• Journal of the Korean Ceramic Society
• /
• v.41 no.8
• /
• pp.578-581
• /
• 2004

In this study, we proposed the novel method that can crystallize the amorphous silicon by adjacent Pd-MILC enhanced Ni-MILC. With this method, the MILC rate was about 15 ${\mu}$m/h at 550$^{\circ}C$ which is four times faster than conventional MILC rate. The crystallization rate increased rapidly with the spacing between Ni and Pd decreased. And it was independent on Ni and Pd layer thickness and amorphous silicon active width. However, when Pd was capped by a Ni layer, there's no enhancement on Ni-MILC. This phenomenon implies that the enhancement of Ni-MILC rate comes from not Pd material itself but Pd-MILC induced tensile stress. We can explain these phenomena with a novel MILC mechanism.

• Proceedings of the Materials Research Society of Korea Conference
• /
• 2003.11a
• /
• pp.172-172
• /
• 2003

It has been known that Pd-MILC shows much faster and lower temperature crystallization than Ni-MILC but it can not be put into practice due to the quality issue of thus fabricated poly crystals. In this study, addition of Pd into Ni-MILC has been attempted in order to take advantages of the Pd-MILC without sacrificing of the Ni-MILC TFTs. It turns out that when 5% of Pd has been added to Ni for MILC, MILC growth rate increases two - three times faster than pure Ni-MILC. The MILC growth rate shows monotonic increase with increase the amount of Pd in Ni up to 50%. Even when small amount of Pd was added to Ni like 5%, crystallization phenomenon already follows the way of Pd-MILC. The Poly-W thus fabricated shows lower leakage current than pure Ni-MILC TFT without losing any amount of on-current This fact is very important in low temperature poly-TFTs because MILC-TFTs, especially suffer from the relatively high leakage current

• Korean Journal of Materials Research
• /
• v.14 no.7
• /
• pp.500-504
• /
• 2004

It is well-known that adjacent Pd-MILC enhanced the rate of Ni-MILC. And the phenomena can be explained by tensile stress propagation between amorphous silicon and Pd silicide which is catalyst of crystallization. In this study, we modified tensile stress by changing geometry of amorphous silicon to prove that there is a direct relation between tensile stress and Ni-MILC rate enhancement. When the tensile stress concentrated, the Ni-MILC rate was enhanced more(14.5 ${\mu}m/hr$) by Pd-MILC while the conventional Pd-MILC enhanced Ni-MILC rate was 11 ${\mu}m/hr$. As the result we can be sure that the tensile stress causes the enhancement of Ni-MILC rate.

• Proceedings of the Materials Research Society of Korea Conference
• /
• 2003.11a
• /
• pp.201-201
• /
• 2003

It has been well known that Ni-MILC TFTs are acceptable for operation of LCD devices but still decrease of annealing temperature is desirable for the future devices like LCD on the plastic substrate. In this work, Cu was added to Ni-MILC in an attempt to lower the annealing temperature and enhance the MILC rate. It has been found that even small amount of Cu addition enhances the MlLC rate considerably. Also well One MILC can be distinguished from island type, which cannot be observed in pure Ni-MILC. Poly TFTs were fabricated with Cu/Ni-MILC and the effects of copper addition on the electrical properties were carefully investigated.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
• /
• 2005.05a
• /
• pp.173-179
• /
• 2005

본 연구에서는 Nickel-Metal Induced Lateral crystallization(Ni-MILC)에 depart에 따른 영향을 관찰함에 있어 Nickel에 Palladium Metal을 인접시켜(Pd assisted Ni-MILC) 그 결정화 속도를 향상시키는 방법을 제안하였다. a-Si에 Phosphorous가 doping 되어 있는 경우 Ni-MILC의 성장은 intrinsic에 비해 2.5배 감소되는 반면, Boron을 doping한 경우 Ni-MILC의 성장은 intrinsic의 경우보다 5배 이상의 성장을 보이게 되는데, well type의 Pd을 인접시킨 경우 Pd에 의해 유도된 tensile stress가 각 doping에 따른 성장 속도를 더욱 증대시키는 것을 확인할 수 있었으며, 이와 같은 현상을 MILC mechanism으로 설명하였다. 이는 Ni-MILC를 이용하여 다결정 실리콘 TFT 제작 시 결정화 속도로 인하여 문제가 되었던 N-type에서의 적용이 가능함과 동시에 contact MILC 등의 방법에도 이용가능성을 의미한다.

