• Journal of the Korean Chemical Society
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• v.53 no.3
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• pp.233-243
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• 2009

We have investigated the infrared spectra for CO adsorbed on silica supported nickel(Ni-Si$O_2$), silica supported copper(Cu-Si$O_2$), silica supported nickel-copper alloys(Ni/Cu-Si$O_2$) of several compositions with varying CO pressures(0.2 $torr{\sim}$50 torr) at room temperature and on pumping to vacumn at room temperature within the frequency range of 1500 $cm^{-1}{\sim}2500\;cm^{-1}$. Four bands(2059.6 $cm^{-1},\;{\sim}$2036.5 $cm^{-1},\;{\sim}$ 1868.7 $cm^{-1},\;{\sim}$ 1697.1 $cm^{-1}$) were observed for Ni-Si$O_2$, two bands($\sim$2115.5 $cm^{-1},\;{\sim}$1743.0 $cm^{-1}$) were observed for Cu-Si$O_2$ and five bands(${\sim}2123.2\;cm^{-1}$, 2059.6 $cm^{-1},\;{\sim}$2036.4 $cm^{-1},\;{\sim}$1899.5 $cm^{-1},\;{\sim}$1697.1 $cm^{-1}$) were observed for Ni/Cu-Si$O_2$. These absorption bands correspond with those of the previous reports approximately. The bands below 1800 $cm^{-1}$ were only observed with Ni metal or Ni/Cu alloy crystal plane containing step at room temperature and the ${\sim}1697.1\;cm^{-1}$ bands observed with Ni-Si$O_2$ and Ni/Cu-Si$O_2$ may be ascribed to CO molecule adsorbed on the adsorption sites near step. The bands below 2000 $cm^{-1}$ were rarely observed with Cu metal crystal plane at room temperature and the 1743.0 $cm^{-1}$ bands may be ascribed to CO molecule adsorbed on the adsorption sites near step. The band shifts of adsorbed CO with varing Cu contents from 0 to 0.5 mole fraction at the same CO pressure or at the same pumping time to vacumn were below 21 $cm^{-1}$. and comparatively small than those with other ⅠB metal addition. It may means ligand effect of Cu d electron is small.

• Journal of the Korean institute of surface engineering
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• v.39 no.6
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• pp.276-281
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• 2006

In order to improve the performance of PPFs (Pre-Plated Frames), a PPF that employed a Cu-Sn alloy instead of conventionally used Ni was developed and then its properties were investigated. It was found that the electoplated Cu-Sn alloy layer was a mixture of uniformly distributed fine crystallites, resulting In better wettability and crack resistance than those of Ni PPF. Moreover, as in Cu/Ni/Pd/Au PPF, migration of copper atoms from the base metal to the top of the Cu/Cu-Sn/Pd/Au PPF surface was not found although the Cu-Sn layer itself contained considerable amount of copper. It was expected that, by using the newly developed Cu-Sn PPF, any possible heat generation and signal interrupt caused by an external electro-magnetic field could be reduced because the Cu-Sn layer was paramagnetic, i.e., nonmagnetic.

• Metals and materials international
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• v.24 no.6
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• pp.1285-1292
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• 2018

Microstructural properties of as-grown and annealed CoCrFeMnNi high entropy alloy (HEA) oxynitride thin films were investigated. The CoCrFeMnNi HEA oxynitride thin film was grown by magnetron sputtering method using an air gas, and annealed under the argon plus air flow for 5 h at $800^{\circ}C$. The as-grown film was homogeneous and uniform composed of nanometer-sized crystalline regions mixed with amorphous-like phase. The crystalline phase in the as-grown film was face centered cubic structure with the lattice constant of 0.4242 nm. Significant microstructural changes were observed after the annealing process. First, it was fully recrystallized and grain growth happened. Second, Ni-rich region was observed in nanometer-scale range. Third, phase change happened and it was determined to be $Fe_3O_4$ spinel structure with the lattice constant of 0.8326 nm. Hardness and Young's modulus of the as-grown film were 4.1 and 150.5 GPa, while those were 9.4 and 156.4 GPa for the annealed film, respectively.

