• 대한치과보철학회지
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• 제34권1호
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• pp.125-142
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• 1996

Bond strength of four different cements to dental casting alloys which were treated with #600 emery, tin-plating, and $50{\mu}m$ sandblasting were evaluated. The alloy specimens were Type III Gold alloy(Degulor C), Palladium-Silver alloy(Pors on 4), Nickel-Chromium(Rexillium III) alloy, which were embedded in acrylic resin disc. The specimens were treated with #600 emery and tin plating, #600 emery and sandblasting, then bonded using Fuji I, Ketac Cem(Glass ionomer cements), Poly F, Livcarbo(Polycarboxylate cements). The specimens were immersed in water for 24 hours and shear bond strengths were evaluated by Instron Machine. Tin plated, sandblasted, and debonded alloy surfaces were observed using scanning electron microscope. On the basis of this study, the following conclusions could be drawn. 1. In the tin plated alloy group, increase in bond strength of glass ionomer cements was statistically insignificant. 2. In the tin plated alloy group, increase in bond strength of polycarboxylate cements was statistically significant, except nickel-chromium alloy. 3. Sandblasted alloy group showed higher bond strength than that of tin-plated alloy group.

• 한국정밀공학회지
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• 제28권7호
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• pp.769-776
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• 2011

In order to cope with the requirements of smaller patterns, larger surfaces and lower costs in the fields of displays, optics and energy, greater attentions is now being paid to the development of micro-pattern machining technology. Compared with flat molds, roll molds have the advantages of short delivery, ease of manufacturing larger surfaces, and continuous molding. This paper presents the state-of-the-art of the micro pattern machining technology on the roll molds and introduces some research results on the machining process technology. The copper and nickel-phosphorous-alloy plating process, machining process technology for uniform micro patterns. micro cutting simulation and the real time monitoring system for micro machining are summarized. The developed technologies have led the complete localization of the prism sheets and will be applied to the direct forming process with succeeding research & development.

• 신재생에너지
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• 제1권1호
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• pp.37-43
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• 2005

High-efficiency silicon solar cells have potential applications on mobile electronics and electrical vehicles. The fabrication processes of the high efficiency cells necessitate com placated fabrication precesses and expensive materials. Ti/Pd/Ag metal contact has been used only for limited area In spite of good stability and low contact resistance because of Its expensive material cost and precesses. Screen printed contact formed by Ag paste causes a low fill factor and a high shading loss of commercial solar cells because of high contact resistance and a low aspect ratio. Low cost Ni/Cu metal contact has been formed by using a low cost electroless and electroplating. Nickel silicide formation at the interface enhances stability and reduces the contact resistance resulting In an energy conversion efficiency of $20.2\%\;on\;0.50{\Omega}cm$ FZ wafer. Tapered contact structure has been applied to large area solar cells with $6.7\times6.7cm^2$ in order to reduce power losses by the front contact The tapered front metal contact Is easily formed by the electroplating technique producing $45cm^2$ solar cells with an efficiency of $21.4\%$ on $21.4\%\;on\;2{\Omega}cm$ FZ wafer.

• 한국표면공학회지
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• 제26권6호
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• pp.291-298
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• 1993

In order to substitute for porous nickel anode in Molten Carbonate Fuel Cell(MCFC), porous cermet elec-trode was fabricated with Ni and Ni-P coated ceramic powder. Ni and Ni-P were coated by electroless plat-ing method in the nickel solution containing of hydrazine and sodium hypophosphate as a reducing agent. The plating solution was stirred by air and mechanical agitator. Ultrasonic irradiation was applied to the plating bath to improved the effect of agitation and coating speed. Electorde was formed by pressing method and doc-tor blade method followed by sinterd at$ 800^{\circ}C$ for 6 hours in H2 environment. Anode performance test carried out by potentiodynamic polarization technique in the MCFC operating condition and 154-161mA/$\textrm{cm}^2$ as ob-tained as a anode current density at the+100mV overpotential.

• 대한금속재료학회지
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• 제48권5호
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• pp.462-468
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• 2010

Carbon Nanotubes (CNTs) have recently emerged as a material with outstanding properties. It has shown promising potential for applications in many engineering fields as electronic devices, thermal conductors, and light-weight composites. Researchers have investigated their use as reinforcements in themetal matrix composites of CNTs. In the present work, we decorated CNTs with Ni particles by electroless plating. The CNTs were wet-ball milled for various milling times with a nickel sulfate solution. The precipitated Ni particles were observed mainly by FESEM. In this study, the dispersion of the CNTs and Ni particles was improved with the addition of the surfactant. Also, as the CNTs were shortened and widened by an increased ball milling time, the size of the precipitated Ni particles increased. It was estimated that the CNTs were deformed and caused some defects on their surface during the ball milling process. Those defects were assumed to be heterogeneous nucleation sites for the Ni particles.