• Journal of the Institute of Electronics Engineers of Korea SD
• /
• v.37 no.4
• /
• pp.31-37
• /
• 2000

In the case of metal-induced lateral crystallization (MILC) for low temperature poly-Si TFT, offset length between Ni-thin film and the sides of gate could be modified to control the location of MILC boundary. Electrical characteristics were compared to analyze the effect of MILC boundary that was located either in or out of the channel region of the TFT. By removing the MILC boundary from channel region, on current, subthreshold slope and leakage current properties could be improved. When MILC boundary was located in the channel region, leakage current was reduced with electrical stress biasing. The amount of reduction increased as the channel width increased, but it was independent of the channel length.

• Proceedings of the KIEE Conference
• /
• 2002.07c
• /
• pp.1400-1402
• /
• 2002

금속유도 측면 결정화 (Metal Induced Lateral Crystallization; MILC)를 통하여 형성한 다결정 실리콘 박막에 엑시머 (excimer) 레이저를 조사하여 우수한 특성을 갖는 박막 트랜지스터를 제작하였다. MILC 공정 중에 형성되는 금속 유도 결정화 (Metal Induced Crystallization; MIC) 실리콘 박막은 다량의 Ni을 함유하고 있기 때문에, 이에 인접한 MILC 실리콘 박막 내에는 니켈 농도의 점진적인 차이가 발생한다. MILC 다결정 실리콘 박막 내의 Ni 농도 차이는 실리콘 박막의 용융점 차이를 유발하여 레이저 결정화 시에 매우 큰 실리콘 결정립의 성장을 유도한다. 새로운 다결정 실리콘 박막 트랜지스터는 기존의 레이저 결정화 방식으로 제작한 다결정 실리콘 박막 트랜지스터에 비하여 40% 향상된 전계효과 이동도를 나타내었다.

• Korean Journal of Materials Research
• /
• v.14 no.7
• /
• pp.477-481
• /
• 2004

High quality polycrystalline silicon is very critical part of the high quality thin film transistor(TFT) for display devices. Metal induced lateral crystallization(MILC) is one of the most successful technologies to crystallize the amorphous silicon at low temperature(below $550^{\circ}C$) and uses conventional and large glass substrate. In this study, we observed that the MILC behavior changed with abrupt variation of the amorphous silicon active pattern width. We explained these phenomena with the novel MILC mechanism model. The 10 nm thick Ni layers were deposited on the glass substrate having various amorphous silicon patterns. Then, we annealed the sample at $550^{\circ}C$ with rapid thermal annealing(RTA) apparatus and measured the crystallized length by optical microscope. When MILC progress from narrow-width-area(the width was $w_2$) to wide-width-area(the width was $w_1$), the MILC rate decreased dramatically and was not changed for several hours(incubation time). Also the incubation time increased as the ratio, $w_1/w_2$, get larger. We can explain these phenomena with the tensile stress that was caused by volume shrinkage due to the phase transformation from amorphous silicon to crystalline silicon.

• Korean Journal of Materials Research
• /
• v.28 no.8
• /
• pp.440-444
• /
• 2018

An effective cleaning method for Ni removal in Ni-induced lateral crystallization(Ni-MILC) poly-Si TFTs and their electrical properties are investigated. The HCN cleaning method is effective for removal of Ni on the crystallized Si surface, while the nitric acid treatment results decrease by almost two orders of magnitude in the Ni concentration due to effective removal of diffused Ni mainly in the poly-Si grain boundary regions. Using the HCN cleaning method after the nitric acid treatment, re-adsorbed Ni on the Si surfaces is effectively removed by the formation of Ni-cyanide complexions. After the cleaning process, important electrical properties are improved, e.g., the leakage current density from $9.43{\times}10^{-12}$ to $3.43{\times}10^{-12}$ A and the subthreshold swing values from 1.37 to 0.67 mV/dec.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2003.07a
• /
• pp.195-198
• /
• 2003

본 연구에서는 MILC 및 FALC를 도핑 타입에 따른 온도별 패턴별 인가 전압별로 진행하여 현미경 및 FESEM 관찰을 함으로써 그 메커니즘을 규명하고자 하였다. LPCVD를 이용하여 $1000\;{\AA}$ a-Si 을 glass에 입힌 후 photolithography법 또는 Hard Mask법으로 Ni $200\;{\AA}$ 을 선택적으로 증착하였으며 Pt 전극을 Sputtering법으로 제작하였다. $33\;{\sim}\;200\;V/cm$의 전기장 하에서 MILC 속도가 2배 정도 증가되는 현상이 관찰되었으며 또한 인접패턴에 의해 FALC 속도가 영향을 받는 현상이 관찰되었다. 또한 전자가 움직이는 방향으로 MILC 선단영역 전후에 Void가 발생하는 영역이 존재함을 발견하였다. FESEM 분석을 통하여 FALC 영역 및 Void 영역을 관찰한 결과 도핑 종류에 따라 결정화 양상이 다른 것이 관찰되었으며 Void 분석결과 Charged vacancy가 어닐링시 결집되어 나타나는 것으로 분석할 수 있었다.