• Korean Journal of Materials Research
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• v.14 no.12
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• pp.846-850
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• 2004

NiCo silicide films have been fabricated from $300{\AA}-thick\;Ni_{1-x}Co_{x}(x=0.1\sim0.9)$ on Si-substrates by varying RTA(rapid thermal annealing) temperatures from $700^{\circ}C\;to\;1100^{\circ}C$ for 40 sec. Sheet resistance, cross-sectional microstructure, and chemical composition evolution were measured by a four point probe, a transmission electron microscope(TEM), and an Auger depth profilemeter, respectively. For silicides of the all composition and temperatures except for $80\%$ of the Ni composition, we observed small sheet resistance of sub- $7\;{\Omega}/sq.,$ which was stable even at $1100^{\circ}C$. We report that our newly proposed NiCo silicides may obtain sub 50 nm-thick films by tunning the nickel composition and silicidation temperature. New NiCo silicides from NiCo-alloys may be more appropriate for sub-0.1${\mu}m$ CMOS process, compared to conventional single phase or stacked composit silicides.

• Journal of dental hygiene science
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• v.4 no.3
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• pp.103-109
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• 2004

The present study prepared 72 test samples - 24 made of amalgam alloy, 24 of Verabond (Ni-Cr alloy) for crown and 24 of Talladium $^{TM}alloy$ for denture - according to the manufacturers' manuals and general method in consideration of the width of the mesial-distal dental crown of the lower $1^{st}$ molar and MOD cavity in clinics, put them in a 200 ml beaker containing 80 ml of artificial saliva, and measured their galvanic corrosion at distances of 0 mm, 7 mm and 40 mm after 7 days. Isolated metals in the electrolyte such as Cu, Ag, Ni, Cr, Sn, Zn and Hg were quantitatively analyzed with Inductively Coupled Plasma - Atomic Emission Spectrometer (ICP-AES, JY-50P, VG Elemental Co. France), and from the results were drawn conclusions as follows. First, Cu, Sn, Ag, Hg and Zn were highly advantageous when amalgam contacted gold alloy compared to Ni-Cr alloy for crown and Talladium alloy for denture. In addition, although gold alloy was finest in terms of oral tissue and biocompatibility, it was most disadvantageous when it was with amalgam. Second, when amalgam contacted gold alloy, heavy metals such as Ni and Cr were not isolated at all because gold alloy did not contain such elements but Sn was isolated as much as $227.1{\pm}18.0035{\mu}g/cm^2$ although it was not included in the composition either. Hg was also isolated. These elements are assumed to have been isolated from amalgam itself. Third, when amalgam alloy was apart from gold alloy 0 mm, 7 mm and 40 mm, Cu and Ag showed significance but Hg did not. This suggests that gold alloy must not be used together with amalgam, and must not be used between dissimilar prostheses regardless of distance. Fourth, when amalgam alloy contacted Ni-Cr alloy for crown, Ag was not isolated from the amalgam, but Zn, Ni, Sn, Hg and Cu were isolated in order of quantity. Significance was observed according to distance - 0 mm, 7 mm and 40 mm. Hg was not isolated but heavy metals Ni and Cr were isolated. If amalgam alloy was in the opposite arch or it was apart from Ni-Cr alloy for crown, the isolation Hg was less than that when amalgam alloy contacted Ni-Cr alloy for crown. Fifth, when amalgam alloy contacted Talladium alloy for denture, significance was observed at distances of 0mm, 7 mm and 40 mm. Hg was not isolated but heavy metals Ni and Cr were isolated. If amalgam alloy was in the opposite arch or it was apart from Talladium alloy for denture, the isolation Hg was less than that when amalgam alloy contacted Talladium alloy for denture. Sixth, according to the result of ICPES test on Cu, Sn, Ag, Hg, Zn, Ni and Cr of amalgam alloy, gold ally, Verabond and Talladium alloy when these alloys contacted artificial saliva, significance was observed in Cu and Hg. Seventh, when amalgam alloy contracted two non-precious metals Ni-Cr alloy for crown and Talladium alloy for denture in artificial saliva, significance was observed in the isolated by-products of Hg, Ni and Cr according to distance.

