Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference (한국전기전자재료학회:학술대회논문집)
- 2006.06a
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- Pages.16-17
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- 2006
Study of thermal stability of Ni Silicide using Ni-V Alloy
- Zhong, Zhun (Chungnam National University) ;
- Oh, Soon-Young (Chungnam National University) ;
- Kim, Yong-Jin (Chungnam National University) ;
- Lee, Won-Jae (Chungnam National University) ;
- Zhang, Ying-Ying (Chungnam National University) ;
- Jung, Soon-Yen (Chungnam National University) ;
- Li, Shi-Guang (Chungnam National University) ;
- Kim, Yeong-Cheol (Korea University of Technology and Education) ;
- Wang, Jin-Suk (Chungnam National University) ;
- Lee, Hi-Deok (Chungnam National University)
- Published : 2006.06.22
Abstract
In this paper, Ni-V alloy was studied with different structures and thickness. In case of Ni-V and Ni-V/Co/TiN, low resistive Ni silicide was formed after one step RTP (Rapid Thermal Process) with temperature range from