• Korean Journal of Materials Research
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• v.23 no.4
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• pp.211-214
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• 2013

The effects of a Ni coating on the sensing properties of nano ZnO:Ni based gas sensors were studied for $CH_4$ and $CH_3CH_2CH_3$ gases. Nano ZnO sensing materials were prepared by the hydrothermal reaction method. The Ni coatings on the nano ZnO surface were deposited by the hydrolysis of zinc chloride with $NH_4OH$. The weight % of Ni coating on the ZnO surface ranged from 0 to 10 %. The nano ZnO:Ni gas sensors were fabricated by a screen printing method on alumina substrates. The structural and morphological properties of the nano ZnO : Ni sensing materials were investigated by XRD, EDS, and SEM. The XRD patterns showed that nano ZnO : Ni powders with a wurtzite structure were grown with (1 0 0), (0 0 2), and (1 0 1) dominant peaks. The particle size of nano ZnO powders was about 250 nm. The sensitivity of nano ZnO:Ni based sensors for 5 ppm $CH_4$ gas and $CH_3CH_2CH_3$ gas was measured at room temperature by comparing the resistance in air with that in target gases. The highest sensitivity of the ZnO:Ni sensor to $CH_4$ gas and $CH_3CH_2CH_3$ gas was observed at Ni 4 wt%. The response and recovery times of 4 wt% Ni coated ZnO:Ni gas sensors were 14 s and 15 s, respectively.

• Journal of the Korean Ceramic Society
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• v.43 no.12 s.295
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• pp.768-774
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• 2006

The microstructure of Ni-YSZ cermets was controlled with fine and coarse starting powders (NiO and YSZ) to obtain a optimum strong and conductive tubular anode support for SOFCs. Three types of cermets with different microstructures, i.e., coarse Ni-fine YSZ, fine Ni-coarse YSZ, and fine Ni-fine YSZ, were fabricated to investigate their electrical and mechanical properties. The cermets from fine NiO powder showed high electrical conductivity due to the enhanced percolation of Ni particles. The cermet by foe Ni and coarse YSZ showed excellent electrical conductivity (>1000 S/cm) despite its high porosity $(\sim40%)$ but it showed poor mechanical strength due to the lack of percolation by YSZ particles and due to large pores. Thus fine NiO and YSZ powders were used to make strong and conductive Ni-YSZ support tube by extrusion. The microstructure of the anode tube was modified by the amount of polymeric additives and carbon black, a pore former. Ni-YSZ tube (porosity $\sim34%$) with the finer microstructure showed better performance both in electrical conductivity (>1000 S/cm) and fracture strength $(\sim140\;MPa)$. Either flat or circular NiO-YSZ tubes with the length from 20 to 40cm were successfully fabricated with the optimized composition of materials and polymeric additives.

• Journal of the Korean Society for Heat Treatment
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• v.22 no.6
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• pp.354-360
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• 2009

This paper reports the oxidation mechanism of epitaxial Ni thin films grown on GaN/sapphire(0001) substrates, investigated by real-time x-ray diffraction and scanning electron microscopy. At the initial stage of oxidation process, a thin NiO layer with a thickness of ${\sim}50\;{\AA}$ was formed on top of the Ni films. The growth of such NiO layer was saturated and then served as a passive oxide layer for the further oxidation process. For the second oxidation stage, host Ni atoms diffused out to the surfaces of initially formed NiO layer through the defects running vertically to form NiO grains, while the sites that were occupied by host Ni, became voids. The crystallographic properties of resultant NiO films, such as grain size and mosaic distribution, rely highly on the oxidation temperatures.

• Proceedings of the Materials Research Society of Korea Conference
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• 2003.11a
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• pp.212-212
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• 2003

Many of the spin valve multilayer structures with FeMn as antiferromagnetic layer consist of a NiFe/FeMn/NiFe trilayer where the bottom NiFe layer is the seed layer to facilitate the growth of (111) gama-FeMn antiferromagnetic phase and the top NiFe layer forms the pinned layer[1], In this study, exchange bias of bottom NiFe layer has been investigated as functions of thicknesses of top and bottom NiFe in NiFe/FeMn/NiFe, prepared by rf magnetron sputtering, MH-loop was measured by vibration sample magnetometer (VSM). Two hysteresis loops are corresponded to bottom and top layers, similar to reported loops in spin valve structure. Exchange bias of bottom NiFe could be induced by the interfacial coupling between bottom NiFe and FeMn. But those coupling are strongly dependent on the top and bottom NiFe thicknesses, revealing anomalous character ul exchange bias of bottom NiFe layer.

