• Proceedings of the Materials Research Society of Korea Conference
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• 2003.11a
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• pp.201-201
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• 2003

It has been well known that Ni-MILC TFTs are acceptable for operation of LCD devices but still decrease of annealing temperature is desirable for the future devices like LCD on the plastic substrate. In this work, Cu was added to Ni-MILC in an attempt to lower the annealing temperature and enhance the MILC rate. It has been found that even small amount of Cu addition enhances the MlLC rate considerably. Also well One MILC can be distinguished from island type, which cannot be observed in pure Ni-MILC. Poly TFTs were fabricated with Cu/Ni-MILC and the effects of copper addition on the electrical properties were carefully investigated.

• Journal of Power System Engineering
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• v.11 no.4
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• pp.92-97
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• 2007

This study aims at investigating the wear behavior of thermally sprayed Ni-based self-flux alloy coatings against different counterparts. Ni-based self-flux alloy powders were flame-sprayed onto a carbon steel substrate and then heat-treated at temperature of $1000^{\circ}C$. Dry sliding wear tests were performed using the sliding speeds of 0.2 and 0.8 m/s and the applied loads of 5 and 20 N. AISI 52100, $Al_2O_3$, $Si_3N_4$ and $ZrO_2$ balls were used as counterpart materials. Wear behavior of Ni-based self-flux alloy coatings against different counterparts were studied using a scanning electron microscope(SEM) and energy dispersive X-ray spectroscopy (EDX). It was revealed that wear behavior of Ni-based self-flux alloy coatings were much influenced by counterpart materials.

• Journal of Surface Science and Engineering
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• v.16 no.2
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• pp.41-47
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• 1983

An investigation has been performed on the effects of temperature and Ni addition on the wetting behaviour of Cu on W substrate in hydrogen atmosphere. An sessile drop method was used to measure a wetting angle. The concentration profiles of W, Cu and Ni elements in W/Cu - 5 Ni specimen were made by EPMA. With increasing temperature, the wetting angle of Cu droplet on W plate decreases and the time to reach an equilibrium wetting angle is shortened in hydrogen atmosphere. The addition of Ni improves appreciably the wettability of Cu on W. With increasing Ni content in Cu liquid droplet(0, 1, 3, 5%), the wetting angle is decreased from 21$^{\circ}$to 0$^{\circ}$.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.07a
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• pp.185-188
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• 2000

Crystal orientation of Ni$_{18}$ $Fe_{19}$ thin films prepared by facing targets sputtering system was investigated. FTS system can deposit a high quality thin film and control deposition conditions in wide range. T he crystallographic characteristics of Ni$_{18}$ $Fe_{19}$ thin films on variation of thickness and substrate tempera ture was investigated by XRD and AFM. As a result, we obtained Ni$_{18}$ $Fe_{19}$ thin films prepared at subst rate temperature room temperature, thickness 160nm and over revealed good crystal orientation to [111] direction.irection.

• Journal of the Korean Vacuum Society
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• v.22 no.6
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• pp.277-284
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• 2013

Carbon coils could be synthesized using $C_2H_2/H_2$ as source gases and $SF_6$ as an incorporated additive gas under thermal chemical vapor deposition system. The Ni layer on the $SiO_2$ substrate was used as a catalyst for the formation of the carbon coils. The characteristics (formation densities, morphologies, and geometries) of the as-grown carbon coils on the substrate with or without the $H_2$ plasma pretreatment process were investigated. By the relatively short time (1 minute) $H_2$ plasma pretreatment on the Ni catalyst layered-substrate prior to the carbon coils synthesis reaction, the dominant formation of the carbon microcoils on the substrate could be achieved. After the relatively long time (30 minutes) $H_2$ plasma pretreatment process, on the other hand, we could obtain the noble-shaped geometrical nanostructures, namely the formation of the numerous carbon nanocoils along the growth of the carbon microcoils. This noble-shaped geometrical nanostructure seemed to play a promising role as the good catalyst support for holding the very tiny Ni catalyst grains.

