• 한국표면공학회지
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• 제51권4호
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• pp.197-201
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• 2018

Dynamic nano-indentation method was applied to characterize thin electroformed Ni-P layers. The Ni-P layers were produced in a sulphamic acid bath at $50^{\circ}C$ in $0.02A/cm^2$ for 10-60 minutes. The chemical analyses by XRD and EDX showed that the Ni-P layers were very fine grains with mainly $Ni_3P$ with Ni. The surface roughness determined by atomic force microscopy increased with thickness, which was relative to the surface morphology. The nano-hardness and the stiffness of the thin Ni-P layers with thickness of 1.9, 6.2 and $7.5{\mu}m$ were 5.52, 6.52 and 6.77 [GPa] and 56.7, 76.2 and 108.0 [${\mu}N/nm$], respectively. The elastic modulus of the Ni-P layer increased with thickness such as 37.29, 54.50 and 78.76 [GPa], respectively. The surface roughness of the electroplated Ni-P layers with diverse thickness was 8.66, 18.56 and 35.22 [nm], respectively. The enhanced nano-mechanical properties were related to mainly residual stress of the Ni-P layers.

• 전기화학회지
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• 제20권4호
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• pp.67-74
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• 2017

층상구조의 Ni-rich NCM계 양극활물질 $Li[Ni_xCo_{(1-x)/2}Mn_{(1-x)/2}]O_2$ ($x{\geq}0.6$)은 $LiCoO_2$ 대비 높은 에너지밀도와 가격 경쟁력의 장점을 가진다. Ni 함량에 비례하여 가역 방전용량이 증가하는 장점이 있는 반면, 합성 중에 발생하는 양이온 혼합으로 인해 안정적인 전기화학성능을 구현하기 어려운 문제가 있다. 본 연구에서는 합성 분위기, 리튬 원료물질, 합성 시간, 합성 온도, Li/M (M=transition metal) 비율 등의 다양한 합성조건을 변수로 하여 Ni 함량 증가에 따라 최적의 층상구조 Ni-rich NCM을 각각 합성하고 이에 대한 전기화학성능을 보고하였다. $Li[Ni_{0.6}Co_{0.2}Mn_{0.2}]O_2$ (NCM6)을 기준으로 Ni 함량이 증가한 $Li[Ni_{0.7}Co_{0.15}Mn_{0.15}]O_2$ (NCM7)와 $Li[Ni_{0.8}Co_{0.1}Mn_{0.1}]O_2$ (NCM8)의 합성시 전이금속 중 Ni의 비율이 증가함에 따라 양이온 혼합이 증가하는 것이 관찰되었고, 이는 전기화학 성능에 부정적인 영향을 끼치는 것으로 확인되었다. Ni 비율별 NCM에 대한 연구결과 비율 내확인한 최적의 조건에서 NCM6은 $180mAh{\cdot}g^{-1}$, 96.2% (50회), NCM7은 $187mAh{\cdot}g^{-1}$, 94.7% (50회), NCM8은 $201mAh{\cdot}g^{-1}$, 92.7% (50회)의 초기 방전용량 및 수명평가 후 용량유지율 값을 각각 구현하였다.

• Corrosion Science and Technology
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• 제2권4호
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• pp.197-201
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• 2003

In this study, Ni-P layers were electroplated on the surface of stainless steel in order to investigate the effects of an additive and agitation on their mechanical properties and microstructure. The concentration of the additive in the plating solution increased, the pores formed in the layer decreased, while the residual stress developed in the layers during electroplating increased. Agitation of the solution during electroplating was observed to force to increase local pores in the layer, which lowers its tensile properties. Grain growth was suppressed due to very fine $Ni_3P$ precipitates formed at its grain boundaries during heat treatment at $343^{\circ}C$ for 1 hr in air.

• 대한기계학회논문집A
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• 제33권3호
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• pp.201-209
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• 2009

The objective of present research work is to design the heat conductive mould to improve cooling characteristics of the injection mould for a mouse. In order to obtain the high cooling rate of the mould, a heat conductive mould with three different materials was designed. The materials of the base structure, the mid-layer and the molding part of the heat conductive mould were chosen as Cu-Ni alloy (Ampcoloy 940) to improve the heat conductivity of the mould, Ni-Cu alloy (Monel 400) to reduce a thermal stress, injection tool steel (P21), respectively. Through the three-dimensional transient heat transfer analysis and the thermal stress analysis, the effects of the geometrical arrangement of each material on the cooling characteristics and the thermal stress distribution were examined. From the results of the analyses, a proper design of the thermal conductive mould was obtained.

• 연구논문집
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• 통권27호
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• pp.201-208
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• 1997

본 연구에서는 배기 가스 촉매정화용 금속담체 지지체의 접합특성을 향상시키기 위하여, 브레이징 접합부의 고온내산화성에 미치는 브레이징 합금원소의 영향을 고찰하였다. 브레이징은 Ni계 합금인 BNi-5 분말(Ni-Cr-Si계합금)과 MBF-50 foil(Ni-Cr-Si-B계 합금)을 사용하여 $1200^\circC$의 진공중에서 행하였다. 약 1-1.5 wt%의 B을 함유한 MBF-50으로 브레이징된 시편이 BNi-5로 브레이징된 시편에 비해 내산화성이 떨어지는 것으로 나타났으며. 이것은 합금/브레이징 계변을 따라 형성된 Kirkendall void를 통한 산소의 빠른 침투로 인한 것으로 생각된다.

