• The Sea:JOURNAL OF THE KOREAN SOCIETY OF OCEANOGRAPHY
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• v.2 no.2
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• pp.117-124
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• 1997

Vertical profiles of dissolved Cu and Ni at the upper 400 m water layer have been determined at two stations in the central East Sea in October 1995. This is the first report on the vertical distribution of trace metals in Korea. Copper concentrations are in the range of 2.1~5.8 nmol/kg and 1.6~2.4 nmol/kg for stations S and N, respectively. The vertical profile of Cu at S is found a scavenging type (i.e., drastic decrease with increasing depth). Concentrations of Ni range from 4.3 to 7.1 nmol/kg and from 3.4 to 5.4 nmol/kg for stations Sand N, respectively. At station S, Ni is best correlated with phosphate, but not at stations N. Such difference between two stations are probably due to their different vertical distribution of water masses. Station S has a strongly stratified water column with 6 distinct water masses, but station N with a well-mixed subsurface water layer extending from 50 to 300 m depth. Extremely low salinity (31.87~31.96 psu) found at the surface water of station S was interpreted as a result of the Yangtze River effluents which were probably fed into the East Sea through the Korea Strait during the late summer. Such seasonal appearance of low salinity in southern part of the East Sea was reported previously. The concentrations of Cu and Ni at two sites are comparable to those reported in the North Pacific. It was found that Ni mostly exist as dissolved phase.

• Analytical Science and Technology
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• v.12 no.1
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• pp.40-46
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• 1999

Zn-Ni alloy electrodeposition on steel has been examined by means of X-ray diffraction and scanning electron microscopy. The effect of current density, $Ni^{2+}$ ion concentration, and $Cl^-$ ion concentration on the structure as well as morphology of the electrodeposit have been studied. The Ni content of the electrodeposit increased with decreasing current density in the range studied in this work. The Ni content of the electrodeposit also increased with increasing $Ni^{2+}$ ion and $Cl^-$ ion concentrations. The structure change of the electrodeposit was closely related to the Ni content. In fact, the mixture phase of ${\eta}$ and ${\gamma}$ was found below 10 wt.% of Ni while the ${\gamma}$ phase only was observed above 10 wt.% of Ni. In addition, the lattice parameter, a, of then phase structure increased and the lattice parameter, c, of it decreased as the Ni content of the electrodeposit increased. The morphology of the electrodeposit varied from the plate-like shape to the fine granular shape depending upon the change in composition and structure of the electrodeposit.

• Journal of the Korean Magnetics Society
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• v.18 no.1
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• pp.43-47
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• 2008

[ $ZnO-Bi_2O_3-Al_2O_3-B_2O_3-SiO_2$ ] nano-glass has been prepared by sol-gel method. The mean particle size was 60.3 nm with narrow size distribution. The nano-galss has been used as a sintering aid for the densification of the NiZnCu ferrites. The ferrite was sintered with nano-glass sintering aids at $840{\sim}900^{\circ}C$, 2 h and the initial permeability, quality factor, density, and saturation magnetization were also measured. The initial permeability of 0.5 wt% nano-glass added toroidal sample for NiZnCu ferrites sintered at $900^{\circ}C$ was 193.3 at 1 MHz. The initial permeability and saturation magnetization were increased with increasing annealing temperature. As a result, $ZnO-Bi_2O_3-Al_2O_3-B_2O_3-SiO_2$ nano-glass systems were found to be useful as sintering aids for multilayer chip inductors.