• Applied Microscopy
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• v.45 no.1
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• pp.16-22
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• 2015

The reaction kinetics of the growth of Ni germanide in the Ni/Zr-interlayer/Ge system was investigated using isothermal in situ annealing at three different temperatures in a transmission electron microscope. The growth rate of Ni germanide in the Ni/Zr-interlayer/Ge system was determined to be diffusion controlled and depended on the square root of the time, with the activation energy of $1.04P{\pm}0.04eV$. For the Ni/Zr-interlayer/Ge system, no intermediate or intermixing layer between the Zr-interlayer and Ge substrate was formed, and thus the Ni germanide was formed and grew uniformly due to Ni diffusion through the diffusion path created in the amorphous Zr-interlayer during the annealing process in the absence of any intermetallic compounds. The reaction kinetics in the Ni/Zr-interlayer/Ge system was affected only by the Zr-interlayer.

• Korean Journal of Metals and Materials
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• v.49 no.4
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• pp.313-320
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• 2011

100 nm-thick hydrogenated amorphous silicon $({\alpha}-Si:H)$ films were deposited on a glass and glass/30 nm Ni substrates by inductively-coupled plasma chemical vapor deposition (ICP-CVD) at temperatures ranging from 100 to $550^{\circ}C$. The sheet resistance, microstructure, phase transformation and surface roughness of the films were characterized using a four-point probe, AFM (atomic force microscope), TEM (transmission electron microscope), AES (Auger electron spectroscopy), HR-XRD(high resolution X-ray diffraction), and micro-Raman spectroscopy. A nano-thick NiSi phase was formed at substrate temperatures >$400^{\circ}C$. AFM confirmed that the surface roughness did not change as the substrate temperature increased, but it increased abruptly to 6.6 nm above $400^{\circ}C$ on the glass/30 nm Ni substrates. HR-XRD and micro-Raman spectroscopy showed that all the Si samples were amorphous on the glass substrates, whereas crystalline silicon appeared at $550^{\circ}C$ on the glass/30 nm Ni substrates. These results show that crystalline NiSi and Si can be prepared simultaneously on Ni-inserted substrates.

• Korean Journal of Materials Research
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• v.15 no.6
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• pp.375-381
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• 2005

High temperature oxidation behavior of thermal barrier coating (TBC) system (IN738 substrate + NiCoCrAlY or NiAl bond coat with or without Pt + yttria stabilized zirconia) prepared by air plasma spray (APS) process has been studied in order to understand the effect of Pt addition to bond coat on the stability of TBC system. Specimens were oxidized in thermal cycling and isothermal oxidation test at $1100^{\circ}C$. The Pt addition in TBC system with NiCoCrAlY bond coat showed a longer life time compared to that without addition of Pt. Pt addition to TBC system is believed to help the formation of more stable thermally grown oxide, $Al_2O_3$, at the TBC/bond coat interface, leading to a longer lifetime of TBC system.

• Journal of the Korean Ceramic Society
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• v.43 no.12 s.295
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• pp.805-811
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• 2006

The microstructural changes in Ni/YSZ anode substrate and crack formation during Ni oxidation were investigated. The composition of as-sintered anodes was 56 wt% NiO+44 wt% YSZ and that of electrolyte was 8 mol% yttria. After complete reduction, specimens were oxidized in $N_2$ + air at $600\sim800^{\circ}C$. Oxygen partial pressure was controlled in between 0.05 atm and 0.2 atm $O_2$. When the anode was oxidized, at higher than $690^{\circ}C$, three layers were formed in the specimens. The first was fully oxidized layer(NiO/YSZ), the second was a mixed layer and the third, near-intact layer. Under $640^{\circ}C$ such distinctive layers were not observed. Cracks formed at electrolyte layer when weight gain attained at $65\sim75%$ of the total gain due to complete oxidation despite of different oxidation temperature and oxygen partial pressure.

• Progress in Superconductivity and Cryogenics
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• v.8 no.1
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• pp.19-22
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• 2006

Desirable substrates for $YBa_2Cu_3O_{7-\delta}$ coated conductor are highly cube textured Ni or Ni-alloy tapes, which can be produced by cold rolling and recrystallization annealing. We have fabricated hi-axially textured pure Ni tapes for the application of coated conductors. The sintered Ni rod was cold-rolled into the thin tapes of $50{\mu}m$ thickness and the tapes were heat-treated for texture development with line-focused infrared heater. The temperature was maintained at $800\sim1050^{\circ}C$, using 1kW double ended linear halogen lamp in $96%Ar-4%H_2$ atmosphere The biaxially tortured Ni tapes were successfully formed by line-focused infrared heat treatment The texture of the annealed Ni tapes was analysed using the GADDS (general area detector diffraction system). The full width at half maximum values of phi and omega scan for the Ni tapes were less than $10^{\circ}$ and the grain size was $20-50{\mu}m$.