• Korean Journal of Materials Research
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• v.16 no.9
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• pp.571-577
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• 2006

We fabricated thermal evaporated 10 nm-Ni/(poly)Si and 10 nm-Ni/1 nm-Ir/(poly)Si films to investigate the thermal stability of nickel monosilicide at the elevated temperatures by rapid annealing them at the temperatures of $300{\sim}1200^{\circ}C$ for 40 seconds. Silicides for salicide process was formed on top of both the single crystal silicon actives and the polycrystalline silicon gates. A four-point tester is used for sheet resistance. Scanning electron microscope and field ion beam were employed for thickness and microstructure evolution characterization. An x-ray diffractometer and an auger depth profile scope were used for phase and composition analysis, respectively. Nickel silicides with iridium on single crystal silicon actives and polycrystalline silicon gates showed low resistance up to $1200^{\circ}C$ and $800^{\circ}C$, respectively, while the conventional nickel monosilicide showed low resistance below $700^{\circ}C$. The grain boundary diffusion and agglomeration of silicides led to lower the NiSi stable temperature with polycrystalline silicon substrates. Our result implies that our newly proposed Ir added NiSi process may widen the thermal process window for nano CMOS process.

• Proceedings of the KIEE Conference
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• 1999.11d
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• pp.909-911
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• 1999

Metalization technology of the fine patterns by electroless plating is required in place of electrodeposition as high-density printed circuit boards (PCB) become indispensable with the miniaturization of electronic components. Electroless nickel plating is a suitable diffusion barrier between conductor metals, such as Al and Cu, and solder is essetional in electronic packaging in order to sustain a long period of service. Moreover, Electroless nickel has particular characteristics including non-magnetic property, amorphous structure, wear resistance, corrosion protection and thermal stability. In this study fundamental aspects of electroless nickel deposition were studied with effect of complexeing agents of different kinds. Then, the property of electroless deposit are controlled by the composition of the deposition solution, the deposition condition such as temperature and pH value and so on. the characteristics of the deposits has been carried out.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.22 no.5
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• pp.812-817
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• 2013

This study demonstrates the diffusion bonding process between a tungsten carbide shank (K30) and tungsten carbide (DX5) for micro WC-PCD tool fabrication. A type of nickel alloy was used as the filler met alto improve the bond ability between K30 and DX5. The bonding pressure, time, and surrounding conditions were kept constant. In particular, the normal pressure was controlled precisely under buckling analysis. Diffusion bonding was performed at various operation temperatures (1170-1770 K) by using a specially designed jig. The microstructure on the localized bonded surface was analyzed using scanning electron microscopy and optical microscopy. In the case of diffusion bonding of WCat 1370-1770K, the filler metal melted completely and diffused between the two base metals, and they were bonded more tightly on both sides than at temperatures below 1370 K. Our results demonstrated the importance of sensitive temperature dependence of diffusion bonding.

• Transactions of the Korean Society of Pressure Vessels and Piping
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• v.7 no.2
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• pp.26-33
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• 2011

To evaluate steam oxidation behaviours of Alloy 617 and Haynes 230, oxidation test were performed at $900^{\circ}C$ in steam and $steam+20\;vol.-%\;H_2$ environments. Oxidation rate in steam condition was similar to that in air for Alloy 617, while it was slightly lower for Haynes 230. When hydrogen was added to steam, oxidation rate was enhanced. Isolated $MnTiO_3$ particle were formed on $Cr_2O_3$ oxide layer and sub layer $Cr_2O_3$ were formed in steam and $steam+20\;vol.-%\;H_2$ for Alloy 617. On the other hands, $MnCr_2O_3$ layer were formed on top of $Cr_2O_3$ oxide layer for Haynes 230. The extensive sub layer $Cr_2O_3$ formation was resulted from the oxygen inward diffusion in such environments. When hydrogen was added, the oxide morphology was changed from polygonal to platelet because of the accelerated diffusion of cations under the oxide layer. In addition, decarburized zone was extended as hydrogen participated into the reactions causing carbide dissolution.

• Resources Recycling
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• v.14 no.5 s.67
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• pp.32-39
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• 2005

Leaching behavior of nickel contained in waste Multi-Layer Ceramic Capacitor (MLCC) was investigated using a batch reactor. The effects of acid type, acid concentration, leaching temperature, particle size, and reaction time on the extraction of nickel metal from waste MLCC were examined. As a result, 97% of nickel contained in waste MLCC was leached out in 30 min at the temperature of $90^{\circ}C$ under the condition of $HNO_3$ concentration 1N, solid/liquid ratio 5 g/L and particle size $-300/+180{\mu}m$. It was also found that a Jander equation was useful to fit well the leaching rate data. The rate of nickel leaching is controlled by pore diffusion in $BaTiO_3$ layer and has an activation energy of 37.6 kJ/mol (9.0 kcal/mol).

• Journal of the Korean Society for Heat Treatment
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• v.11 no.1
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• pp.17-26
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• 1998

Cladding of stainless steel on mild steel was prepared by diffusion bonding process. The bond strength increased with an increase of bonding temperature and time. It was also found that the bond strength increased as the surface roughness decreased. After the diffusion bonding of stainless steel-mild steel, the mild steel part near the bonded interface showed higher strength than the base steel due to the migration of chromium and nickel from stainless steel to mild steel. Carbon migration from mild steel gave effect on the formation of chromium carbides at grain boundaries of stainless steel, the fractograpohic features of the imperfectly bonded interface showed rather coarse dimples in the mild steel part and very fine dimples in the stainless steel part.