• 한국재료학회지
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• 제24권11호
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• pp.632-638
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• 2014

We investigated the effects of DMAB (Borane dimethylamine complex, C2H10BN) in electroless Ni-B film with addition of DMAB as reducing agent for electroless Ni plating. The electroless Ni-B films were formed by electroless plating of near neutral pH (pH 6.5 and pH 7) at $50^{\circ}C$. The electroless plated Ni-B films were coated on screen printed Ag pattern/PET (polyethylene terephthalate). According to the increase of DMAB (from 0 to 1 mole), the deposition rate and the grain size of electroless Ni-B film increased and the boron (B) content also increased. In crystallinity of electroless Ni-B films, an amorphization reaction was enhanced in the formation of Ni-B film with an increasing content of DMAB; the Ni-B film with < 1 B at.% had a weak fcc structure with a nano crystalline size, and the Ni-B films with > 5 B at.% had an amorphous structure. In addition, the Ni-B film was selectively grown on the printed Ag paste layer without damage to the PET surface. From this result, we concluded that formation of electroless Ni-B film is possible by a neutral process (~green process) at a low temperature of $50^{\circ}C$.

• 마이크로전자및패키징학회지
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• 제11권2호
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• pp.11-16
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• 2004

전자칩의 고집적화에 의해 전자기기들은 점점 소형화 되어가고 있으며, 이들 기기들에서 발생되는 열은 기기의 성능 저하뿐 아니라 수명을 단축시킨다. 본 연구에서는 효율적인 방열 위한 마이크로 히트싱크 제조를 위하여 멤브레인에 금속(금, 니켈, 구리)은 도금하는 무전해 도금 방법을 이용하였다. 무전해 도금은 폴리카보네이트 멤브레인을 sensitization과 activation 등의 전처리 후, 도금하고자 하는 금속염 수용액에 침적시켜 실행하였다. 무전해 도금에 의하여 제조된 각각의 마이크로피브릴의 열전달 특성과 방열량은 표면적이 가장 큰 니켈 마이크로피브릴에서 가장 우수하게 나타났다.

• 한국분말재료학회지
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• 제25권5호
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• pp.375-378
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• 2018

Conductive and dielectric SiC are fabricated using electroless plating of Ni-Fe films on SiC chopped fibers to obtain lightweight and high-strength microwave absorbers. The electroless plating of Ni-Fe films is achieved using a two-step process of surface sensitizing and metal plating. The complex permeability and permittivity are measured for the composite specimens with the metalized SiC chopped fibers dispersed in a silicone rubber matrix. The original non-coated SiC fibers exhibit considerable dielectric losses. The complex permeability spectrum does not change significantly with the Ni-Fe coating. Moreover, dielectric constant is sensitively increased with Ni-Fe coating, owing to the increase of the space charge polarization. The improvements in absorption capability (lower reflection loss and small matching thickness) are evident with Ni-Fe coating on SiC fibers. For the composite SiC fibers coated with Ni-Fe thin films, a -35 dB reflection loss is predicted at 7.6 GHz with a matching thickness of 4 mm.

• 한국정밀공학회지
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• 제23권9호
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• pp.174-178
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• 2006

Pyramid shape of micro pattern is applied to the light guide panel (LGP) to enhance the uniformity of the brightness of the LCD. The micro pyramids are molded in intaglio on the surface of the LGP. The size of each pyramid is 5$\mu$m $\times$ 5$\mu$m on bottom and the height is about 3.5$\mu$m. The pyramids are distributed on the LGP surface randomly to be sparser where the light comes in and denser at the opposite side as a result of a simulation using lightools$^{TM}$ Based on this design, a silicon pattern master and a nickel stamper are fabricated by MEMS process and electro plating process. Intaglio micro pyramids are fabricated on the 6' of silicon wafer from the anisotropic etching using KOH and the process time, temperature of the KOH solution, etc are optimized to obtain precise shape of the pattern. A Wi stamper is fabricated from this pattern master by electro plating process and the embossed pyramid patterns turns out to be well defined on the stamper. Adopting this stamper to the mold base with two cavities, 1.8' and 3.6' LGPs are injection molded.

• 천문학회보
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• 제39권2호
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• pp.103-103
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• 2014

Manufacturing of lens and mirror using Diamond Turning Machine (DTM) offers distinct advantages including short fabrication time and low cost as compared to grinding or polishing process. However, the DTM process can leave mid-frequency error in the optical surface which generates an undesirable diffraction effect and stray light. The mid-frequency error is expected to be eliminated by mechanical polishing after the DTM process, but polishing of soft surface of ductile aluminum is extremely difficult because the polishing process inevitably degrades the surface form accuracy. In order to increase its surface hardness, we performed electroless nickel plating on the surface of diamond-turned aluminum (Al-6061T6) off-axis mirrors, which was followed by the 6-hour-long baking process at $200^{\circ}C$ for improving its hardness. Then we polished the nickel plated off-axis mirrors to remove the mid-frequency error and measured polished mirror surfaces using the optical surface profilometer (NT 2000, Wyko Inc.). Finally, we ascertained that the mid-frequency error on the mirror surface was successfully removed. During the whole processes of nickel plating and polishing, we monitored the form accuracy using the ultra-high accurate 3-D profilometer (UA3P, Panasonic Corp.) to maintain it within the allowable tolerance range (< tens of nm). The polished off-axis mirror was optically tested using a visible laser source and a pinhole, and the airy pattern obtained from the polished mirror was compared with the unpolished case to check the influence of mid-frequency error on optical images.