• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2005년도 추계종합학술대회
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• pp.619-622
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• 2005

본 논문에서는 서로 다른 Si 두께 ($T_{Si}$ = 27, 50 nm) 를 갖는 SOI (Silicon On Insulator) 기판 위에 다양한 두께의 Ni/Co를 순차적으로 증착한 후 Bulk-Si과의 비교를 통해 Silicide의 형성 특성에 대하여 분석하였다. 우선 급속 열처리 (RTP, Rapid Thermal Processing) 를 통하여 Silicide를 형성한 후 측정결과 Si두께에 따라 Silicide의 특성이 달라짐을 확인하였다. 두꺼운 두께의 Si-film을 갖는 SOI 기판을 사용한 경우 증착된 금속의 두께에 따라 Bulk-Si와 비슷한 면저항 특성을 보였으나, 얇은 두께의 Si-film을 갖는 SOI기판을 사용한 경우에는 제한된 Si의 공급으로 인한 Silicide의 비저항 증가로 인하여 증착된 금속의 두께에 따라 면저항이 감소하다가 다시 증가하는 'V' 자형 곡선을 나타내었다.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 2005년도 ICCAS
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• pp.502-505
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• 2005

Researches about micro technology travel lively in these days. Such many researches are concentrated in the field of materials and a process field. But properties of micro materials should be known to give results of research developed into still more. In these various material properties, mechanical property such as tensile strength, elastic modulus, etc is the basic property. To measure mechanical properties in micro or nano scale, actuating must be very precise. PZT is a famous actuator which becomes a lot of use to measure very precise mechanical properties in micro research field. But PZT has a nonlinearity which is called as hysteresis. Not precision result is caused because of this hysteresis property in PZT actuator. Therefore feedback control method is used in many researches to prevent this hysteresis of PZT actuator. Feedback control method produce a good result in processing view, but cause a loss in a resolution view. In this paper, hysteresis is compensated by open loop control method. Hysteresis property is modeled in Mathematical function and compensated control input is constructed using inverse function of original data. Reliability of this control method can be confirmed by testing nickel thin film that is used in MEMS material broadly.

• 한국표면공학회지
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• 제39권3호
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• pp.121-128
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• 2006

A set of Quartz Crystal Microbalances (QCM's) was used to observe the film removal characteristics of three different $CO_2-nitric$ acid microemulsions. QCM's electroplated with nickel or copper were used as specimens. F-AOT, NP-4 and the newly synthesized Proline Surfactant-1 were used as surfactants to create microemulsions. While the F-AOT microemulsion yielded a relatively low removal rate, that of the Proline Surfactant-1 completely removed the Cu metal film within a short period of time. The NP-4 microemulsion removed the metal surface. However, removal rate measurements per QCM were not possible due to the instability of the microemulsion when Cu ions were present in the nitric solution. The reaction kinetics and metal removal capabilities of microemulsions formed by the different surfactants are explained along with the characteristics of reverse micelles.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제43회 하계 정기 학술대회 초록집
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• pp.226-226
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• 2012

The electronic and electrical properties of nickel oxide (NiO) thin films were investigated by reflection electron energy loss spectroscopy (REELS), x-ray photoelectron spectroscopy (XPS), and Hall Effect measurements. REELS spectra revealed that the band gap of the NiO thin film was increased from 3.50 eV to 4.02 eV after annealing the sample at $800^{\circ}C$. Our XPS spectra showed that the amount of Ni2O3 decreased after annealing. The Hall Effect results showed that the doping type of the sample changed from n type to p type after annealing. The resistivity decreased drastically from $4.6{\times}10^3$ to $3.5{\times}10^{-2}$ ${\Omega}{\cdot}cm$. The mobility of NiO thin films was changed form $3.29{\times}10^3$ to $3.09{\times}10^5cm^2/V{\cdot}s$. Our results showed that the annealing temperature plays a crucial role in increasing the carrier concentration and the mobility which leads to lowering resistivity of NiO thin films.

• 한국재료학회지
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• 제9권2호
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• pp.217-225
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• 1999

The effect on the pitting corrosion resistance of laser welding and surface treatment developed as a repair method of stream generator tubing material that was a major component of primary system at nuclear power plant was observed. Some heat-treated Alloy 600 tubing materials used at domestic nuclear power plants were laser-surface observed. Some heat-treated Alloy 600 tubing materials used at domestic nuclear power plants were laser-surface melted and the microstructural characteristics were examined. The pitting corrosion resistance was examined through Ep(pitting potential) and degree of pit generation by means of the electrochemical tests and the immersion tests respectively. The pit formation characteristics were investigated through microstructural changes and the pit initiation site and pit morphology. The test results showed that the pitting corrosion resistances was increased in the order of the followings; sensitized Alloy 600, solution annealed alloy600, and laser surface melted Alloy 600. Pits were initiated preferably at Ti-containing inclusions and their surroundings in all tested specimens and it is believed that higher pitting resistance of laser-surface treated Alloy 600 was caused by fine, homogeneous distribution of non-soluble inclusions, the disappearance of grain boundary, and the formation of dense, stable oxide film. The major element of corrosion products filled in the pit was Cr. On the other hand, Fe was enriched in the deposit formed on the pit.