• Proceedings of the Korea Institute of Applied Superconductivity and Cryogenics Conference
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• 2002.02a
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• pp.340-340
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• 2002

In an effort to develop alternative single buffer layer technology for YBa$_2$Cu$_3$O$_{7-{\delta}}$ (YBCO) coated conductors, we have investigated both LaMnO$_3$, (LMO) and La$_2$Zr$_2$O$_{7}$ (LZO) as potential buffer layers. High-quality LMO films were grown directly on textured Ni and Ni-W (3%) substrates using rf magnetron sputtering. Highly textured LZO buffers were grown on textured Ni substrates using sol-gel alkoxide processing route. YBCO films were then grown on both LMO and LZO buffers using pulsed laser deposition. Detailed X-ray studies have shown that YBCO films were grown on both LMO and LZO layers with a single epitaxial orientation. A high J$_{c}$ of over 1 MA/cm$^2$ at 77 K and self-field was obtained on YBCO films grown on both LMO-buffered Ni or Ni-W substrates, and also on LZO-buffered Ni substrates. We have identified LaMnO$_3$ as a good diffusion barrier layer for Ni and it also provides a good template for growing high current density YBCO films. Similarly we have also demonstrated the growth of high J$_{c}$ YBCO films on all solution buffers. We will discuss in detail about our buffer deposition processes. processes.s.s.s.s.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.07a
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• pp.288-291
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• 2002

Application of metal silicides such as TiSi$_2$ and CoSi$_2$ as contacts and gate electrodes are being studied. However, TiSi$_2$ due to the linewidth-dependance, and CoSi$_2$ due to the excessive Si consumption during silicidation cannot be applied to the deep-submicron MOSFET device. NiSi shows no such problems and can be formed at the low temperature. But, NiSi shows thermal instability. In this investigation, NiSi was formed with a Ti-capping layer to improve the thermal stability. Ni and Ti films were deposited by the thermal evaporator. The samples were then annealed in the N$_2$ ambient at 300-800$^{\circ}C$ in a RTA (rapid thermal annealing) system. Four point probe, FESEM, and AES were used to study the thermal properties of Ti-capped NiSi layers. The Ti-capped NiSi was stable up to 700$^{\circ}C$ for 100 sec. RTA, while the uncapped NiSi layers showed high sheet resistance after 600$^{\circ}C$. The AES results revealed that the Ni diffusion further into the Si substrate was retarded by the capping layer, resulting in the suppression of agglomeration of NiSi films.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.31 no.3
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• pp.141-145
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• 2018

Ni-InGaAs shows promise as a self-aligned S/D (source/drain) alloy for n-InGaAs MOSFETs (metal-oxide-semiconductor field-effect transistors). However, limited thermal stability and instability of the microstructural morphology of Ni-InGaAs could limit the device performance. The in situ deposition of a Pd interlayer beneath the Ni layer was proposed as a strategy to improve the thermal stability of Ni-InGaAs. The Ni-InGaAs alloy layer prepared with the Pd interlayer showed better surface roughness and thermal stability after furnace annealing at $570^{\circ}C$ for 30 min, while the Ni-InGaAs without the Pd interlayer showed degradation above $500^{\circ}C$. The Pd/Ni/TiN structure offers a promising route to thermally immune Ni-InGaAs with applications in future n-InGaAs MOSFET technologies.

• Corrosion Science and Technology
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• v.3 no.5
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• pp.198-208
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• 2004

Although there has been no general agreement on the mechanism of primary water stress corrosion cracking (PWSCC) as one of major degradation modes of Ni-base alloys in pressurized water reactors (PWR's), common postulation derived from previous studies is that the damage to the alloy substrate can be related to mass transport characteristics and/or repair properties of overlaid oxide film. Recently, it was shown that the oxide film structure and PWSCC initiation time as well as crack growth rate were systematically varied as a function of dissolved hydrogen concentration in high temperature water, supporting the postulation. In order to understand how the oxide film composition can vary with water chemistry, this study was conducted to characterize oxide films on Alloy 600 by an in-situ Raman spectroscopy. Based on both experimental and thermodynamic prediction results, Ni/NiO thermodynamic equilibrium condition was defined as a function of electrochemical potential and temperature. The results agree well with Attanasio et al.'s data by contact electrical resistance measurements. The anomalously high PWSCC growth rate consistently observed in the vicinity of Ni/NiO equilibrium is then attributed to weak thermodynamic stability of NiO. Redox-induced phase transition between Ni metal and NiO may undermine the integrity of NiO and enhance presumably the percolation of oxidizing environment through the oxide film, especially along grain boundaries. The redox-induced grain boundary oxide degradation mechanism has been postulated and will be tested by using the in-situ Raman facility.

