• Journal of Korea Foundry Society
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• v.31 no.2
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• pp.83-86
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• 2011

Ni-Al based intermetallic compounds of self-propagating high-temperature synthesis (SHS) by the heat of molten aluminum and been coated on the aluminum casting alloy. The effects of the pouring temperature in casting and the thickness of casting substrate on SHS of the coating layer have been investigated. The experimental result showed that the reaction of the coating layer was activated with increasing the pouring temperature in casting and the thickness of casting substrate. However, the aluminum substrate was re-melted by the heat of formation for intermetallic compounds. Then, it was considered that some mechanical or thermal treatments for elemental powder mixtures were required to control the heat of formation for intermetallic compounds in advance.

• Journal of the Korean institute of surface engineering
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• v.31 no.6
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• pp.379-388
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• 1998

The iron-zinc interfacial reaction and corrosin properties in galvanizing bath containning Ni have been intestigated. The substrate steel plates were galvanized in Zn or Zn-0.018Al baths with various Ni contents. The corrosion resistance of galvanized specimens was also evaluated by $60^{\circ}$bending test for galvannealing speaaimens. The corrosion resistance was improved with Ni addition in pure Zn bath, while deteriorated with Ni addition in Zn-0.18Al bath. The anti-powdering property, on thhe otherhand, was improved with Ni addition in Zn-0.18Al bath, while deteriorated with Ni addition in pure Zn. It was found that the anti-powdering property was improved with increasing $\xi$ phase ratio in reaction layer.

• Journal of the Korean Magnetics Society
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• v.6 no.5
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• pp.329-333
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• 1996

We have studied the magnetoresistance and the magnetic anisotropy of Cu/(NiFe/Ni/NiFe) metallic multi layers grown on Si(100), Si(111), $4^{\circ}\;tilt-cut\;Si(111)$ or glass substrate. When the multilayer was grown on $4^{\circ}\;tilt-cut\;Si(111)$ with $50\;{\AA}$ of Cu underlayer, an in-plane uniaxial anisotropy was observed. On the other substrates such as Si(100), Si(111) or glass with Cu underlayer, however, no appreciable anisotropy was shown. The multilayer grown with NiFe or Ni underlayer or without underlayer did not show any arnsotropy even on $4^{\circ}\;tilt-cut\;Si(111)$. When $10\;{\AA}$ of NiFe was deposited prior to the Cu underlayer, the anisotropy in Cu/(NiFe/Ni/NiFe) multilayer disappeared.

• Journal of Powder Materials
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• v.10 no.4
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• pp.241-248
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• 2003

Biaxially textured Ni tapes were fabricated by a cold working and recrystallization heat treatment processes from powder compact rods. The processing parameters associated with the cube texture formation in Ni tapes were systematically investigated by using X-ray diffraction and pole-figure analysis. The Ni powder used in this study was 5 $\mu$m in size and 99.99% in purity. To find the optimum sintering temperature, tensile tests were performed for Ni rods sintered at various temperatures. The Ni rods sintered at 100$0^{\circ}C$ showed poor elongation and low fracture strength, while the Wi rods sintered above 100$0^{\circ}C$ revealed good mechanical properties. The higher elongation and fracture strength of the Ni rods sintered at higher temperatures than 100$0^{\circ}C$ are attributed to the full densification of the sintered rods. The sintered Ni rods were cold-rolled with 5% reduction to the final thickness of 100 $\mu$m and then annealed for development of rube texture in rolled Ni tapes. The annealed Ni tapes depicted strong cube texture with FWHM(full-width at half-maximum) of in-plane and out-of-plane in the range of 8$^{\circ}$ to 10$^{\circ}$. The NiO deposited on the Ni tapes by MOCVD process showed good epitaxy with FWHM=10$^{\circ}$, which indicates that the Ni tapes can be used as a substrate for YBCO coated conductors.

• 한국초전도학회:학술대회논문집
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• v.13
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• pp.88-88
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• 2003

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.11a
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• pp.35-35
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• 2004

• Proceedings of the KWS Conference
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• 2003.05a
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• pp.187-189
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• 2003

• Journal of the Korean Ceramic Society
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• v.36 no.5
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• pp.521-530
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• 1999

• Proceedings of the Korea Institute of Applied Superconductivity and Cryogenics Conference
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• 2002.02a
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• pp.119-122
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• 2002

The NiO buffer layers for YBCO coated conductor were prepared on textured Ni substrates by MOCVD method and the degree of texturizing and the surface roughness were analyzed X-ray pole figure and AFM and SEM. Processing variables were oxygen partial pressure and substrate temperature. (200) textured NiO layer was formed at 450~$470^{\circ}C$ and oxygen partial pressure of 1.67 Torr. Out-of-plane($\omega$-scan) and in-plane($\Phi$-scan) texture were $10.34^{\circ}$ and $10.00^{\circ}$ respectively. The surface roughness estimated by atomic force microscopy was in the range of 3.1~4.6 nm.

• Journal of the Korean institute of surface engineering
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• v.32 no.4
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• pp.503-512
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• 1999

The crystal structure and the microstructure of the intermetallic compounds formed in the interface between In solder and Au/Ni/Ti thin films have been investigated by XRD, SEM, and TEM. Indium solder was deposited on the Au/Ni/Ti thin films/Si substrate by evaporation. The heat treatments simulated the flip chip solder joining were performed in RTA system or in furnace. $Auln_2$ phase is formed in all specimens.$ In_{27}$ $Ni_{10}$ and/or $In_{X}$ $Ni_{Y}$ phase are formed in the interface between $Auln_2$ and Ni depending the heat treatment conditions.