• Applied Chemistry for Engineering
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• v.3 no.3
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• pp.527-534
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• 1992

Raney nickel was used as catalyst in the hydrogen electrode for an alkaline fuel cell. The hydrogen electrode manufactured with the Raney nickel catalyst which was sintered at $700^{\circ}C$ was found to have the highest electrode performance. Using the Raney nickel powder of average particle size $90{\AA}$ for the electrode, the current density which had been measured was $450mA/cm^2$ at $80^{\circ}C$ using 6N KOH solution as an electrolyte. The effects of PTFE addition were investigated with CO-chemisorption, polarization curves and Tafel slope. CO-chemisorption had shown the optimum value when the Raney nickel was mixed with 5wt% of PTFE, but from the current density and Tafel slope at porous Raney nickel electrode, the appropriate value of PTFE addition was 10wt%. Recommendable Ni and Al portion for Raney nickel was 60 : 40 and loading amount was $0.25g/cm^2$. Also the influence of pressing pressure for manufacturing catalytic layer and for junction with gas diffusion layer was examined. The morphology of catalyst surface was investigated with SEM. The influence of reactivation time and heat-treatment temperature were also studied.

• Journal of Powder Materials
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• v.31 no.3
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• pp.220-225
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• 2024

Molten salt reactors represent a promising advancement in nuclear technology due to their potential for enhanced safety, higher efficiency, and reduced nuclear waste. However, the development of structural materials that can survive under severe corrosion environments is crucial. In the present work, pure Ni was deposited on the surface of 316H stainless steel using a directed energy deposition (DED) process. This study aimed to fabricate pure Ni alloy layers on an STS316H alloy substrate. It was observed that low laser power during the deposition of pure Ni on the STS316H substrate could induce stacking defects such as surface irregularities and internal voids, which were confirmed through photographic and SEM analyses. Additionally, the diffusion of Fe and Cr elements from the STS316H substrate into the Ni layers was observed to decrease with increasing Ni deposition height. Analysis of the composition of Cr and Fe components within the Ni deposition structures allows for the prediction of properties such as the corrosion resistance of Ni.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.215-216
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• 2013

The silicide is a compound of Si with an electropositive component. Silicides are commonly used in silicon-based microelectronics to reduce resistivity of gate and local interconnect metallization. The popular silicide candidates, CoSi2 and TiSi2, have some limitations. TiSi2 showed line width dependent sheet resistance and has difficulty in transformation of the C49 phase to the low resistive C54. CoSi2 consumes more Si than TiSi2. Nickel silicide is a promising material to substitute for those silicide materials providing several advantages; low resistivity, lower Si consumption and lower formation temperature. Nickel silicide (NiSi) nanowire (NW) has features of a geometrically tiny size in terms of diameter and significantly long directional length, with an excellent electrical conductivity. According to these advantages, NiSi NWs have been applied to various nanoscale applications, such as interconnects [1,2], field emitters [3], and functional microscopy tips [4]. Beside its tiny geometric feature, NW can provide a large surface area at a fixed volume. This makes the material viable for photovoltaic architecture, allowing it to be used to enhance the light-active region [5]. Additionally, a recent report has suggested that an effective antireflection coating-layer can be made with by NiSi NW arrays [6]. A unique growth mechanism of nickel silicide (NiSi) nanowires (NWs) was thermodynamically investigated. The reaction between Ni and Si primarily determines NiSi phases according to the deposition condition. Optimum growth conditions were found at $375^{\circ}C$ leading long and high-density NiSi NWs. The ignition of NiSi NWs is determined by the grain size due to the nucleation limited silicide reaction. A successive Ni diffusion through a silicide layer was traced from a NW grown sample. Otherwise Ni-rich or Si-rich phase induces a film type growth. This work demonstrates specific existence of NiSi NW growth [7].

• Korean Journal of Materials Research
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• v.32 no.4
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• pp.216-222
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• 2022

The capacity of high nickel Li(Ni_xCo_yMn_1-x-y)O₂ (NCM, x ≥ 0.8) cathodes is known to rapidly decline, a serious problem that needs to be solved in a timely manner. It was reported that cathode materials with the {010} plane exposed toward the outside, i.e., a radial structure, can provide facile Li⁺ diffusion paths and stress buffer during repeated cycles. In addition, cathodes with a core-shell composition gradient are of great interest. For example, a stable surface structure can be achieved using relatively low nickel content on the surface. In this study, precursors of the high-nickel NCM were synthesized by coprecipitation in ambient atmosphere. Then, a transition metal solution for coprecipitation was replaced with a low nickel content and the coprecipitation reaction proceeded for the desired time. The electrochemical analysis of the core-shell cathode showed a capacity retention of 94 % after 100 cycles, compared to the initial discharge capacity of 184.74 mA h/g. The rate capability test also confirmed that the core-shell cathode had enhanced kinetics during charging and discharging at 1 A/g.