromagnetic wave. Nowadays, researches to utilize characteristics of the plasma-wave interaction for realizing the stealth technology are actively progressed. In this paper, to investigate the physical feasibility of the plasma stealth, calculation results for the required conditions of the plasma cloaking on the aircraft flying in the air for showing the stealth function, using a flat non-magnetized non-uniform plasma model, are reported and discussed.

Numerical Modeling of a Rectangular Type Inductively Coupled Plasma System (사각형 유도 결합 플라즈마 시스템의 수치 모델링)

  • Joo, Jung-Hoon
    • Journal of the Korean institute of surface engineering
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    • v.45 no.4
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    • pp.174-180
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    • 2012
  • Low pressure inductively coupled plasma characteristics of argon and oxygen are numerically simulated for a 400 mm rectangular type system with a plasma fluid model. The results showed lower power absorption profile at the corner than a circular one in a 13.56 MHz driven 1.5 turn antenna system with a drift-diffusion and quasi-neutrality assumption. Ions controlled by electric field are more non-uniform than metastables and the power absorption profile of oxygen plasma is affected by horizontal gas flow pattern to show 25% lower power absorption at the pumping flange side. Oxygen negative ions which are generated in electron collisional dissociation of oxygen molecules was calculated as 0.1% of oxygen atoms with similar spatial profile.