• Journal of Power System Engineering
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• v.11 no.1
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• pp.121-126
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• 2007

This study aims at investigating the effect of heat treatment conditions on the dry sliding wear behavior of thermally sprayed Ni-based self-flux alloy coatings. Ni-based self-flux alloy powders were sprayed onto a carbon steel substrate and then heat-treated at 700, 800, 900 and $1000^{\circ}C$ for 30 minutes in a vacuum furnace. Dry sliding wear tests were performed using sliding speed of 0.4 m/s and applied load of 6 N. AISI 52100 ball(diameter 8 mm) was used as counterparts. Microstructure and wear behavior of both as-sprayed and heat-treated Ni-based self-flux alloy coatings were studied using a scanning electron microscope(SEM), energy dispersive X-ray spectroscopy(EDX), electron probe micro-analysis(EPMA) and X-ray diffraction(XRD). It was revealed that microstructure and wear behavior of thermally sprayed Ni-based self-flux alloy coatings were much influenced by heat treatment conditions.

• Proceedings of the KAIS Fall Conference
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• 2006.11a
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• pp.162-166
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• 2006

기존의 Ni PPF를 대신하여 새롭게 Cu-Sn 합금을 barrier층으로 적용한 PPF를 제조하여, 그 제반 특성들을 조사하였다. Cu-Sn 합금도금층은 기존의 Ni PPF와 마찬가지로 반도체 substrate로서 지녀야 할 열적 안정성을 충분히 확보할 수 있음을 알 수 있었다. 또한 기지층 및 보호층과의 계면간 밀착성이 Ni PPF보다 더 우수했으며, 미세한 결정립들이 균일하게 분포한 도금층 구조를 나타내어, 이들이 Ni PPF보다 구조적으로 더욱 안정할 것임을 예상할 수 있었다. 한편 강자성 거동을 보이는 Ni PPF와는 달리 Cu-Sn PPF는 완벽한 상자성 특성을 보여, 점차 고집적, 고밀도화 되어가는 반도체 패키지의 동작중 발생할 발열 및 신호간섭의 위험이 원천적으로 제거될 수 있음을 보였으며, solderability, bondability 등의 field 특성 또한 Ni PPF와 거의 비슷함을 알 수 있었다.

• Advances in nano research
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• v.14 no.2
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• pp.195-200
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• 2023

Safety in sports is important because if an athlete has an accident, he may not be able to lead an everyday life for the rest of his life. The safety of sports facilities is very effective in creating people's sports activities, with the benefits of staying away from physical injury, enjoying sports, and mental peace. Everyone has the right to participate in sports and recreation and to ensure that they want a safe environment. This study prepares a very good Nickel-Cobalt -Silicon carbide (Ni/Co-SiC) nanocomposite with convenient geometry on the leg press machine rod, employing the pulse electrodeposition technique to reduce the rod's wear and increase the durability of sports equipment and control sports damages. The results showed that the Ni/Co-SiC nanocomposite formed at 2 A/dm2 shows extraordinary microhardness. The wear speed for the Ni/Co-SiC nanocomposite created at 4 A/dm2 was 15 mg/min, showing superior wear resistance. Therefore, the Ni/Co-SiC nanocomposite can reduce sports equipment's wear and decrease sports injuries. Ni-Co/SiC nanocomposite layers with various scopes of silicon carbide nanoparticles via electrodeposition in a Ni-Co plating bath, including SiC nanoparticles to be co-deposited. The form and dimensions of Silicon carbide nanoparticles are watched and selected using Scanning Electron Microscopy (SEM).