• Journal of Astronomy and Space Sciences
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• v.34 no.4
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• pp.257-270
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• 2017

Solar activity is known to be linked to changes in the Earth's weather and climate. Nonetheless, for other types of extreme weather, such as tropical cyclones (TCs), the available evidence is less conclusive. In this study the modulation of TC genesis over the western North Pacific by the solar activity is investigated, in comparison with a large-scale environmental parameter, i.e., El-$Ni{\tilde{n}}o$-Southern Oscillation (ENSO). For this purpose, we have obtained the best track data for TCs in the western North Pacific from 1977 to 2016, spanning from the solar cycle 21 to the solar cycle 24. We have confirmed that in the El-$Ni{\tilde{n}}o$ periods TCs tend to form in the southeast, reach its maximum strength in the southeast, and end its life as TSs in the northeast, compared with the La-$Ni{\tilde{n}}o$ periods. TCs occurring in the El-$Ni{\tilde{n}}o$ periods are found to last longer compared with the La-$Ni{\tilde{n}}o$ periods. Furthermore, TCs occurring in the El-$Ni{\tilde{n}}o$ periods have a lower central pressure at their maximum strength than those occurring in the La-$Ni{\tilde{n}}o$ periods. We have found that TCs occurring in the solar maximum periods resemble those in the El-$Ni{\tilde{n}}o$ periods in their properties. We have also found that TCs occurring in the solar descending periods somehow resemble those in the El-$Ni{\tilde{n}}o$ periods in their properties. To make sure that it is not due to the ENSO effect, we have excluded TCs both in the El-$Ni{\tilde{n}}o$ periods and in the La-$Ni{\tilde{n}}o$ periods from the data set and repeated the analysis. In addition to this test, we have also reiterated our analysis twice with TCs whose maximum sustained winds speed exceeds 17 m/s, instead of 33 m/s, as well as TCs designated as a typhoon, which ends up with the same conclusions.

• Journal of the Korean Chemical Society
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• v.31 no.5
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• pp.382-388
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• 1987

Kinetics studies on the reaction system of $[Ni(H_2O)_6]^{2+}+4CN^-{\rightleftharpoons}[Ni(CN)_4]^{2-}$ have been carried out in 0.005% gelatin solution at $25^{\circ}C$ by means of conductometry. The fifth-order kinetics were observed in the formation rate of $[Ni(CN)_4]^{2-}$ from the reaction of [Ni(H$_2O)_6]^{2+}$ and [CN]$^-$. The reaction was found first order in $[Ni(H_2O)_6]^{2+}$ and fourth order in [CN]$^-$. ${\Delta}H^{\neq}$ and ${\Delta}S^{\neq}$ were obtained the values of 5.15kcal/mole and -35.07 e.u., respectively. We have proposed the possible mechanism from the data obtained.

• Proceedings of the Korean Society of Applied Pharmacology
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• 1994.11a
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• pp.69-80
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• 1994

Although ureases play important roles in microbial nitrogen metabolism and in the pathogenesis of several human diseases, little is known of the mechanism of metallocenter biosynthesis in this Ni-Containing enzyme. Klebsiella aerogenes urease apo-protein was purified from cells grown in the absence of Ni. The purified apo-enzyme showed the same native molecular weight, charge, and subunit stoichiometry as the holo-enzyme. Chemical modification studies were consistent with histidinyl ligation of Ni. Apo-enzyme could not be activated by simple addition of Ni ions suggesting a requirement for a cellular factor. Deletion analysis showed that four accessory genes (ureD, ureE, ureF, and ureG) are necessary for the functional incorporation of the urease metallocenter. Whereas the $\Delta$ureD, $\Delta$ureF, and $\Delta$ureG mutants are inactive and their ureases lack Ni, the $\Delta$ureE mutants retain partial activity and their ureases possess corresponding lower levels of Ni. UreE and UreG peptides were identified by SDS-polyacrylamide gel comparisons of mutant and wild type cells and by N-terminal sequencing. UreD and UreF peptides, which are synthesized at ve교 low levels, were identified by using in vitro transcription/translation methods. Cotransformation of E. coli cells with the complementing plasmids confirmed that ureD and ureF gene products act in trans. UreE was purified and characterized. immunogold electron microscopic studies were used to localize UreE to the cytoplasm. Equilibrium dialysis studies of purified UreE with $^{63}$ NiC1$_2$ showed that it binds ～6 Ni in a specific manner with a $K_{d}$ of 9.6 $\pm$1.3 $\mu$M. Results from spectroscopic studies demonstrated that Ni ions are ligated by 5 histidinyl residues and a sixth N or O atom, consistent with participation of the polyhistidine tail at the carboxyl termini of the dimeric UreE in Ni binding. With these results and other known features of the urease-related gene products, a model for urease metallocenter biosynthesis is proposed in which UreE binds Ni and acts as a Ni donor to the urease apo-protein while UreG binds ATP and couples its Hydrolysis to the Ni incorporation process.ouples its Hydrolysis to the Ni incorporation process.s.