• 한국수소및신에너지학회논문집
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• 제29권5호
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• pp.434-441
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• 2018

The pore size of nickel (Ni) bottom electrode layer (BEL) for low-temperature solid oxide fuel cells embedded with ultrathin-film electrolyte was controlled by changing the substrate surface morphology and deposition process parameters. For ~150-nm-thick Ni BEL, the upper side of an anodic aluminum oxide (AAO) substrate with ~65-nm-sized pores provided ~1.7 times smaller pore size than the lower side of the AAO substrate. For ~100-nm-thick Ni BEL, the AAO substrate with ~45-nm-sized pores provided ~2.6 times smaller pore size than the AAO substrate with ~95-nm-sized pores, and the deposition pressure of ~4 mTorr provided ~1.3 times smaller pore size than that of ~48 mTorr. On the AAO substrate with ~65-nm-sized pores, the Ni BEL deposited for 400 seconds had ~2 times smaller pore size than the Ni BEL deposited for 100 seconds.

• Transactions on Electrical and Electronic Materials
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• 제9권2호
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• pp.47-51
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• 2008

In this paper, thermal stability of Nickel silicide formed on p-type silicon wafer using Ni-V alloy film was studied. As compared with pure Ni, Ni-V shows better thermal stability. The addition of Vanadium suppresses the phase transition of NiSi to $NiSi_2$ effectively. Ni-V single structure shows the best thermal stability compared with the other Ni-silicide using TiN and Co/TiN capping layers. To enhance the thermal stability up to $650^{\circ}C$ and find out the optimal thickness of Ni silicide, different thickness of Ni-V was also investigated in this work.

• 한국표면공학회지
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• 제19권3호
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• pp.92-108
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• 1986

An electroplating on the lead frame fabricated from domestic copper plate was studied experimentally. In this study, nickel was plated on the thin copper lead frame and silver layer was coated on the nickel film in the cyanide electrolyte. The effect of process variables such as current density, plating time, coating thickness and flow rate of electrolytic solution on the properties of coating was investigated. Some samples on each step were fabricated during electroplating. The results obtained from polarization measurement, observation of SEM photograph, adhesion test of coating and microhardness test are as follows. On silver plating, polarization resistance of potentiostatic cathodic polarization curve is reduced as the flow rate of Ag electrolytic solution increases. And above resistance is also reduced when the minor chemicals of sodium cyanide and sodium carbonate are added in potassium silver cyanide bath. The reduced polarization resistance makes silver deposition on the cathode easy. An increase in the current density and the coating thickness causes the particle size of deposit to coarsen, and consequently the Knoop microhardness of the coating decreases. On selective plating an increase in the flow rate of plating solution lead to do high speed plating with high current density. In this case, the surface morphology of deposit is of fine microstructure with high Knoop hardness. An increasing trend of the adhesion of coating was shown with increasing the current density and flow rate of electrolytic solution.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2003년도 하계학술대회 논문집 C
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• pp.1535-1537
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• 2003

Manganese oxide electrode was designed to improve electrical conductivity for dimensionally stable anode(DSA) using discreet variation (DV)-X${\alpha}$ method. It was calculated in DV-X${\alpha}$ method that the addition of nickel to manganese oxide reduce the energy band gap of manganese oxide electrode. Therefore, it is estimated that nickel in 3 additive elements of Ti, Ni and Sn is the best candidate to improve the electrical conductivity of manganese oxide. The anodically deposited manganese oxide which was produced in 0.2M $MnSO_4$ and 0.2M (Mn,Ni)$SO_4$ solution had $MnSO_4$ structure which was identified by XRD. The $MnSO_4$ films produced in both solutions over than 50mA/$cm^2$ of current density and long deposition time of 600sec showed low adhesion with Ti substrate.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2013년도 제45회 하계 정기학술대회 초록집
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• pp.76.2-76.2
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• 2013

Advanced electronic application areas have strongly required new materials due to the continuous shrinking dimensions of their devices. Specially, the development and use of metal precursors for atomic layer deposition has been extensively focused on application to electronic devices. Thus the systematic design and synthesis of metal compounds with relevant chemical and physical properties, such as stability, volatility, and resistance to air and moisture are very important in the vacuum deposition fields. In many case, organic ligands for metal precursors are especially focused in the related research areas because the large scale synthesis of the metal complexes with excellent properties exclusively depends on the potential usefulness of the ligands. It is recommended for metal complexes to be in monomeric forms because mononuclear complexes generally show high vapor pressures comparing with their oligomeric structure such as dimer and trimer. Simple metal alkoxides complexes are involatile except several examples such as Ti(OiPr)4, Si(OEt)4, and Hf(OtBu)4. Thus the coordinated atom of alkoxide ligands should be crowded in its own environment with some substituents by prohibiting the coordinated atoms from bonding to another metal through oxygen-bridging configuration. Alkoxide ligands containing donor-functionalized group such as amino and alkoxy which can induce the increasing of the coordinative saturation of the metal complexes and the decreasing of the intermolecular interaction between or among the metal compounds. In this presentation, we will discuss the development of metal compounds which adopted donor-functionalized alkoxide ligands derived from their alcohols for electronic application. Some recent results on ALD using metal precursors such as tin, nickel, ruthenium, and tungsten developed in our group will be disclosed.