• Journal of the Korean Society for Nondestructive Testing
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• v.23 no.4
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• pp.322-327
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• 2003

Giant magnetoresistance(GMR) NiO multilayer, which has been used to reading head of highly dense magnetic recording, was fabricated, and oxidized in an air during 80 days to study the dependence of magnetoresistance properties on residual stress in the interfaces. The magnetoresistance ratio and the exchange biasing $field(H_{ex})$ of $NiO(60nm)/Ni_{81}Fe_{19}(5nm)/Co(0.7nm)/Cu(2nm)/Co(0.7nm)/Ni_{81}Fe_{19}(7nm)$ spin valves were increased from 4.9% to 7.3%, and 110 Oe to 170 Oe after natural oxidation in the atmosphere for 80 days, respectively. The sheet resistivity ${\rho}$ decreased from $28{\mu}{\Omega}m$ to $17{\mu}{\Omega}m$, but ${\Delta}p$ did not almost change after the oxidation. Therefore, the increase of MR ratio is due to the decrease in the sheet resistivity. the reduced resistance may result from the increase in the reflection of conduction electrons at the oxidized top surface. Also, the increase in the exchange biasing field is originated from the reduction of residual stress at the interface of $NiO/Ni_{81}Fe_{19}$ according as the aging time increases.

• Korean Journal of Crystallography
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• v.12 no.2
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• pp.70-75
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• 2001

The purpose of this study is to investigate the effect of V₂O/sub 5/ addition on physical and magnetic properties of NiCuZn ferrite for multi-layer chip inductors. NiCuZn ferrite pastes doped with 0, 0.1, 0.3 and 0.5 wt% V₂O/sub 5/ were prepared and samples of ferrite sheets were prepared by the screen printing method. They were sintered at 870, 880, 890 and 900℃, and then their physical and magnetic properties were analyzed. After sintering at 870℃, the sintered density of the ferrite sheet doped with 0.5wt% V₂O/sub 5/ showed the highest value to 5.08g/cm³due to the best densification by the liquid phase sintering, while the microstructures of ferrite sheets doped with 0.1 and 0.3 wt% V₂O/sub 5/ showed and inhibited grain growth. Irrespective of the sintering temperature, the initial permeability of ferrite sheet doped with 0.5 wt% V₂O/sub 5/ was highest and after sintering beyond 880℃, the quality factor of 0.3 wt% V₂O/sub 5/-doped sample appeared to be highest.

• Journal of the Korean Ceramic Society
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• v.13 no.2
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• pp.8-16
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• 1976

The conductive transparent film is prepared by spraying thin salt solution. In stannic chloride solution as a base solution, various dopants such as Al, Co, Cu and Ni were dissolved respectively as a chloride state and then the films were made by spraying solutions on hot glass plates. The properties of them were compared with those of the stannic salt single component film. The films doped with copper oxide and nickle oxide were improved by decreasing their sheet resistivity and temperature coefficient of resistivity. In comparison with the sheet resistivity and temperature coefficient of resistivity of stannic oxide single component film, being 2.5 K ohm/$\textrm{cm}^2$ and -1650ppm/$^{\circ}C$ respectively, its values of the film containing 15 mol % of copper oxide and formed at 40$0^{\circ}C$ were 2.5K ohm/$\textrm{cm}^2$ and -920ppm/$^{\circ}C$ respectively. The film containing 15 mol % of nickel oxide and formed at 50$0^{\circ}C$ has shown its sheet resistivity and temperature coefficient 0.7 K ohm/$\textrm{cm}^2$ and -940ppm/$^{\circ}C$ respectively.