• Journal of the Korean Society for Heat Treatment
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• v.36 no.3
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• pp.128-136
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• 2023

In this study, the effects of heat treatment on the nano-scale creep behavior of CoCrFeMnNi high-entropy alloy (HEA) processed by high-pressure torsion (HPT) was investigated through nanoindentation technique. Nanoindentation experiments with a Berkovich indenter were performed on HPT-processed alloy subjected to heat treatment at 450℃, revealing that the hardness of the HPT-processed alloy (HPT sample) significantly increased with the heat treatment time. The heat treatment-induced microstructural change in HPT-processed alloy was analyzed using transmission electron microscopy, which showed the nano-sized Cr-, NiMn-, and FeCo-rich phases were formed in the HPT-processed alloy subjected to 10 hours of heat treatment (HPT+10A sample). To compare the creep behavior of HPT and HPT+10A samples, constant load nanoindentation creep experiments were performed using spherical indentation indenters with two different radii. It was revealed that the predominant mechanism for creep highly depended on the applied stress level. At low stress level, both HPT and HPT+10A samples were dominated by Coble creep. At high stress level, however, the mechanism transformed to dislocation creep for HPT sample, but continued to be Coble creep for HPT+10A sample, leading to higher creep resistance in the HPT+10A sample.

• Journal of Information Display
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• v.5 no.4
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• pp.27-30
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• 2004

This paper investigates the effects of coating such as Invar (Fe-36% Ni), Fe-Ni Alloys and $WO_3$ on the doming property of aluminum killed (AK) shadow masks, which may be used for flat CPTs. Invar and Fe-Ni Alloys are deposited on AK shadow mask in plasma atmosphere and annealed. $WO_3$ is screen-printed on the deposited layer. The coating is observed to cause a decrease in the doming property of the shadow masks due to their lower thermal expansion coefficients and anti-doming properties.

• Korean Journal of Materials Research
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• v.25 no.11
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• pp.642-646
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• 2015

Super alloys, which can be divided into three categories, i.e. Ni-base, Co-base, and Fe-base alloys, are widely used for high temperature applications. Since superalloys contain many alloying elements and precipitates, their chemistry and processing parameters need to be carefully designed. In this study, we designed a new Ni alloy to prevent corrosion due to water vapor and gases at high temperatures. The new alloy was designed using the theoretical value of the resulting energy electronic state calculation($DV-X{\alpha}$ method). The components that were finally used were Cr, Mo, and Ti, with Ni as a base. For these alloys, elements were selected in order to compare their values with that of the average theoretical basis for an Inconel 625 alloy. Finally, two kinds of Ni alloy were designed: Ni-28Cr-4Mo-2Ti and Ni-20Cr-10Mo-1Ti.

• Proceedings of the KIEE Conference
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• 2001.07c
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• pp.1346-1348
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• 2001

Generally, Invar alloy shows very low thermal expansion characteristics, lower than $2{\times}10^{-6}$/K approximately. To apply Fe-Ni-Co-C Invar alloy as a core material for large ampacity transmission line we studied the effects of magnetic properties on coefficient of thermal expansion. The coefficient of thermal expansion(CTE) suddenly decreases with addition of a little carbon(0.08%), increases with the increasing carbon and has a constant value at the composition over than 1.0%C. The trend of Curie temperature change with carbon is similar with that of CTE. Therefore, the CTE has a linear relationship with Curie temperature. However, the CTE linearly decreases with the ratio of saturation magnetization and Curie temperature(${\sigma}_s/T_c$).

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09b
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• pp.1130-1131
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• 2006

We found that the """interface reaction between Ni-based alloy bond, diamond, and steel core is very critical in bond strength of diamond tool. None element from metal bond diffuses into the steel core but the Fe element of steel core was easily diffused into the bond. This diffusion depth of Fe has a great effect on the bonding strength. The Cr in steel core accelerated the Fe diffusion and improved the bond strength, on the other hand, carbon decreased the strength. Ni-based alloy bond including Cr was chemically bonded with diamond by forming Cr carbide. However, the Cr and Fe in STS304 were largely interdiffused, the strength was very low. The Cr passivity layer formed at surface of STS304 made worse strength at commissure in brazing process.