• Transactions on Electrical and Electronic Materials
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• v.9 no.2
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• pp.47-51
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• 2008

In this paper, thermal stability of Nickel silicide formed on p-type silicon wafer using Ni-V alloy film was studied. As compared with pure Ni, Ni-V shows better thermal stability. The addition of Vanadium suppresses the phase transition of NiSi to $NiSi_2$ effectively. Ni-V single structure shows the best thermal stability compared with the other Ni-silicide using TiN and Co/TiN capping layers. To enhance the thermal stability up to $650^{\circ}C$ and find out the optimal thickness of Ni silicide, different thickness of Ni-V was also investigated in this work.

• Proceedings of the IEEK Conference
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• 2005.11a
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• pp.611-614
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• 2005

In this paper, investigated is the relationship between the formation temperature and the thermal stability of Ni silicide formed with Ni-V (Nickel Vanadium) alloy target. The sheet resistance after the formation of Ni silicide with the Ni-V showed stable characteristic up to RTP temperature of $700\;^{\circ}C$ while degradation of sheet resistance started at that temperature in case of pure-Ni. Moreover, the Ni silicide with Ni-V indicated more thermally stable characteristic after the post-silicidation annealing. It is further found that the thermal robustness of Ni silicide with Ni-V was highly dependent on the formation temperature. With the increased silicidation temperature (around $700\;^{\circ}C$), the more thermally stable Ni silicide was formed than that of low temperature case using the Ni-V.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.16-17
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• 2006

In this paper, Ni-V alloy was studied with different structures and thickness. In case of Ni-V and Ni-V/Co/TiN, low resistive Ni silicide was formed after one step RTP (Rapid Thermal Process) with temperature range from $400^{\circ}C$ to $600^{\circ}C$ for 30sec in vacuum. After furnace annealing with temperatures range from $550^{\circ}C$ to $650^{\circ}C$ for 30min in nitrogen ambient, Ni-V single structure shows the best thermal stability compare with the other ones. To enhance the thermal stability up to 650oC and find the optimal thickness of Ni silicide, different thickness of Ni-V was studied in this work. Stable sheet resistance was obtained through Ni-V single structure with optimal Ni-V thickness.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2000.05a
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• pp.1-1
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• 2000

The results of the modification of metal materials treated by high temperature pulst:d plasma fluxes (HTlPPF) with a specific power of incident flux changing in the $(3...100)10^5{]\;}W/cm^2$ range and a pulse duration lying from 15 to $50{\;}\mu\textrm{s}$ have been presented. The results of HTPPF action were studied on the stainless steels of 18Cr-l0Ni, 16Cr- 15Ni, 13Cr-2Mo types; on the structural carbon steels of (13...35)Cr, St. 3, St. 20, St. 45 types; on the tool steels of U8, 65G, ShHI5 types, and others; on nickel and high nickel alloy of 20Cr-45Ni type; on zirconium- and vanadium-base alloys and other materials. The microstructure and properties (mechanical, tribological, erosion, and other properties) of modified materials and surface alloying of metals exposed to HTPPF action have been investigated. It was found that the modification of materials by HTPPF resulted in a simultaneous increase of several properties of the treated articles: microhardness of the surface and layers of 40...60 $\mu\textrm{m}$ in depth, tribological characteristics (friction coefficient, wear resistance), mechanical properties ({\sigma_y}, {\;}{\sigma_{0.2}}.{\;}{\sigma_r}) on retention of the initial plasticity ($\delta$), corrosion resistance, radistanation erosion under ion irradiation, and others. The determining factor of the changes observed is the structural-phase modification of the near-surface layers, in particular, the formation of the fine cellular structure in the near-surface layers at a depth of $20{\;}{\mu\textrm{m}}$ with dimension of cells changing in the range from 0.1 to $1., 5{\;}\mu\textrm{m}$, depending on the kind of material, its preliminary treatment, and the parameters of plasma fluxes. The remits obtained have shown the possibility of purposeful surface alloying of metals exposed to HTPPF action over a depth up to 20...45 $\mu\textrm{m}$ and the concentration of alloying element (Ni, Cr, V) up to 20 wt.%. Possible industrial brunches for using the treatment have been also considered, as well as some results on modifying the serial industrial articles by HTPPF.

• Nuclear Engineering and Technology
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• v.52 no.3
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• pp.647-653
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• 2020

Stainless steel is used commonly in nuclear applications for shielding radiation, so in this study, three different types of new stainless steel samples were designed and developed. New stainless steel compound ratios were determined by using Monte Carlo Simulation program Geant 4 code. In the sample production, iron (Fe), nickel (Ni), chromium (Cr), silicium (Si), sulphur (S), carbon (C), molybdenum (Mo), manganese (Mn), wolfram (W), rhenium (Re), titanium (Ti) and vanadium (V), powder materials were used with powder metallurgy method. Total macroscopic cross sections, mean free path and transmission number were calculated for the fast neutron radiation shielding by using (Geant 4) code. In addition to neutron shielding, the gamma absorption parameters such as mass attenuation coefficients (MACs) and half value layer (HVL) were calculated using Win-XCOM software. Sulfuric acid abrasion and compressive strength tests were carried out and all samples showed good resistance to acid wear and pressure force. The neutron equivalent dose was measured using an average 4.5 MeV energy fast neutron source. Results were compared to 316LN type stainless steel, which commonly used in shielding radiation. New stainless steel samples were found to absorb neutron better than 316LN stainless steel at both low and high temperatures.