• Journal of the Microelectronics and Packaging Society
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• v.6 no.4
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• pp.1-7
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• 1999

We developed Fabrication process of embedded passive components in MCM-D substrate. The proposed MCM-D substrate is based on Cu/photosensitive BCB multilayer. The substrate used is Si wafer and Ti/cu metallization is used to form the interconnect layer. Interconnect layers are formed with 1000$\AA$ Ti/3000$\AA$ Cu by sputtering method and 3$\mu\textrm{m}$ Cu by electrical plating method. In order to form the vias in photosensitive BCB layer, the process of BCB and plasma etch using $C_2F_6$ gas were evaluated. The MCM-D substrate is composed of 5 dielectric layers and 4 interconnect layers. Embedded resistors are made with NiCr and implemented on the $2^{nd}$ dielectric layer. The sheet resistance of NiCr is controlled to be about 21 $\Omega$/sq at the thickness of 600$\AA$. The multi-turn sprial inductors are designed in coplanar fashion on the $4^{th}$ interconnect layer with an underpass from the center to outside using the lower $3^{rd}$ interconnect layer. Capacitors are designed and realized between $1^{st}$ interconnect layer and $2^{nd}$ interconnect layer. An important issue in capacitor is the accurate determination of the dielectric thickness. We use the 900$\AA$ thickness of PECVD silicon nitride film as dielectric. Capacitance per unit area is about 88nF/$\textrm {cm}^2$at the thickness of 900$\AA$. The advantage of this integration process is the compatibility with the conventional semiconductor process due to low temperature PECVD silicon nitride process and thermal evaporation NiCr process.

• Journal of Advanced Marine Engineering and Technology
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• v.26 no.1
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• pp.99-107
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• 2002

Recently all kinds of structural materials are subjected to the severe corrosive environment. Especially corrosion problems of heat exchanger such as galvanic corrosion, erosion and cavitation raised by both contaminated solution and high velocity of fluid to increase cooling effect of heat exchanger have been frequently reported in these days. In this study two kinds of sheet materials and five kinds of tube materials are used for galvanic corrosion characteristics and their corrosion current density calculation. The tube materials having the most galvanic corrosion resistance between tube and sheet of heat exchanger were Al Brass(68700) and Al Brass(C6872TS) and although Ti tube predominantly indicated the highest individual corrosion resistance among those five tube materials. it appeared that Ti tube can be allowed as sheet materials to get galvanic corrosion easily. However it is considered that Cu-Ni tube materials is not only easy to produce galvanic corrosion significantly between tube and sheet regardless of kinds of sheet materials but also is appeared considerably its own high corrosion current density

• Journal of the Korean Ceramic Society
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• v.28 no.9
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• pp.675-682
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• 1991

Among many problems that need to be solved in the process of preparing multilayer chip LC filters, we studied the control of shrinkage in order to prevent the crack, warpage, and/or delamination which occurs at the interface between the inductance (L part) and the capacitance (C part). Shrinkage was controlled by compositions, powder size, calcining temperature and amount of organic binder. Capacitance sheet was prepared by mixing 65 wt% binder with the composition of 96 wt% TiO2 having an average particle size of 0.5 $\mu\textrm{m}$, 3 wt% CuO. After small amount of MnO2 and SiO2 added, it was calcined at 750$^{\circ}C$ for 2 hr. Inductance sheet was prepared by mixing 60 wt% binder with the composition of 49.5% mol% Fe2O3, 20.5 mol% ZnO, 20 mol% NiO and 10 mol% CuO which was calcined at 775$^{\circ}C$ for 2 hr. These sheets was laminated at 250 kg/$\textrm{cm}^2$, and cofired at 900$^{\circ}C$ for 2 hr to give rise to a multilayer chip LC filter without any warpage.

• Journal of the Korean Magnetics Society
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• v.11 no.3
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• pp.104-108
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• 2001

The effect of specular electron scattering on natural oxidation of free layer in NiO spin valves have been investigated. The magnetoresistance (MR) ratio and the exchange biasing field ( $H_{ex}$) of NiO(600 $\AA$)Ni$_{81}$$Fe_{19}$(50$\AA$)/Co(7 $\AA$)/Cu(20 $\AA$)/Co(7 $\AA$)Ni$_{81}$$Fe_{19}$(70 $\AA$) spin valves were increased from 4.9 % to 7.3 %, and 110 Oe to 170 Oe after natural oxidation in the atmosphere for 80 days, respectively. The sheet resistivity p decreased from 28$\mu$$\Omega$m to 17$\mu$$\Omega$m, but $\Delta$$\rho$ did not almost change after the oxidation. The spin valves enhanced by the specular electron scattering in the natural]y Co/NiFe/NiFe $O_{x}$ free layer were confirmed from the depth profiles using Auger electron spectroscopy.scopy..