• International Journal of Industrial Entomology and Biomaterials
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• 제7권2호
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• pp.197-201
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• 2003

The recombinant plasmids harboring a heterologous gene coding mouse endostatin were transfected and expressed stably in Trichoplusia ni Tn 5B1-4 cells and Bombyx mori BmN cells, respectively. Recombinant endostatin expressed in the stably transformed Tn 5B1-4 and BmN cells was secreted into the medium. BmN cells are relatively lower in maximum cell growth and recombinant endostatin production than Tn 5B 1-4 cells. Recombinant endostatin was also purified to homogeneity using a simple one-step ${Ni^2+}$ affinity fractionation method. Purified recombinant endostatin inhibited endothelial cell proliferation in a dose-dependent manner. The concentration at half-maximum inhibition $({ED_50})$ for recombinant endostatin was approximately 0.35 ${\mu}g$/ml.

• 대한치과교정학회지
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• 제43권4호
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• pp.201-206
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• 2013

This article describes the orthodontic treatment of a 25-year-old Korean female patient with anterior crowding, including palatally displaced lateral incisors. Her facial profile was satisfactory, but 3.5 mm of maxillary anterior crowding was observed. To correct this crowding, we decided to minimize the use of the conventional fixed orthodontic appliances and employed a less bulky and more aesthetic appliance for applying light continuous force. We determined the final positions of the maxillary teeth via a working model for diagnostic set up and achieved space gaining and alignment with simple Ni-Ti spring and stainless steel round tubes. Tooth alignment was achieved efficiently and aesthetically without the conventional brackets.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2016년도 추계학술대회 논문집
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• pp.201.1-201.1
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• 2016

전주된 Invar (Fe-35%Ni) 박판 위에 증착된 Cu 박막은 스퍼터 전력량이 증가할수록 증착속도가 증가하였다. Cu/Invar 박판이 Invar 박판보다 면저항 값이 34%로 작았다. Invar 박판 위에 Cu가 증착되면 최대자화와 투자율은 각각 40.3, 65.0 [%] 감소하였다. Cu 박막의 탄성하강강성도, 마찰계수, 피로한계는 각각 45, 0.130, 0.093 이었다. 동적 나노 압침법으로 얻은 Invaar/Cu 박막의 하중-시간-변위 곡선의 가장 큰 차이는 탄성하강강성도(elastic stiffness) 이었다. 미세경도와 나노경도의 실험적 관계식은 $Y[GPa]=9.18{\times}10^{-3}X[Hv]$ 이었다. 나노압침선단의 하중분포를 이차원 선형 및 비선형 유한요소해석을 통하여 1.0 [mN] 의 정적하중을 가한 Cu 박막은 486 [mN] 으로 예측되었다. 이는 표면탐침현미경으로 관찰한 압흔의 변형정도와 유사한 경향을 보였다.

• 대한화학회지
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• 제18권3호
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• pp.194-201
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• 1974

네자리 schiff리간드는 salicylaldehyde와 m-phenylenediamine을 Duff-반응 시킴으로써 N,N-bis(salicylaldehyde)-m-phenylenediimine을 합성하고 이 리간드와 Cu(II), Ni(II), Co(II) 및 Zn(II) 이온들과의 새로운 착물 Cu(II)$[C_{20}H_{14}O_2N_2]{\cdot}2H_2O, Co(II)[C_{20}H_{14}O_2N_2]{\cdot}2H_2O$ 및 Zn(II)$[C_{20}H_{14}O_2N_2]{\cdot}4H_2O$들을 합성하였다. 이들 착물에 대하여 가시부 흡수스펙트럼, 적외선스펙트럼, TGA, X-ray 회절 및 원소분석 결과에 의하여 Cu(II), Ni(II) 및 Co(II) 착물들은 리간드와 금속이 1:1 몰비 및 2수화물의 6배위 착물로 주어지며 Zn(II) 착물은 1:2 몰비 4배위 착물로 주어짐을 알았다

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 추계학술대회 논문집 Vol.15
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• pp.198-201
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• 2002

In this paper, the dependence of Ni-silicide properties such as sheet resistance and cross-sectional profile on the dopants have been characterized. There was little dependence of sheet resistance on the used dopants such as As, P, $BF_{2}$ and $B_{11}$ just after RTP (Rapid Thermal Process). However, the silicide properties showed strong dependence on the dopants when thermal treatment was applied after formation of Ni-silicide. $BF_{2}$ implanted sample shows the best stable property, while $B_{11}$ implanted one was thermally unstable. The main reason of the excellent property of $BF_{2}$ sample is believed to be the retardation of Ni diffusion by the flourine.