• Journal of Welding and Joining
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• v.32 no.3
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• pp.60-67
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• 2014

The ability of electronic packages and assemblies to resist solder joint failure is becoming a growing concern. This paper reports on a study of high speed shear energy of Sn-4.0wt%Ag-0.5wt%Cu (SAC405) solder with different electroless Ni-P thickness, with $HNO_3$ vapor's status, and with various pre-conditions. A high speed shear testing of solder joints was conducted to find a relationship between the thickness of Ni-P deposit and the brittle fracture in electroless Ni-P deposit/SAC405 solder interconnection. A focused ion beam (FIB) was used to polish the cross sections to reveal details of the microstructure of the fractured pad surface with and without $HNO_3$ vapor treatment. A scanning electron microscopy (SEM) and an energy dispersive x-ray analysis (EDS) confirmed that there were three intermetallic compound (IMC) layers at the SAC405 solder joint interface: $(Ni,Cu)_3Sn_4$ layer, $(Ni,Cu)_2SnP$ layer, and $(Ni,Sn)_3P$ layer. The high speed shear energy of SAC405 solder joint with $3{\mu}m$ Ni-P deposit was found to be lower in pre-condition level#2, compared to that of $6{\mu}m$ Ni-P deposit. Results of focused ion beam and energy dispersive x-ray analysis of the fractured pad surfaces support the suggestion that the brittle fracture of $3{\mu}m$ Ni-P deposit is the result of Ni corrosion in the pre-condition level#2 and the $HNO_3$ vapor treatment.

• 한국정보디스플레이학회:학술대회논문집
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• 2003.07a
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• pp.1164-1167
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• 2003

Recently CRT is getting flatted, As change of CRT trend from normal type to Flat type, the material of Shadow Mask was also changed from AK(Aluminum Killed) to Invar(Fe-Ni alloy) materials Until now we have used just AK(Aluminum Killed) for normal type TV(not flat type), but main raw material of shadow mask component was changed. . However recently Invar(Fe-Ni alloy) materials, which has advantage of Low Thermal Expansion and High Strength, has been developed as well as applying in mass production as CRT's trend has become more flat and fine pitch. As main raw material of shadow mask component was changed, conditions of process were changed. One of them, the importance of pre-etching process (assistant process for developing & etching) is improved because there are so many particles in the pre-etching bath because of Ni compounds. Since the solubility of Ni in pre-etching solvent is very low related to Fe's, so the compounds of Ni happen to make particles.(the solubility of Fe is twenty times Ni's) that particles happen to make process troubles and NG productions so to clear the particles we had to established high cost filtering system, but it is useless. As time goes by the quantity of particles (Ni compounds) was increased because of the capability of filtering system was not enough, the particles was produced continuous in bath, and it make quality problems. Hence we tried to develop the new pre-etching solution to remove the particles (Ni compounds) and to cost down the filtering system's running cost. But in improving the solution we discovered the new pre-etching solution made the PR developing better. In former solution there were three kinds of chemistry (COOH)2 , H2O2 , H2S04 .first the function of (COOH)2 is drilling the surface of Invar, during this mechanism Ni compounds occurred. Second the function of H202 is removing the PR fringe (half UV exposure zone on PR(PVA)), Third the function of H2S04 is the catalysis of (COOH)2 In those, (COOH)2 was the main reason to make the Ni compounds. So to improve the solutions we had to change (COOH)2 to the other material. the chemistry we improved was a complex chemistry based on H2S04 . after using this chemistry the particles problem was disappeared and there was another advantage cut down the PR fringe. The New solution made the function of H202 better so the PR developing improved. To be direct the catalyst of the new solution helped the H202. anyway First thing after change the solution the quality of shadow Mask for flat color TV was improved & the yield also improved. But the more important thing is how to control the new solution. So we accepted the new concept which was the degree of freshness. The degree of freshness is based on non-reacted solution which was 100% ( the degree of freshness) and calculated the melted Ni quantity as time goes by. So we made the gauging liner plot. In conclusion, many companies tried to make fine pitched Shadow Mask ,generally to make quality jump up it needed a lot of cost & persons .in this case the shift of core material made it possible.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.3 s.36
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• pp.259-265
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• 2005

Characteristics of electroplated Ni films and $Ni-Al_2O_3$ composite films, such as yield strength, fracture elongation, and $Al_2O_3$ content, were evaluated as a function of electroplating current density. $Al_2O_3$ content was $11.48\~11.64\;vol\%$ for $Ni-Al_2O_3$ composite films electroplated at $5\~20\;mA/cm^2$, and decreased to $8.41\;vol\%$ at $30\;mA/cm^2$ $Ni-Al_2O_3$ possessed yield strengths higher than those of Ni films. Especially, $Ni-Al_2O_3$ fabricated at $5\;mA/cm^2$ exhibited $50\%$ improved yield strength. Fracture elongations of Ni and $Ni-Al_2O_3$ decreased with increasing the electroplating current density. $Ni-Al_2O_3$ electroplated at $5\;mA/cm^2$ exhibited more uniform dispersion of $Al_2O_3$ and higher yield strength and larger fracture elongation than the composite films processed at other current densities.