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.490-490
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• 2011

Graphene, hexagonal network of carbon atoms forming a one-atom thick planar sheet, has been emerged as a fascinating material for future nanoelectronics. Huge attention has been captured by its extraordinary electronic properties, such as bipolar conductance, half integer quantum Hall effect at room temperature, ballistic transport over ${\sim}0.4{\mu}m$ length and extremely high carrier mobility at room temperature. Several approaches have been developed to produce graphene, such as micromechanical cleavage of highly ordered pyrolytic graphite using adhesive tape, chemical reduction of exfoliated graphite oxide, epitaxial growth of graphene on SiC and single crystalline metal substrate, and chemical vapor deposition (CVD) synthesis. In particular, direct synthesis of graphene using metal catalytic substrate in CVD process provides a new way to large-scale production of graphene film for realization of graphene-based electronics. In this method, metal catalytic substrates including Ni and Cu have been used for CVD synthesis of graphene. There are two proposed mechanism of graphene synthesis: carbon diffusion and precipitation for graphene synthesized on Ni, and surface adsorption for graphene synthesized on Cu, namely, self-limiting growth mechanism, which can be divided by difference of carbon solubility of the metals. Here we present that large area, uniform, and layer controllable graphene synthesized on Cu catalytic substrate is achieved by acetylene-assisted CVD. The number of graphene layer can be simply controlled by adjusting acetylene injection time, verified by Raman spectroscopy. Structural features and full details of mechanism for the growth of layer controllable graphene on Cu were systematically explored by transmission electron microscopy, atomic force microscopy, and secondary ion mass spectroscopy.

• Korean Journal of Materials Research
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• v.29 no.4
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• pp.228-232
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• 2019

Copper electroplating and electrode patterning using a screen printer are applied instead of lithography for heterostructure with intrinsic thin layer(HIT) silicon solar cells. Samples are patterned on an indium tin oxide(ITO) layer using polymer resist printing. After polymer resist patterning, a Ni seed layer is deposited by sputtering. A Cu electrode is electroplated in a Cu bath consisting of $Cu_2SO_4$ and $H_2SO_4$ at a current density of $10mA/cm^2$. Copper electroplating electrodes using a screen printer are successfully implemented to a line width of about $80{\mu}m$. The contact resistance of the copper electrode is $0.89m{\Omega}{\cdot}cm^2$, measured using the transmission line method(TLM), and the sheet resistance of the copper electrode and ITO are $1{\Omega}/{\square}$ and $40{\Omega}/{\square}$, respectively. In this paper, a screen printer is used to form a solar cell electrode pattern, and a copper electrode is formed by electroplating instead of using a silver electrode to fabricate an efficient solar cell electrode at low cost.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.293.1-293.1
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• 2016

Various materials including conductive, dielectric, and semi-conductive materials, constitute suitable candidates for printed electronics. Metal nanoparticles (e.g. Ag, Cu, Ni, Au) are typically used in conductive ink. However, easily oxidized metals, such as Cu, must be processed at low temperatures and as such, photonic sintering has gained significant attention as a new low-temperature processing method. This method is based on the principle of selective heating of a strongly absorbent film, without light-source-induced damage to the transparent substrate. However, Cu nanoparticles used in inks are susceptible to the growth of a native copper-oxide layer on their surface. Copper-oxide-nanoparticle ink subjected to a reduction mechanism has therefore been introduced in an attempt to achieve long-term stability and reliability. In this work, a flash-light sintering process was used for the reduction of an inkjet-printed Cu(II)O thin film to a Cu film. Using a photographic lighting instrument, the intensity of the light (or intense pulse light) was controlled by the charged power (Ws). The resulting changes in the structure, as well as the optical and electrical properties of the light-irradiated Cu(II)O films, were investigated. A Cu thin film was obtained from Cu(II)O via photo-thermal reduction at 2500 Ws. More importantly, at one shot of 3000 Ws, a low sheet resistance value ($0.2527{\Omega}/sq.$) and a high resistivity (${\sim}5.05-6.32{\times}10^{-8}{\Omega}m$), which was ~3.0-3.8 times that of bulk Cu was achieved for the ~200-250-nm-thick film.